1GC1 Search Results
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Carling Technologies MF1-B-24-616-1-GC1-B-CMF1B246161GC1BC |
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Carling Technologies MG1-B-30-420-1-GC1-1-CMG1B304201GC11C |
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MG1-B-30-420-1-GC1-1-C |
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Samtec Inc TS-111-G-C-1Conn Unshrouded Header HDR 11 POS 2.54mm Solder ST Thru-Hole |
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Samtec Inc TD-101-G-C-1 |
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Samtec Inc TS-101-G-C-1.100 SINGLE ROW SCREW M |
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1GC1 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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LM 8002
Abstract: 1GC1 HMMC-3004 1GC1-8002
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1gc1-8002hmmc-30045989-7344enlm 8002+1 | |
HMMC-3028Contextual Info: Agilent HMMC–3028 DC–12 GHz High Efficiency GaAs HBT MMIC Divide–by–8 Prescaler 1GC1-8008 Data Sheet Features • Wide Frequency Range: 0.2-12 GHz • High Input Power Sensitivity: On-chip pre- and post-amps -20 to +10 dBm 1–8 GHz -15 to +10 dBm (8–10 GHz) |
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1gc1-80085989-7348enhmmc-3028 | |
1gc1-8053
Abstract: MMIC limiter 1gc1 tc231 GaAs MMIC ESD, Die Attach and Bonding Guidelines
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1gc1-8053tc23100e-0300e-04+5 | |
1GM1- 4220 Agilent
Abstract: 1GM1 4234 1GM1 1GC1-4234 1GC1 s21b 1GM1-4220 1GC1-8234 and/1GM1 4234 1GC1-42
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1gc1-8234tc230pdc-18mlf-16/qfn-16+12 | |
1GC1
Abstract: Die Attach and Bonding Guidelines TC225 GaAs MMIC ESD, Die Attach and Bonding Guidelines 1gc1 agilent TC2-25 2tc2-25 agilent HBT transistor series
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1gc1-8048tc225tc225/rev1gc1+6 | |
1gc1
Abstract: DC-12 HMMC-3122 JESD22-A112-A GaAs MMIC ESD, Die Attach and Bonding Guidelines HBT agilent series 1GC1-8209-TR1-7
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hmmc-3122dc-121gc1-8209-tr1-7reel/500+7 | |
1GC1-8202-TR1-7
Abstract: 1GC1 HMMC-3104 JESD22-A112-A GaAs MMIC ESD, Die Attach and Bonding Guidelines
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hmmc-3104dc-161gc1-8202-tr1-7reel/500+7 | |
1GC1
Abstract: HMMC-3022 GaAs MMIC ESD, Die Attach and Bonding Guidelines hmmc frequency divider
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1gc1-80095989-7346en1gc1hmmc-3022+2 | |
1gc1
Abstract: DC-12 HMMC-3128 JESD22-A112-A GaAs MMIC ESD, Die Attach and Bonding Guidelines 1GC1-8208-TR1-7 1GC1-8208-BLK-bubble
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hmmc-3128dc-121gc1-8208-tr1-7reel/500+6 | |
agilent HBT transistor series
Abstract: tca 335 A 1GC1-8000 HBT agilent series
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hmmc-52001gc1-80005989-6211enagilent hbt transistor series+2 | |
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Contextual Info: Agilent 1GC1-8235 0-20 GHz Integrated Diode Limiter TC231P Data Sheet Features • Two Independent Limiters for Single–ended or Differential Signals • Can be Biased for Adjustable Limit Level and Signal Detection • Minimum Group Delay. Package Type: |
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1gc1-8235tc231pmlf-16/qfn-165989-6211en | |
