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TC4511BP
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Toshiba Electronic Devices & Storage Corporation
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CMOS Logic IC, BCD-to-7-Segment Decoder, DIP16 |
Datasheet
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98426-F11-25-194LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions, 2.00mm (0.079in) Pitch. |
PDF
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64991-G19-4LF
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Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 38 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating. |
PDF
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77314-194LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100) Pitch. |
PDF
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51952-194LF
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Amphenol Communications Solutions
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PwrBlade®, Power Supply Connectors, 3ACP 4P 24S Vertical Header. |
PDF
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