21445 Search Results

AM29F040B

Abstract: am29f040 amd am29f040b datasheet amd am29f040b am29f040b die DSASL0064931 Publication# 19957 Am29F040 98401
Contextual Info: SUPPLEMENT Am29F040B Data Sheet Supplement for PROM Programmer Manufacturers This supplement is for use with the Am29F040B data sheet, publication number 21445, and describes the sector protection and sector unprotection functions intended for programming equipment.

VSMB2020X01

Abstract: VEMD2000X01 VSMY2850 VSMB2000 VEMD20 980050
Contextual Info: VSMB2000X01, VSMB2020X01 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, DH VSMB2000X01 FEATURES VSMB2020X01 • Package type: surface mount • Package form: GW, RGW • Dimensions L x W x H in mm : 2.3 x 2.3 x 2.8

94v0 circuit board

Abstract: UL 94v-0 board ul 1458 070-003 94v-0 board 94v0 2126
Contextual Info: Data downloaded from http://www.anglia.com - the website of Anglia - tel: 01945 474747 Catalogue 1654741 MTA-50 IDC Connectors and Headers Revised 1-04 Through-Hole Header Assemblies Vertical Note: To determine header overall length dim. A , multiply .050

144534-2

Contextual Info: Data downloaded from http://www.anglia.com - the website of Anglia - tel: 01945 474747 Catalogue 1654741 MTA-50 IDC Connectors and Headers Revised 1-04 Receptacle Assemblies — Discrete Wire Feed-Thru and Closed End Connectors ± .004 A [± 0.10] See Note 1

diode

Abstract: DS2141 TR54016 ads 96r
Contextual Info: DS2141 FULL DATA SHEET AVAILABLE - CALL - 214-450-3836 DALL AS S E M I C O N D U C T O R CORP S b l M l B O DDQ5fc.7b 5 • DAL SGE D DALLAS SEMICONDUCTOR DS2141 T1 Controller PIN ASSIGNMENT FEATURES • DS1 transceiver • Parallel Control Port • Frames to D4, ESF, and SLC-96n formats

am29f040b

Contextual Info: AMD3 Am29F040B 4 Megabit 512 K x 8-Bit CMOS 5.0 Volt-only, Uniform Sector Flash Memory Distinctive Characteristics • 5.0 V ± 10% for read and write operations ■ — Minimizes system level power requirements ■ Manufactured on 0.32 pm process technology

Contextual Info: THIS £L DRAWING IS UNPUBLISHED. BY C O P Y R I G H T 20 RELEASED TYCO ELECTRONICS CORPORATION. ALL FOR 20 PUBLICATION R 1G H T S LOC RESERVED. DIST REVI S IONS FT LTR DI HOUSI NG, OTY: I MATERIAL: THERMOPLASTIC, \ MAY BE COLOR-SEE DESCRIPTION DATE DWN REVISED

VSLB3940

Contextual Info: VSLB3940 Vishay Semiconductors High Speed Infrared Emitting Diode, 940 nm, GaAlAs, MQW FEATURES • Package type: leaded • Package form: T-1, clear epoxy • Dimensions: Ø 3 mm • Peak wavelength: λp = 940 nm • High speed • High radiant power • High radiant intensity

Contextual Info: VSLB9530S www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diode, 940 nm, GaAlAs, MQW FEATURES • Package type: leaded • Package form: TELUX • Dimensions L x W x H in mm : 7.62 x 7.62 x 4.6 • Peak wavelength: p = 940 nm • High reliability

Contextual Info: VSMB10940X01 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diode, 940 nm, GaAlAs, MQW FEATURES • • • • • • • • • • • • • • • DESCRIPTION VSMB10940X01 is an infrared, 940 nm side looking emitting diode in GaAlAs multi quantum well MQW technology with

Contextual Info: VSMB3940X01 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diode, 940 nm, GaAlAs Double Hetero FEATURES • Package type: surface mount • Package form: PLCC-2 • Dimensions L x W x H in mm : 3.5 x 2.8 x 1.75 • Peak wavelength: λp = 940 nm

Contextual Info: VSMB3940X01 Vishay Semiconductors High Speed Infrared Emitting Diode, 940 nm, GaAlAs Double Hetero FEATURES • Package type: surface mount • Package form: PLCC-2 • Dimensions L x W x H in mm : 3.5 x 2.8 x 1.75 • Peak wavelength: λp = 940 nm • High reliability

4558

Contextual Info: INSULATION DISPLACEMENT CONNECTION INSULATION DISPLACEMENT CONNECTION IDC2 IDC2 IDC2 IDC2 IDC2 IDC2 PRODUCT INFORMATION IDC2 IDC2 IDC-TECHNOLOGY IDC is the abbreviation for Insulation Displacement Connection otherwise known as cut and clamp technology . Innovative,

Contextual Info: DS1360 FULL DATA SH E E T AVAILABLE - CA LL 214-450-3836 DAL LAS S E MI CONDUCTOR CORP S DE D Bbmi30 DALLAS SEMICONDUCTOR 0005700 MDAL DS1360 Phantom DAA Chip 7~~ S 'Ì - o FEATURES PIN ASSIGNMENT • Single-chip D M controller for: -M odem s - Speech interfaces

AM29F040B

Contextual Info: PRELIMINARY A M D ii Am29F040B 4 Megabit 512 K x 8-Bit CMOS 5.0 Volt-only, Uniform Sector Flash Memory Distinctive Characteristics • 5.0 V ± 10% for read and write operations ■ — Minimizes system level power requirements ■ Manufactured on 0.35 pm process technology

ul 94v-0 lcd display

Abstract: 94v-0 lcd Split System Air Conditioner washing machine motor 567067-1 connector cross reference 478 SOCKET PIN LAYOUT torque settings for metric cap head screws AMP 140 pin connector crimping positioners cross reference
Contextual Info: Catalog 82181 Revised 2-07 tycoelectronics.com 82181–7.5M–LUG–FP–2-07–2–0G3B Soft Shell Pin and Socket Connectors Tyco Electronics Corporation Harrisburg, PA AMP Soft Shell Pin and Socket Connectors Soft Shell Pin and Socket Connectors Restriction on the use of

M29X1

Contextual Info: M10x0,75 Germany hex 32 SW 32 Mechanical characteristics Electrical characteristics impedance frequency Mechanische Eigenschaften Steckgesicht nach . Innenleiter Außenleiter Steckzyklen Kupplungsdrehmoment Bauteile Innenkontakt Außenkontakt sonstige Metallteile

am29f040b

Abstract: Publication# 19957 Am29F040
Contextual Info: PRELIMINARY Am29F040B 4 Megabit 512 K x 8-Bit CMOS 5.0 Volt-only, Sector Erase Flash Memory DISTINCTIVE CHARACTERISTICS • 5.0 V ± 10% for read and write operations — Minimizes system level power requirements ■ Manufactured on 0.35µm process technology

IRDH275

Abstract: TBP103005 IRDH575
Contextual Info: TM The Power in Electrical Safety North American Product Catalog, 2013 Edition 1 BENDER Group North American Product Catalog 2013 Edition 1 USA: Bender Inc. 700 Fox Chase Coatesville, PA 19320 Tel. 800.356.4266 / 610.383.9200 Fax 610.383.7100 E mail: info@bender.org

Omron TL-X proximity

Contextual Info: C500-IDS01-V1/IDS02 ID Sensor Revised May 1990 Written and Produced for OMRON by: Brent Winchester Koji Suzuta DATEC Inc.
 Notice: OMRON products are manufactured for use according to proper procedures by a qualified operator and only for the purposes described in this manual.

Contextual Info: MTA, CST-100 II, SL-156 and AMP Economy Power EP Connectors MTA-50 IDC Connectors and Headers (Continued) Feed-Thru and Closed End Connectors Receptacle Assemblies — Discrete Wire ± .004 [± 0.10] (See Note 1) MTA-50 .050 [1.27] A .315 ± .006 [8.00 ± 0.15]

Contextual Info: Soft Shell Pin and Socket Connectors AMP PageHead_12_HelvCdBd Micro MATE-N-LOK 3 mm Continued Connector System (Continued) .236 [6.00] Dia. (Continued) .118 [3.00] Ref. .051 [1.30] Circuit 1 Single Row, Surface Mount, with Surface Mount Hold-down Housing — High Temperature Nylon,

ul 1458

Contextual Info: MTA, CST-100 II, SL-156 and AMP Economy Power EP Connectors MTA-50 IDC Connectors and Headers (Continued) MTA-50 .050 [1.27] Surface Mount Header Assemblies Note: To determine header overall length (dim. A), multiply .050 x the number of circuits and add .150. Example: .050 x 6

CQX 86

Abstract: U832 write-verify RaR8 81 u218 A09T
Contextual Info: DM512K64DTE/DM512K72DTE Multibank Burst EDO EDRAM 512Kb x 64/512Kb x 72 Enhanced DRAM DIMM Enhanced Memory Systems Inc. Product Specification Features 8Kbytes SRAM Cache Memory for 12ns Random Reads Within Four Active Pages Multibank Cache • Fast 4Mbyte DRAM Array for 30ns Access to Any New Page