216-BALL LPDDR Search Results

Contextual Info: PRELIMINARY DATA SHEET 4G bits DDR2 Mobile RAM PoP 12mm x 12mm, 216-ball FBGA EDB4432BAPC Specifications Features • Density: 4G bits • Organization — 16M words × 32 bits × 8 banks • Data rate: 1066Mbps (max.) • Package: 216-ball FBGA — Package size: 12.0mm × 12.0mm

Contextual Info: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 15.0mm  15.0mm, 216-ball FBGA EDFA164A1PK Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words  32 bits  8 banks) in one package — Independent 2-channel bus • Package

Contextual Info: COVER DATA SHEET 16Gb DDR3 Mobile RAMTM PoP 15.0mm  15.0mm, 216-ball FBGA EDFA164A1PB Specifications Features • Density: 16Gb • Organization — 4 pieces of 4Gb (16M words  32 bits  8 banks) in one package — Independent 2-channel bus • Package

Contextual Info: DATA SHEET 4G bits DDR2 Mobile RAM PoP 12mm x 12mm, 216-ball FBGA EDB4064B3PB Specifications Features • Density: 4G bits • Organization — 2 pieces of 2Gb (8M words × 32 bits × 8 banks) in one package — Independent 2-channel bus • Data rate: 1066Mbps (max.)

Contextual Info: DATA SHEET 8G bits DDR2 Mobile RAM PoP 12mm x 12mm, 216-ball FBGA EDB8164B3PF Specifications Features • Density: 8G bits • Organization — 2 pieces of 4Gb (16M words × 32 bits × 8 banks) in one package — Independent 2-channel bus • Data rate: 1066Mbps (max.)

Contextual Info: DATA SHEET 8G bits DDR2 Mobile RAM PoP 12mm x 12mm, 216-ball FBGA EDB8132B3PD Specifications Features • Density: 8G bits • Organization — 16M words × 32 bits × 8 banks × 2 ranks — 2 pieces of 4Gb (× 32) in one package • Data rate: 1066Mbps (max.)

Contextual Info: DATA SHEET 16G bits DDR2 Mobile RAM PoP 12mm x 12mm, 216-ball FBGA EDBA164B1PB Specifications Features • Density: 16G bits • Organization — 4 pieces of 4Gb (16M words × 32 bits × 8 banks) in one package — Independent 2-channel bus • Data rate: 1066Mbps (max.)

MT42L256M32D2

Abstract: LPDDR2 SDRAM micron MT42L128M32D1 PS 229 ADQ-22 micron lpddr2 MT42L256M32D marking wl4 SMD MARKING code 4N Dual LPDDR2
Contextual Info: 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1, MT42L256M32D2, MT42L128M64D2, MT42L512M32D4, MT42L192M64D3, MT42L256M64D4 Features Options • Ultra low-voltage core and I/O power supplies – VDD2 = 1.14–1.30V

SMD MARKING CODE sdp

Contextual Info: 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1, MT42L256M32D2, MT42L128M64D2, MT42L512M32D4, MT42L192M64D3, MT42L256M64D4, MT42L384M32D3 Features Options • Ultra low-voltage core and I/O power supplies – VDD2 = 1.14–1.30V

LPDDR2 SDRAM micron

Abstract: lpddr2 MT42L256M32D2 LPDDR2 SDRAM micron lpddr2 MT42L128M32D1 micron LPDDR2 X32 35MR11 lpddr2 DQ calibration 216-ball LPDDR
Contextual Info: 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1, MT42L256M32D2, MT42L128M64D2, MT42L512M32D4, MT42L192M64D3, MT42L256M64D4 Features Options • Ultra low-voltage core and I/O power supplies – VDD2 = 1.14–1.30V

M1012

Contextual Info: 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1, MT42L256M32D2, MT42L128M64D2, MT42L512M32D4, MT42L192M64D3, MT42L256M64D4 Features Options • VDD2: 1.2V • Configuration – 32 Meg x 16 x 8 banks x 1 die – 16 Meg x 32 x 8 banks x 1 die

Contextual Info: Preliminary‡ 4Gb: x16, x32 Automotive Mobile LPDDR2 SDRAM Features Automotive Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1, MT42L256M32D2, MT42L128M64D2, MT42L512M32D4, MT42L192M64D3, MT42L256M64D4 Features Options • VDD2: 1.2V • Configuration – 32 Meg x 16 x 8 banks x 1 die

Contextual Info: 4Gb: x16, x32 Automotive Mobile LPDDR2 SDRAM Features Automotive Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1, MT42L256M32D2, MT42L128M64D2, MT42L512M32D4, MT42L192M64D3, MT42L256M64D4 Features Options • VDD2: 1.2V • Configuration – 32 Meg x 16 x 8 banks x 1 die

