170X220 Search Results

Contextual Info: Thermal Data  SO 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 2.55 mm 0.0063W/cm°C Leadframe options:

DS0813

Abstract: DSPG TOYOGIKEN TIBOX MIP 320 f DS1217
Contextual Info: EN K I G TOYO N E K I G O Y O T N E K I G O Y TO N E K I G TOYO 1项 12 IP 液体防护级别 1项 PROTECTION AGAINIST SOLID SECOND NUMBE PROTECTION AGAINIST LIQUIDS 外部冲击防护级别 测试 TEST IP 测试 (TEST) IK 测试 (TEST) 固体防护级别

SO-28-2

Abstract: SO28
Contextual Info: Thermal Data  SO28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 2.55 mm 0.0063W/cm°C Leadframe options:

BATWING

Abstract: SO24
Contextual Info: Thermal Data  SO24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 2.55 mm 0.0063W/cm°C Leadframe options:

thermal PCB D2PAK

Abstract: AR348 HTGB ERS -112 assembly motorola transistor dpak marking
Contextual Info: AR348/D HIGHER POWER LEVELS IN SURFACE MOUNT DESIGNS Prepared By Dave Hollander Motorola Semiconductor Products Sector Phoenix, Arizona "Reprinted by permission from the September issue of Surface Mount Technology; Copyright 1990, P.O. Box 159f 17730 W. Peterson Road, Libertyville, IL 60048 U.S.A."

Contextual Info: Thermal Data  SO 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 2.55 mm 0.0063W/cm°C Leadframe options: