208 BGA Search Results

Contextual Info: Product Number: 599-10-208-08-001429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel 208-08-001 16 X 16 # Of Pins Mill-Max Part Number 208 599-10-208-08-001429 RoHS Compliant LOOSE PIN:

Contextual Info: Product Number: 599-10-208-08-001429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 208-08-001 16 X 16 # Of Pins Mill-Max Part Number 208 599-10-208-08-001429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929

LQFP 208

Abstract: ZL3806 LQFP208 LBGA-100
Contextual Info: Voice Echo Cancellation VOICE PROCESSING VOICE/DATA 8 4 64(128) 0.056 100 pin LQFP, 208 ball LBGA ZL50235 16(8) 64(128) 0.088 100 pin LQFP, 208 ball LBGA MT9300B 32(16) 64(128) 1 160 pin MQFP, 208 ball LBGA MT93L00 32(16) 64(128) 0.15 100 pin LQFP, 208 ball LBGA

Contextual Info: Com m ercial/Industrial D ev ice s PLCC 44 68 84 PQFP 100 144 160 208 240 RQFP 208 240 VQFP 80 TQFP 100 144 BGA 225 176 272 313 CPGA 329 84 100 132/133 175/176 207 257 CQFP 84 132 172 196 208 256 HiRel/Space D evice RadTolerant < o o 12 x CM CO X 5 A </

Contextual Info: Product Number: 599-11-208-08-001428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 " Gold over 100 μ" Nickel Inner Contact Plating: 10 μ" Gold over 50 μ" Nickel 208-08-001

Contextual Info: Product Number: 599-11-208-08-001428 Description: BGA Socket 1mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 208-08-001 16 X 16

MAAM-008863

Abstract: MAMU-009156 transistor MY52 200W MOSFET POWER AMP transistor MY51 GPS Antenna AT65 MA4ST350 MADR-007690-DR0002 a74 sot-89 SM4T mixer
Contextual Info: Corporate Headquarters Richardson Electronics 40W267 Keslinger Road P.O. Box 393 LaFox, IL USA 60147-0393 Phone: 1 800 737-6937 630-208-3637 Fax: (630) 208-2550 Internet: www.rell.com Email: Canada Brampton, Ontario Torod, Norway 1 (800) 737-6937 Latin America

18CO

Contextual Info: White Electronic Designs W3H64M64E-XSBX ADVANCED* 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Organized as 64M x 64 • 1.0mm pitch

MPC5634M

Abstract: MPC5566 flexcan AMBA "microsecond bus" bosch Knock sensor mpc5554 ebi MPC5565 MPC5566 MPC5567 LQFP144
Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MPC551x and MPC5533 products in 208 MAPBGA packages; MPC5534 and MPC5553 products in 208 and 496 MAPBGA packages; MPC5554, MPC5565, MPC5566

MPC5565

Abstract: MPC5554 GPIO configuration mpc5554 ebi MPC500 MPC5500 MPC5533 MPC5534 MPC5553 MPC5554 MPC5566
Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010:MPC551x and MPC5533 products in 208 MAPBGA packages; MPC5534 and MPC5553 products in 208 and 496 MAPBGA packages; MPC5554,

CEE 32

Abstract: W3H32M64E-XSBX
Contextual Info: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400 Mb/s  Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm • 1.0mm pitch  Commercial, Industrial and Military Temperature

84 FBGA

Abstract: IPC17 FBGA-84
Contextual Info: W3H64M72E-XSBX W3H64M72E-XSBXF White Electronic Designs 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Organized as 64M x 72 • 1.0mm pitch

MPC5566 instruction set

Abstract: MPC5510 MPC5554 IVOR14 MPC5554 instruction set MPC5500 MPC5533 MPC5534 MPC5553 MPC5553 instruction set
Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MPC551x and MPC5533 products in 208 MAPBGA packages; MPC5534 and MPC5553 products in 208 and 496 MAPBGA packages; MPC5554, MPC5565, MPC5566 and MPC5567 products in

mpc5554 emios

Abstract: MPC5554 "pin compatible" mpc5554 ebi MPC5554 GPIO mpc5554 resonator MPC500 MPC5500 MPC5533 MPC5534 MPC5553
Contextual Info: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: MPC551x and MPC5533 products in 208 MAPBGA packages; MPC5534 and MPC5553 products in 208 and 496 MAPBGA packages; MPC5554, MPC5565, MPC5566 and MPC5567 products in

Contextual Info: White Electronic Designs W3H32M64EA-XSBX ADVANCED* 32M x 64 DDR2 SDRAM Single-Rank 208 PBGA MCP FEATURES  Commercial, Industrial and Military Temperature Ranges  Data rate = 667, 533, 400 Mb/s  Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

W3H128M72

Abstract: W3H128M72E-XSBX W3H128M72E
Contextual Info: White Electronic Designs W3H128M72E-XSBX Advanced* 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Package: „ CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm

84 FBGA

Abstract: W3H64M72E-XSBX fbga84 ccd400
Contextual Info: White Electronic Designs W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm „ Organized as 64M x 72 • 1.0mm pitch „ Weight: W3H64M72E-XSBX - 2.5 grams typical

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

EP1K10

Abstract: DATA44
Contextual Info: EP1K10 Device Pin-Outs Version 1.4 Pin Name 1 100-Pin TQFP 144-Pin TQFP 208-Pin PQFP 256-Pin FineLine BGA 77 76 35 74 107 2 14 106 3 142 141 144 143 11 7 116 114 113 112 111 110 109 108 105 4 1 34 54, 56, 124, 126 108 107 52 105 155 2 19 154 3 206 204 208

Contextual Info: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm

Contextual Info: W3H64M72E-XSBX W3H64M72E-XSBXF 512MB – 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  30% Space saving vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm

Contextual Info: White Electronic Designs W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Programmable CAS latency: 3, 4 or 5 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 22mm