MT42L256M32D2

Abstract: MT42L128M32D1 lpddr2 DQ calibration MT42L256M16D1 LPDDR2 SDRAM MT42L128M64D2 MT42L256M64D4 mt42L256m16 LPDDR2 SDRAM micron LPDDR2
Contextual Info: 4Gb: x16, x32 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L256M16D1, MT42L128M32D1, MT42L256M32D2, MT42L128M64D2, MT42L512M32D4, MT42L192M64D3, MT42L256M64D4 Features Options • VDD2: 1.2V • Configuration – 32 Meg x 16 x 8 banks x 1 die – 16 Meg x 32 x 8 banks x 1 die

GPIO191

Contextual Info: OMAP3515/03 Applications Processor www.ti.com SPRS505 – FEBRUARY 2008 1 OMAP3515/03 Applications Processor • • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • 600-MHz ARM Cortex™-A8 Core • NEON™ SIMD Coprocessor

MPC5675K

Abstract: MPC5675 e200z7d fine BGA thermal profile MPC5674* memory
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5675K Rev. 3, 8/2010 MPC5675K MPC5675K Microcontroller Data Sheet Overview This document provides electrical specifications, pin assignments, and package diagrams for the MPC5675K series

473-MAPBGA

Abstract: PXS30 B2M1-5 HVD12 LVD12 MPC5561 MPC5604P MPXS3010VMM150 e200z7 e200z7d
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: PXS30 Rev. 1, 09/2011 PXS30 PXS30 Microcontroller Data Sheet The PXS30 family represents a new generation of 32-bit microcontrollers based on the Power Architecture . These devices provide a

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: PXS30 Rev. 1, 09/2011 PXS30 PXS30 Microcontroller Data Sheet The PXS30 family represents a new generation of 32-bit microcontrollers based on the Power Architecture . These devices provide a

B2M1-5

Abstract: MPC5675K MPC5674 e200z7d 473-pin MPC5673 mpc5675 mobile ddr2 BLDC Driver MPC5674* memory
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5675K Rev. 4, 04/2011 MPC5675K MPC5675K Microcontroller Data Sheet 1 Overview This document provides electrical specifications, pin assignments, and package diagrams for the MPC5675K series of microcontroller units

MT29C4G48MAZBBAKQ-48 IT

Abstract: MT29C8G96MAZBBDJV-48 IT MT29C4G96MAZBBCJG-48 mt29c4g96
Contextual Info: Micron Confidential and Proprietary 168-Ball NAND Flash with LPDDR PoP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package PoP Combination Memory (TI OMAP ) MT29C4G48MAZBBAKQ-48 IT: 4Gb x16 (NAND) with 2Gb x32 (LPDDR) MT29C4G96MAZBBCJG-48 IT: 4Gb x16 (NAND) with 4Gb x32 (LPDDR)

samsung ddr3 ram MTBF

Abstract: KLM2G1HE3F-B001 KLM4G1FE3B-B001 KLMAG2GE4A-A001 k4B2G1646 KLMAG KLM8G2FE3B-B001 K4B2G0446 klm8g k4x2g323pd
Contextual Info: PRODUCT SELECTION GUIDE LCD, Memory and Storage | 1H 2012 + Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks

SGX530

Abstract: GPMC OMAP35xx ETM11 n515 omap3530 TRM TrustZone OMAP3525 OMAP3530 TI GPIO106
Contextual Info: OMAP3530/25 Applications Processor www.ti.com SPRS507 – FEBRUARY 2008 1 OMAP3530/25 Applications Processor 1.1 Features • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • 600-MHz ARM Cortex™-A8 Core • NEON™ SIMD Coprocessor

OMAP3525

Abstract: OMAP3530 SGX530 OMAP35xx Cortex-A8 Errata cache C64X CPU BW 6122 GPMC OMAP NAND
Contextual Info: OMAP3530/25 Applications Processor www.ti.com SPRS507 – FEBRUARY 2008 1 OMAP3530/25 Applications Processor 1.1 Features • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • 600-MHz ARM Cortex™-A8 Core • NEON™ SIMD Coprocessor

MIPI dbi

Abstract: TI Sitara ARM MPU PowerVR sgx 545 NCS24 matrix tv m21 service mode manual AM37X 37X CUS CBC 557 B
Contextual Info: AM3715/03 www.ti.com SPRS616B – JUNE 2010 – REVISED JULY 2010 AM3715/03 Applications Processor 1 AM3715/03 Applications Processor 1.1 Features • AM3715/03 Applications Processor: – Compatible with OMAP 3 Architecture – MPU Subsystem • 1-GHz ARM CortexTM-A8 Core