1J30 Search Results

2SA814

Abstract: 2SC1625 2SA815 2SC1624 AC75 MAC-75 A0754
Contextual Info: 2Sa 8 SILICON 2Sa 8 PNP EPITAXIAL BASE MESA o 4> mx i mt e m o m m s L i tus« U n it o M edium P o w e r A m p l i f i e r A p p lic a tio n s o D riv e r A p p lic a tio n s S tag e A m p lifier \m æ x -tc 2SC 1 6 2 4 V CEO ^ laS M A X . to as± a z “ 1J30V 2 S A 8 1 4

vp44

Abstract: CY37064 CY37064V
Contextual Info: «oaHaoooiMMMWfMMMMMM!9:^ v’*'» -^ jjÉBT * ¿f5 ’00“’'* '^ 7“T{• < 1; .r - - •■■■■■■ c PRELIMINARY CY37064V 3, £ ,.* k v / k J UltraLogic 3.3V 64-Macrocell ISR™CLPD — tPD = 8.5ns Features — ts = 5.0 ns • 64 macrocells in four logic blocks

C2244

Abstract: S401 LCD-S401M 6 digit TN 70 pin LCD panel D5 PM X2C13
Contextual Info: UNCONTROLLED DOCUMENT PART NUMBER L C D REV, 1,00 [0 ,0 3 9 ] MAX. 65,00 60.00 [ 2 ,5 5 9 ] E.C.N. REV. — S 4 0 1 M 5 1 T R — 1 B NUMBER AND REVISION COMMENTS DATE A E.C.N. # 1 0 9 5 7 2 .2 0 . D3 B E.C.N. # 1 1 1 4 8 . D 2.0B.07 [2 , 3 6 2 ] V.A. • 57.00 C 2 .2 44 ] LA.

Contextual Info: Advance Data Sheet February 1997 m i c r o e l e c t r o n i c s gr oup Lucent Technologies Bell Labs Innovations L8551 Low-Power SLIC Features Description • Low active power typical 135 mW during on-hook transmission This electronic subscriber loop interface circuit

Schematic LED panel

Abstract: 2f30
Contextual Info: M ic r o c h ip M T A 1 1 2 Q B Intelligent Battery Management I.C. PACKAGE TYPE FEATURES • Digitally integrates battery charge and discharge current to provide an accurate state of charge indication < 3% error . • Operates with NiCd, NiMH, or Lead Acid battery

Contextual Info: MODEL J NTC Thermistors Surface Mount Chips FEATURES • Wraparound terminations • Allows for design flexibility for use with hybrid circuitry • High-density monolithic ceramic construction • Available in 8mm tape and reel • Model J chips are thermistor dies with wraparound terminations of fired-on platinum/

Contextual Info: M O D EL J N TC Therm istors S u r f a c e M ount C h ip F E A TU R E S Model J chips are thermistor dies with wraparound • Wraparound terminations terminations of fired-on platinum/palladium/silver • Allows for design flexibility for use with hybrid circuitry

Contextual Info: M ODEL G A N D J STYLES NTC Thermistors Surface Mount Chips FEATURES • Wraparound terminations • Allows for design flexibility for use with hybrid circuitry • High-density monolithic ceramic construction • Available in 8mm tape and reel • Model J chips are thermistor dies with wraparound

1j50

Abstract: 8J5003 1j30 2J1002 2j50
Contextual Info: MODEL J NTC Thermistors Surface Mount Chip FEATURES • Wraparound terminations. • Allows for design flexibility for use with hybrid circuitry. • High-density monolithic ceramic construction. • Available in 8mm tape and reel. • Model J chips are thermistor dies with wraparound