TC225Contextual Info: Agilent 1GC1-8048 40–72 GHz Doubler TC225 Data Sheet Features • PIN = + 15 dBm • Wide Bandwidth: 40–72 GHz Usable to 80+ GHz • Low Conversion Loss: 13 dB typical • Low 1/2 and 3/2 spurs: –23 dBc typical Chip Size: Chip Size Tolerance: Chip Thickness: |
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1gc1-8048tc225tc225/rev | |
TC221Contextual Info: Agilent 1GC1-8038 50 GHz Frequency Doubler TC221 Data Sheet Features • Conversion Efficiency: −12 dB Typical • 1/2 and 3/2 spurs: 15 dBc Typical Chip Size: Chip Size Tolerance: Chip Thickness: 890 x 500 µm 35.0 x 19.7 mils ±10 µm (±0.4 mils) 127 ± 15 µm (5.0 ± 0.6 mils) |
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1gc1-8038tc221tc221/rev | |
1GC1-8234
Abstract: 1GM1 4234 MLF-16/QFN-16
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1gc1-8234tc230pdc-18mlf-16/qfn-16+4 | |
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TC221
Abstract: 1GC1-8038 GaAs MMIC ESD, Die Attach and Bonding Guidelines 8038 CE25 Die Attach and Bonding Guidelines
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1gc1-8038tc221tc221/revgaas mmic esd, die attach and bonding guidelines+3 | |
HMMC-3008
Abstract: GaAs MMIC ESD, Die Attach and Bonding Guidelines
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1gc1-80035989-7345enhmmc-3008gaas mmic esd, die attach and bonding guidelines | |
1gc18204
Abstract: HMMC-3102 JESD22-A112-A 1GC1-8204-BLK-bubble
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hmmc-31021gc1-8204-tr1-7reel/5001gc1-8204-blk-bubble+4 | |
HMMC 1GC1
Abstract: HMMC-3108 JESD22-A112-A GaAs MMIC ESD, Die Attach and Bonding Guidelines 1gc1 excess
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hmmc-3108dc-161gc1-8203-tr1-7reel/500+8 | |
hmmc3124
Abstract: DC-12 HMMC-3124 JESD22-A112-A GaAs MMIC ESD, Die Attach and Bonding Guidelines
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hmmc-3124dc-121gc1-8207-tr1-7reel/500+7 | |
HMMC-3024
Abstract: GaAs MMIC ESD, Die Attach and Bonding Guidelines
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1gc1-80075989-7347enhmmc-3024gaas mmic esd, die attach and bonding guidelines | |
HMMC-3002Contextual Info: Agilent HMMC–3002 DC–16 GHz GaAs HBT MMIC Divide–by–2 Prescaler 1GC1-8004 Data Sheet Features • Wide Frequency Range: 0.2-16 GHz • High Input Power Sensitivity: On–chip pre– and post–amps -20 to +10 dBm 1–10 GHz -15 to +10 dBm (10–12 GHz) |
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1gc1-80045989-7343enhmmc-3002 | |
TC231P
Abstract: 1GC1-8235 1gc1-4235 1gc1 agilent TC231 pin diode limiter RF limiter PIN diode AN 829 gain adjustable device 1GC142 f2525
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1gc1-8235tc231pmlf-16/qfn-16tc231+8 | |
c0425Contextual Info: UNCONTROLLED DOCUMENT PART NUMBER REV. S S I-L X M P 5 0 1 1GC1215 PANEL CUTOUT 1195 [0.470: 10,25 [0 ,4 0 6 ] SQR, 9 ,1 0 [ 0 , 3 5 8 ] ELECTRO-OPTICAL CHARACTERISTICS Ta = 25'C SQR, <MAX.> 1.20 [0,047] 7,50 [0,295] 10.80 [0.425] SQR, i \ PARAMETER PEAK WAVELENGTH |
OCR Scan |
ssi-lxmp5011gc1215c0425 | |
05S200Contextual Info: TOSHIBA UNDER DEVELOPMENT TMP95CS64/TMP95C265 CMOS 16-Bit Microcontrollers TMP95CS64F and TMP95C265F 1. Outline and Features TMP95CS64/265 is a high-speed 16-bit microcontroller designed for the control of various mid- to large-scale equipm ent. TMP95CS64 incorporates m asked ROM, while |
OCR Scan |
tmp95cs64/tmp95c26516-bittmp95cs64ftmp95c265f+5 | |