1MM PITCH BGA Search Results

SF-BGA256J-B-01

Abstract: FR4 substrate 1.6mm SN63 FR4 1.6mm substrate 1.6mm pitch BGA
Contextual Info: 14mm [0.551"] 1mm [0.039"] Top View 1mm [0.039"] 14mm [0.551"] 0.8mm [0.031"] pitch typ. 12mm [0.472"] sqr. 0.36mm [0.014"] 0.8mm [0.031"] pitch typ. Side View 6.78mm [0.267"] 2 1.6mm [0.063"] 1 0.8mm [0.031"] pitch typ. 0.33mm [0.013"] 3 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

0.3mm pitch BGA

Abstract: SF-BGA180C-B-11
Contextual Info: 1mm [0.039"] Top View 1mm [0.039"] 14mm [0.551"] sqr. 12mm [0.472"] sqr. Side View 0.3mm [0.012"] dia. typ. 8.75mm [0.344"] 6.79mm [0.268"] 2 3.75mm [0.148"] 1 3 0.8mm pitch typ. 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2

0.3mm pitch BGA

Abstract: micro pitch BGA SF-BGA292D-B-11 1mm pitch BGA BGA 20x20
Contextual Info: C BGA292D D Ø 0.396mm x2 See BGA pattern code to the right for actual pattern layout Y (optional alignment hole) 1mm pitch typ. 19mm X Top View (reference only) Ø 0.508mm pad 3.48mm [0.137"] 2 0.5mm 0.3mm [0.012"] dia. 5.32mm [0.210"] 0.635mm 19mm B 1

0.3mm pitch BGA

Abstract: 34X34 1mm pitch BGA SF-BGA680B-B-11
Contextual Info: C D Ø 0.0156" 2x (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 33mm X Top View (reference only) 1mm [0.039"] pitch typ. 0.508 mm [0.020"] dia pads 0.3mm [0.012"] dia. 2 8.69mm [0.342"] 6.85mm [0.270"] 0.5mm 0.5mm 33mm B 1

ultra fine pitch BGA

Abstract: C49B 22-N-4
Contextual Info: HIGH DENSITY PACKAGE APPLICATIONS FOR WIRE BOND AND FLIP CHIP: SMALL, FINE PITCH BGA PACKAGES Mark J. Kuzawinski International Business Machines Corp. Endicott, New York Biography Mark Kuzawinski graduated from Worcester Polytechnic Institute with a BSEE in 1978 and

1mm pitch BGA socket

Abstract: thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO
Contextual Info: Tel: 800 404-0204 www.ironwoodelectronics.com GHz Socket Specifications Mechanical Specifications Individual contact force: BGA Package Typical 1.27mm pitch BGAi Typical 1.0mm pitch BGAii Typical 0.8mm pitch BGAiii Depth of penetration (mm) 0.1 0.1 0.1 Force per ball (grams)

transistor CS4

Abstract: BGA Solder Ball 1mm D4047
Contextual Info: Issue 1.0 Sept 2001 Description The MSM64V256CB is a 16MBit Fast 3.3V SRAM available in a multichip 192 ball BGA Ball Grid Array package. The device can be organised as 256Kx64, 512Kx32 and 1Mx16. Access times of 15 and 20ns are available at Commercial or Industrial

bga676

Abstract: 1mm pitch BGA socket BGA-676 BGA 27X27 pitch 27X27MM 7075-T6 aluminum 180C 7075-T6 SBT-BGA-6002 1mm pitch BGA
Contextual Info: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • • • • 6 7 • 12 14 13 • Wide temperature range -55C to +180C High current capability (up to 8A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable

Contextual Info: 1M x 8 Static RAM MSM81000B - 020 Issue 5.0 December 1999 Description The MSM81000B is a 1M x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature

106 10k 804

Abstract: 106F 213B
Contextual Info: CTS ClearONE Terminator Reliability Test Data RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN &

Contextual Info: 1M x 8 Static RAM MSM81000B - 020 Issue 5.0 December 1999 Description The MSM81000B is a 1M x 8 SRAM monolithic device available in Chip Size BGA Ball Grid Array package, with access times of 20ns. The device is available to commercial and industrial temperature

JEDEC JESD22-B117

Abstract: JESD22-B117 Solder Paste, Indium 5.8 N41 250 y 803 IPC-9504 10k resistor 1/8 watt datasheet hot air bga Solder Paste, Indium 5.1, Type 3 10k resistor 1/4 watt datasheet
Contextual Info: RELIABILITY TEST DATA Table of Contents BGA RESISTOR ARRAY DESIGN VALIDATION TEST PLAN .3 DESIGN VERIFICATION PLAN & REPORT .4

1mm pitch BGA 14X14

Abstract: 14X14 SF-BGA156A-B-11 BGA Solder Ball 1mm BGA Package 14x14 pitch 0.4mm BGA
Contextual Info: C Package Code: BGA156A D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 13.00mm [0.512"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.53mm [0.021"] 2 0.53mm [0.021"]

pitch 0.4mm BGA

Abstract: 10X10 SF-BGA100B-B-11 0.4mm pitch BGA
Contextual Info: C Package Code: BGA100B D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 9.00mm [0.354"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.50mm [0.020"] 1.00mm pitch typ. 0.508 mm [0.020"]

BGA Solder Ball 1mm

Abstract: SF-BGA672B-B-11 pitch 0.4mm BGA
Contextual Info: C Package Code: BGA672B D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] 1.00mm pitch typ. X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"] dia pads

pitch 0.4mm BGA

Abstract: SF-BGA324A-B-11
Contextual Info: C Package Code: BGA324A D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 19.00mm [0.748"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.50mm [0.020"] 2 5.32mm [0.210"]

0.4mm pitch BGA

Abstract: pitch 0.4mm BGA SF-BGA324G-B-11 1mm pitch BGA
Contextual Info: C Package Code: BGA324G D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 17.00mm [0.669"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]

bga48

Abstract: SF-BGA48M-B-11 0.4mm pitch BGA
Contextual Info: C Package Code: BGA48M D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 6.00mm [0.236"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.50mm [0.020"] 1.00mm pitch typ. 0.508 mm [0.020"]

0.4mm pitch BGA

Abstract: pitch 0.4mm BGA 27mmx27mm SF-BGA388B-B-11
Contextual Info: C Package Code: BGA388B D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 1.00mm pitch typ. 25.00mm [0.984"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.508 mm [0.020"] dia pads

1mm pitch BGA 144

Abstract: 12X12 SF-BGA144C-B-11 BGA144C
Contextual Info: C Package Code: BGA144C D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 11.00mm [0.433"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.50mm [0.020"] 0.508 mm [0.020"]

16X16

Abstract: SF-BGA208C-B-11 16x16 bga
Contextual Info: C Package Code: BGA208C D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]

pitch 0.4mm BGA

Abstract: 1299b 34X34 SF-BGA480E-B-11
Contextual Info: C Package Code: BGA480E D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 1.00mm pitch typ. 33.00mm [1.299"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.50mm [0.020"] 2 0.508 mm

SF-BGA352B-B-11

Contextual Info: C Package Code: BGA352B D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.508 mm [0.020"] dia pads

16x16 bga

Abstract: 16X16 SF-BGA256E-B-11
Contextual Info: C Package Code: BGA256E D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]