2073M Search Results

Contextual Info: DUAL LOW VOLTAGE POWER AMPLIFIER NJM2073 The NJM2073 is a monolithic integrated circuit in 8 lead dual-in-line package, which is designed for dual audio power amplifier in portable radio and handy cassette player. • Package Outline ■ Features • Supply V oltage V + = 1 .8 ~ I5 V

Contextual Info: Series Index Bestellnummern Part Numbers Page/Seite M ini-SM P Mini-SMP 02K118-K00 . .45 02 K 118-500 . .45 02 S 118-K00. .45

P-07M

Contextual Info: i . y-yiO#S*iftSWTi:SL i t . 1 'J-Ki * r— x ij 7 o — TO-92 O T0-220F O DIP8 O DIP14 O o o o o o o o o o o O o o o o o DIP16 DIP18 DIP20 DIP22 DIP28 DIP40 '• ¡■y'r— i? 7 0— i; 7 o — 7 0— S0T-B9 o*i X SOT-89 5Pin) O *1 X O O*1 0*2 X TO-252

Calex

Contextual Info: C/ILEX 40 WATT CEM 2900 SERIES 2:1 Input Range 40 Watt Isolated Output High-Density Remote On/Off Control Six-Sided Shield SPECIFICATIONS All Specifications Are Typical At Nominal Line, Full Load and 25°C Unless Otherwise Noted. Ripple and Noise, 20MHz BW

UAA 1008

Abstract: SSOP16 UAA2073M
Contextual Info: Philips Semiconductors Product specification Image rejecting front-end for GSM applications 2073M FEATURES Image rejection is achieved in the internal architecture by two RF mixers in quadrature and two all-pass filters in I and Q IF channels that phase shift the IF by 45° and 135°

HDMP-8

Abstract: SSOP8 p 0.65 DIP18 DIP20 SDIP22 SDIP24 SDIP28 SDIP30 SDIP42 P-07M
Contextual Info: RECOMMENDED MOUNTING METHOD a • RECOMMENDED MOUNTING METHOD 1.Soldering M ethods The recom m ended soldering m ethods for each package are show n in the follow ing table. 1 R ecom m ended Soldering M ethods Table T hrough-H ole m ounted device type package

Contextual Info: Series BNC - 50 Q Stecker gerade, lot Straight Plug, solder P a rt N u m b e r C a b le A s s e m b ly G ro u p In s t r u c t io n 51 S101-272 N4 72 51 S2 R e m a rk s P a c k in g U n it solder tag silver plated 100 1 m Q Winkelstecker, klemm Right Angle Plug, clamp