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Dichtomatik


Dichtomatik 170X220X15SC (75006638) OIL SEAL, 170MM ID, 220MM OD, 15MM WIDTH
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	170X220X15SC (75006638)	Bulk		3 Weeks	13	1 - 10 - 100 $42.20 1000 $42.20 10000 $42.20	Get Quote
Dichtomatik 170X220X15TC (75006639) OIL SEAL, 170MM ID, 220MM OD, 15MM WIDTH
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	170X220X15TC (75006639)	Bulk		3 Weeks	1	1 $45.48 10 $43.20 100 $38.65 1000 $38.65 10000 $38.65	Get Quote

170X220 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Contextual Info: Thermal Data  SO 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 2.55 mm 0.0063W/cm°C Leadframe options:	Original	063W/cm 170x220	PDF
DS0813 Abstract: DSPG TOYOGIKEN TIBOX MIP 320 f DS1217 Contextual Info: EN K I G TOYO N E K I G O Y O T N E K I G O Y TO N E K I G TOYO 1项 12 IP 液体防护级别 1项 PROTECTION AGAINIST SOLID SECOND NUMBE PROTECTION AGAINIST LIQUIDS 外部冲击防护级别测试 TEST IP 测试 (TEST) IK 测试 (TEST) 固体防护级别	Original	MIP-65 MIP-65PT MP-65 MIP-86 MIP-86PT MP-86 MIP-325 MIP-43 MIP-44 MIP-54 DS0813 DSPG TOYOGIKEN TIBOX MIP 320 f DS1217	PDF
SO-28-2 Abstract: SO28 Contextual Info: Thermal Data  SO28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 2.55 mm 0.0063W/cm°C Leadframe options:	Original	063W/cm 170x220 SO-28-2 SO28	PDF
BATWING Abstract: SO24 Contextual Info: Thermal Data  SO24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 2.55 mm 0.0063W/cm°C Leadframe options:	Original	063W/cm 170x220 BATWING SO24	PDF
thermal PCB D2PAK Abstract: AR348 HTGB ERS -112 assembly motorola transistor dpak marking Contextual Info: AR348/D HIGHER POWER LEVELS IN SURFACE MOUNT DESIGNS Prepared By Dave Hollander Motorola Semiconductor Products Sector Phoenix, Arizona "Reprinted by permission from the September issue of Surface Mount Technology; Copyright 1990, P.O. Box 159f 17730 W. Peterson Road, Libertyville, IL 60048 U.S.A."	OCR Scan	AR348/D OT-23 2PHX26222G-1 thermal PCB D2PAK AR348 HTGB ERS -112 assembly motorola transistor dpak marking	PDF
Contextual Info: Thermal Data  SO 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 2.55 mm 0.0063W/cm°C Leadframe options:	Original	063W/cm 170x220	PDF