200KJ Search Results

PEH200TX4220M

Abstract: rifa capacitor peh 200 PEH200TX4270M PEH200TO4100M PEH Rifa PEH 200 Rifa EVOX RIFA CAPACITORS PEH200 PEH200tv peh200tv418 rifa PEH 129
Contextual Info: PEH 200 85°C • High CV-value • Long Life • Low ESR and ESL • Compact size APPLICATION BASIC DESIGN Typical applications for the new PEH 200 would be found in Uninterruptable Power Supplies UPS , Ground Power Units (GPU), Welding Equipments and Drives

Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: SPECIFICATIONS Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling

transistor SMD 352a

Abstract: capacitor 33j 6kv 12w SOT 23 package marking code smd transistor marking 12W 33J 6KV smd 352A 25 ohm 3 watt rheostat United Chemi-Con SME series United Chemi-Con KMC capacitor 6kv 22j
Contextual Info: POWER RESISTORS CURRENT SENSE HIGH VOLTAGE HIGH ENERGY HEAT SINKABLE SURFACE MOUNT COMPONENT SELECTOR 4000G Revised July 16, 2010 1600 Golf Road, Suite 850 | Rolling Meadows, IL 60008 Phone: 866-964-6483 Fax: 847-574-7522 ohmite.com email: sales@ohmite.com

Contextual Info: bq2014 Gas Gauge IC with External Charge Control Features General Description >• C o n s e r v a t i v e a n d r e p e a t a b l e m e a su re m e n t of a v ailab le ch arg e in re c h a rg e a b le b a tte rie s T h e b q 2 0 1 4 G a s G a u g e IC is i n ­

Contextual Info: TA Series Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/ in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: TA Series Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/ in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

peh200

Abstract: IEC 384-4 PEH 200 PEH200OO427AM din 41240 PEH 160 200UH4100M PEH200MJ5220M 200XV4470M PEH200VO4220M
Contextual Info: PEH 200 85°C • High CV-value • Long Life • Low ESR and ESL • Compact size APPLICATION BASIC DESIGN Typical applications for the new PEH 200 would be found in Uninterruptable Power Supplies UPS , Ground Power Units (GPU), Welding Equipments and Drives

Contextual Info: Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling

5R00J

Abstract: TA810 TA203 TA205 TA207 TA303 TA310
Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

5R00J

Abstract: ta207 100rj 50w 100rj TA303 50000 ohm 55 watt
Contextual Info: Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling

Contextual Info: 4mm Cermet Potentiometer m iniReel Ohm s O rd er f N um ber Type 1 1KD 2KQ 5KD lOKii 20KQ 50Ka lOOKn 200KQ 330K12 500KD Type 2 1KT2 2KQ 5K£2 10KQ 20KD 50K12 100KQ 200K£2 330K£2 500KT2 691-410 691-420 691-450 691-510 69 1-520 691-550 691-610 691-620 691-633

Contextual Info: TA Series Power Chip Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is

ta303pa

Abstract: TA810PW TA310P TA205P
Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

LTA810

Abstract: TA025 TA303PA ta207 TA305 L1085
Contextual Info: Thick Film Alumina TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is

Rifa PEH 165

Abstract: PEH165 Rifa PEH169 169RV510VM peh 165 Rifa PEG 124 PEH165PG4470Q 169MV568VM PEH165KC4330Q 169PA410VM
Contextual Info: PEH 124 • • • • 125°C Snap-in terminals High performance, 125°C Long Life > 30 years at 50°C Low ESR and ESL APPLICATION BASIC DESIGN The PEH 124 is a radial capacitor for PCB mounting with a 3-pin snap-in termination. It is mainly intended for SMPS or other

5R00J

Abstract: Power Resistor 0,25ohms 100rj TA203 TA205 TA207 TA303 TA310 TA810 TA305PA
Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: SONY CXG1092N SP5T GSM Triple-Band Antenna Switch Description The CXG1092N is a high power antenna MMIC switch for use in triple-band GSM handsets. One antenna can be routed to either of the 2 Tx or 3 Rx ports. Features • 4 CMOS compatible control lines

5R00J

Abstract: 1K50J 300RJ 470RJ 75K0J
Contextual Info: O hm ite Power Chip Resistors are thick film on alum ina oxide substrates w ith copper plated silver conductors, Ruthenium oxide resistance m aterial, and a glass passivation layer. T hese resistors offer very low inductance 50nh m easured at 1MHz and outstanding power

300RJ

Abstract: TA203 TA205 TA207 TA303 TA310 TA810
Contextual Info: TA Series Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

pipo tablet

Abstract: 43lI LC6528c LA6527 6628H 6528 QSC11 connecting diagram for pc 7137 ibm 0528C LE-6T
Contextual Info: O rdering n um b er: E N 2 2 6 0 P ~ | No. 2260D SAiYO L C 6 5 2 7 C / H , 6 5 2 8 C 7 h T F CMOS LSI S i n g l e -Ch i p 4 - B i t Mi c r o c o m p u t e r s f o r ' S m a l l - S c a l e C o n t r o l -O r i e n t e d A p p l i c a t i o n s i / / General Description

transistor SMD 352a

Abstract: smd 352A capacitor 6kv 22j ge 205a 0201 footprint RW67V 12w SOT 23 package marking code SPECIFICATION OF SCR 207A CC21AA-D22W-OFA 353A
Contextual Info: POWER RESISTORS CURRENT SENSE HIGH VOLTAGE HIGH ENERGY HEAT SINKABLE SURFACE MOUNT COMPONENT SELECTOR 4000G Revised January 8, 2009 1600 Golf Road, Suite 850 | Rolling Meadows, IL 60008 Phone: 866-964-6483 Fax: 847-574-7522 ohmite.com email: sales@ohmite.com

300RJ

Abstract: TA203 TA205 TA207 TA303 TA310 TA810
Contextual Info: TA Series Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/ in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package

Contextual Info: TA Series Ohmite’s original Power Chip resistors are designed from our thick film on alumina substrate technology. These planar packages yield space saving, 10W/ in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package