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    200A00 Search Results

    200A00 Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    10141012-200A000LF
    		Amphenol Communications Solutions PwrMAX® Power Connector, Right Angle, Plug, 2P No Guide pin PDF
    SF Impression Pixel

    200A00 Price and Stock

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    Vicor Power PRM48AH480M200A00

    - Trays (Alt: PRM48AH480M200A00)
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    Avnet Americas PRM48AH480M200A00 Tray 52 Weeks 25
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    Mouser Electronics PRM48AH480M200A00
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    Avnet Abacus PRM48AH480M200A00 54 Weeks 25
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    3M Interconnect 35720-L200-A00AK

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    Avnet Americas 35720-L200-A00AK Bulk 11 Weeks, 4 Days 100
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    3M Interconnect 35505-6200-A00GF

    Conn IDC Connector SKT 5 POS 3mm IDT ST Cable Mount - Bulk (Alt: 7000090389)
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    Avnet Americas 35505-6200-A00GF Bulk 11 Weeks, 6 Days 100
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    Mouser Electronics 35505-6200-A00GF 71
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    Master Electronics 35505-6200-A00GF
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    3M Interconnect 35805-6200-A00-GF

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    Avnet Americas 35805-6200-A00-GF Bulk 11 Weeks, 4 Days 100
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    Vicor Power PRM48AH480T200A00

    - Trays (Alt: PRM48AH480T200A00)
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    Avnet Americas PRM48AH480T200A00 Tray 52 Weeks 25
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    Mouser Electronics PRM48AH480T200A00
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    Avnet Abacus PRM48AH480T200A00 54 Weeks 1
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    Vyrian PRM48AH480T200A00 14,328
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    200A00 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    sac 187

    Abstract: MIL-HDBK-217Plus
    Contextual Info: BCM48B x 040 y 200A00 PRELIMINARY DATASHEET BCM Bus Converter S US C C FEATURES US DESCRIPTION The V•I Chip™ bus converter is a high efficiency >94% Sine Amplitude Converter™ (SAC™) operating from a 38 to 55 Vdc primary bus to deliver an isolated, unregulated 3.2 to 4.6


    Original     		bcm48b200a00sac 187mil-hdbk-217plus PDF

    PRM48AH480

    Abstract: PRM48AH480T200A00
    Contextual Info: PRM48AH480 X 200A00 PRM Regulator FEATURES •        48V input 36V to 75V , non-isolated ZVS buck‐boost regulator 20V to 55V adjustable output range 200W output power in .57in2 footprint 96.7% typical efficiency, at full load


    Original     		prm48ah480200a0057in2milhdbk217plus+1prm48ah480t200a00 PDF

    Shipping Trays

    Abstract: A104 A108 A113 W72M64VK-XBX
    Contextual Info: W72M64VK-XBX Application Note W72M64VK-XBX PACKAGE CONSTRUCTION + QUALIFICATION ORGANIZATION TEST 2M x 64 4 banks per Flash Burn-In – 100%-48 hours at 125°C Final Electrical Test – 100% at maximum and minimum ambient temperatures Temperature Ranges Available:


    Original     		w72m64vk-xbxsn63/pb37762mmeia/jesd22+5c/85rhshipping traysa104a108a113 PDF

    SN46

    Abstract: PB46 JESD22 A104 A108 A113 WED3C750A8M-200BX
    Contextual Info: White Electronic Designs WED3C750A8M-200-BX WED3C7558M-300-BX POWER PC™ MULTI-CHIP PACKAGE CONSTRUCTION HIGH RELIABILITY FLIP CHIP ATTACH TEST • C4 Assembly on PowerPCÔ Processors & SSRAM die ■ Burn-In - 100%, 48 hours at 125°C ■ Final Electrical Test - 100% at maximum and


    Original     		wed3c750a8m-200-bxwed3c7558m-300-bxsn46/pb46/bi8835mm+10eia/jesd22200a0004-4200a0004-5sn46pb46jesd22a104a108a113wed3c750a8m-200bx PDF

    W3E64M16S-XSBX

    Abstract: A104 A108 A113
    Contextual Info: W3E64M16S-XSBX Application Note W3E64M16S-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST The encapsulant is not injection molded to control wire sweep effects TG = 150°C Moisture sensitivity is to JEDEC level 3 Burn-In – 100%-48 hours at 125°C


    Original     		w3e64m16s-xsbxsn63/pb37eia/jesd22200a00004-42+4an0022a104a108a113 PDF

    JESD22

    Abstract: W3H32M72E-XSBX A104 A108 A113
    Contextual Info: W3H32M72E-XSBX Application Note W3H32M72E-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST The encapsulant is not injection molded to control wire sweep effects TG = 150°C Moisture sensitivity is to JEDEC level 3 Burn-In – 100%-48 hours at 125°C


    Original     		w3h32m72e-xsbxsn63/pb37eia/jesd22200a00004-45+5an0044jesd22a104a108a113 PDF

    JESD22

    Abstract: SN63 PB37 A104 A108 A113 W332M64V-XSBX
    Contextual Info: W332M64V-XSBX Application Note W332M64V-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST Thickness around die = 0.015 to 0.020 typical The encapsulant is not injection molded to control wire sweep effects Burn-In – 100%-48 hours at 125°C Final Electrical Test – 100% at maximum and


    Original     		w332m64v-xsbxsn63/pb37eia/jesd22200a00004-x+7an0045w223m64v-xsbxjesd22sn63 pb37a104a108a113 PDF

    JESD22

    Abstract: A104 A108 A113 W3H32M64E-XSBX
    Contextual Info: W3H32M64E-XSBX Application Note W3H32M64E-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST The encapsulant is not injection molded to control wire sweep effects TG = 150°C Moisture sensitivity is to JEDEC level 3 Burn-In – 100%-48 hours at 125°C


    Original     		w3h32m64e-xsbxsn63/pb37eia/jesd22200a00004-46+5an0019jesd22a104a108a113 PDF

    JESD22

    Abstract: Sn46 PB46 7410E A104 A108 A113 WED3C7410E16M-400BX
    Contextual Info: WED3C7410E16M-400BX POWER PC 7410E MULTI-CHIP PACKAGE CONSTRUCTION HIGH RELIABILITY FLIP CHIP ATTACH TEST • C4 Assembly on PowerPC™ Processors & SSRAM die ■ Burn-In - 100%, 48 hours at 125°C ■ JEDEC Level 2 underfill ■ Die Thickness ■ Final Electrical Test - 100% at maximum and


    Original     		wed3c7410e16m-400bx7410esn46/pb46/bi8835mm+8eia/jesd22200a0004-18jesd22sn46pb46a104a108a113 PDF

    STi5516

    Abstract: STI5519 sti5518 jtag sti5518 ST20 Embedded Toolset Reference Manual pin out sti5517 JTAG STi5516 STI5518 toolset ST20 Embedded Toolset sti5505
    Contextual Info: ST20 Embedded Toolset R2.0 Reference Manual PRELIMINARY DATA ADCS 7250966F ST20 Embedded Toolset R2.0 Reference Manual Issued by the MCDT Documentation Group on behalf of STMicroelectronics Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences


    Original     		7250966fstmicroelec59sti5516sti5519+8sti5518 jtagsti5518st20 embedded toolset reference manualpin out sti5517jtag sti5516sti5518 toolsetst20 embedded toolsetsti5505 PDF