1j30

Abstract: 1j29 1J22 TL431 SOT-23 1J22 AN CL2431 CL2431AVS CL2431IAVS CL2431IVS CL2431VS
Contextual Info: Precision Adjustable Shunt Reference CORPORATION CL2431 FEATURES • • • • • • • o Temperature-Compensated: 30ppm/ C Trimmed 0.5% Bandgap Reference Internal Amplifier with 100mA Capability Temperature Range: Extended to 0 to 105oC Low Frequency Dynamic Output Impedance: < 150mΩ

atmel 89c52

Abstract: 89c52 of atmel 89C52 AT89C52 MICRO CONTROLLER AT89C52 AT 89C51 PLCC 9B9926 2H0235 5C0873 report on PLCC
Contextual Info: PAGE 1 OF 11 ATMEL CORPORATION Tel: 408 441-031 Fax: (408) 436-420 AT-89C52 CMOS FLASH MICRO CONTROLLER RELIABILITY DATA* - 125°C DYNAMIC OPERATING LIFE TEST - 200°C RETENTION BAKE - 125°C DYNAMIC OPERATING LIFE TEST (PLASTIC) - 125°C RETENTION BAKE (PLASTIC)

atmel 89c52

Abstract: 89c52 AT89C52 MICRO CONTROLLER 89c52 datasheet DATASHEET 89C52 89c52 controller AT 89C51 PLCC 89c51 datasheet atmel 89C51 datasheet of atmel 89C52
Contextual Info: PAGE 1 OF 11 ATMEL CORPORATION Tel: 408 441-0311 Fax: (408) 436-4200 AT-89C52 CMOS FLASH MICRO CONTROLLER RELIABILITY DATA* - 125°C DYNAMIC OPERATING LIFE TEST - 200°C RETENTION BAKE - 125°C DYNAMIC OPERATING LIFE TEST (PLASTIC) - 125°C RETENTION BAKE (PLASTIC)

8J5003

Contextual Info: A COMPANY MODEL J NTC Therm istors OF JJA LE Surface Mount Chip FE A T U R E S • W raparound terminations Model J chips are therm istor dies with wraparound term inations of fired-on platinum /palladium/silver for mounting directly to the bonding pads of a hybrid

Contextual Info: UNCONTROLLED DOCUMENT PART NUMBER 21 4D REV. LDQ-SMC3006RI-TR D.5D [ o .q e d : r 10.00 [0.394] zo 3,75 [0.148] 2 9 ,8 0 [1,17 3] ELECTRO-OPTICAL CHARACTERISTICS TA = 25T lf=1Q m A PARAMETER MIN TYP MAX UNITS PEAK WAVELENGTH 660 RED nm FORWARD VOLTAGE 1.7

90s8515

Abstract: 7C9749 AT90S8515
Contextual Info: PAGE 1 OF 7 ATMEL CORPORATION Tel: 408 441-0311 Fax: (408) 436-4200 AT-90S8515 AVR MICROCONTROLLER RELIABILITY DATA - 125°C RETENTION BAKE (PLASTIC) - 125°C DYNAMIC OPERATING LIFE TEST (PLASTIC) - 15 PSIG PRESSURE POT - EXTENDED TEMPERATURE CYCLE - 85°C/85% RELATIVE HUMIDITY OPERATING LIFETEST

Contextual Info: UNCONTROLLED DOCUMENT REV. LDQ-SMC3003RI-SYTR D.5D [ o .q e d : 21 4D PART NUM BER r 10.00 [0.394] zo 2 9 ,8 0 3,75 [0.148] [1,1 73 ] ELECTRO-OPTICAL CHARACTERISTICS TA=25T PARAMETER REFLOW PRO FILE 1.00 [0.039] 20 PLS. “ i r - r pout 00.65 W 0.026] (40 PLS.)

Contextual Info: A COMPANY OF MODEL J NTC Thermistors Surface Mount Chip FEATURES • Wraparound terminations • Allows for design flexibility for use with hybrid circuitry • High-density monolithic ceramic construction • Available in 8mm tape and reel Model J chips are thermistor dies with wraparound