16M SERIAL SRAM Search Results
16M SERIAL SRAM Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| 27S07ADM/B |
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27S07A - Standard SRAM, 16X4 |
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| 27LS07DM/B |
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27LS07 - Standard SRAM, 16X4 |
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| 27S03/BEA |
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27S03 - SRAM - Dual marked (860510EA) |
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| 27S03ADM/B |
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27S03A - 64-Bit, Low Power Biploar SRAM |
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| 27S03ALM/B |
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27S03A - 64-Bit, Low Power Biploar SRAM |
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16M SERIAL SRAM Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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MX25L1605ZM
Abstract: 25l1605 8x6mm MX25L1605 IN3064 256-Byte
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MX25L1605ZM 16M-BIT 100mA PM1291 MX25L1605ZM 25l1605 8x6mm MX25L1605 IN3064 256-Byte | |
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Contextual Info: GS81302D06/11/20/38E-500/450/400/350 144Mb SigmaQuad-II+ Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features 500 MHz–350 MHz 1.8 V VDD 1.8 V or 1.5 V I/O are just one element in a family of low power, low voltage HSTL I/O SRAMs designed to operate at the speeds needed to |
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GS81302D06/11/20/38E-500/450/400/350 165-Bump 165-bump, ava11 x18/x36 81302Dxx 81302D2038 | |
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Contextual Info: Preliminary GS81302T08/09/18/36E-333/300/250/200/167 144Mb SigmaDDRTM-II Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–167 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaDDR Interface • Common I/O bus |
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GS81302T08/09/18/36E-333/300/250/200/167 165-Bump 165-bump, GS81302Txx | |
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Contextual Info: Preliminary GS82582D18/36E-400/375/333/300/250 400 MHz–250 MHz 1.8 V VDD 1.8 V and 1.5 V I/O 288Mb SigmaQuad-IITM Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features Clocking and Addressing Schemes • Simultaneous Read and Write SigmaQuad Interface |
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GS82582D18/36E-400/375/333/300/250 165-Bump 165-bump, 288Mb GS82582D36E-300T. 82582Dxx | |
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Contextual Info: Preliminary GS82582D19/37E-450/400/375/333 288Mb SigmaQuad-II+TM Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface |
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GS82582D19/37E-450/400/375/333 165-Bump 165-bump, packag165-bump GS82582DxxE-300T. 82582D1937 | |
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Contextual Info: Preliminary GS82582DT20/38E-550/500/450/400 288Mb SigmaQuad-II+ Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features 550 MHz–400 MHz 1.8 V VDD 1.8 V or 1.5 V I/O one element in a family of low power, low voltage HSTL I/O SRAMs designed to operate at the speeds needed to implement |
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GS82582DT20/38E-550/500/450/400 165-Bump 165-bump, 165-buad-II+ GS82582DT38GE-400I GS82582DT38E-400T. 82582DTxx | |
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Contextual Info: Preliminary GS82582T20/38E-550/500/450/400 288Mb SigmaDDR-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features 550 MHz–400 MHz 1.8 V VDD 1.8 V or 1.5 V I/O SRAMs. The GS82582T20/38E SigmaDDR-II+ SRAMs are just one element in a family of low power, low voltage HSTL |
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GS82582T20/38E-550/500/450/400 165-Bump 165-bump, GS82582T38E-400T. 82582TxxE | |
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Contextual Info: Preliminary GS82582Q18/36E-357/333/300/250 357 MHz–250 MHz 1.8 V VDD 1.8 V and 1.5 V I/O 288Mb SigmaQuad-IITM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features Clocking and Addressing Schemes • Simultaneous Read and Write SigmaQuad Interface |
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GS82582Q18/36E-357/333/300/250 165-Bump 165-bump, 288Mb GS82582Q36E-250T. 82582Qxx | |
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Contextual Info: SONY CXK77Q36162GB 25/27/3 Preliminary 16Mb DDR1 HSTL High Speed Synchronous SRAM 512K x 36 Description The CXK77Q36162GB is a high speed CMOS synchronous static RAM with common I/O pins, organized as 524,288 words by 36 bits. This synchronous SRAM integrates input registers, high speed RAM, output registers, and a two-deep write buffer |
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CXK77Q36162GB CXK77Q36162GB | |
64mb edo dram simm
Abstract: 8Mb SDRAM 5.0v memory 2mb 72-pin simm simm72 IBM11S43 ram 168 pin 8k refresh simm DIMM 72 pin out edo dram 72-pin simm
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176X220
Abstract: S1D13515F00A S1D13513B01B QFP22-208 epson 176X220 S1D13513F01A 18-BIT bitblt PFBGA12180 S1D13717B00B
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16bit 18-bit 24-bit 16bitRICS QFP22256 176X220 S1D13515F00A S1D13513B01B QFP22-208 epson 176X220 S1D13513F01A bitblt PFBGA12180 S1D13717B00B | |
S1D13521
Abstract: s1d13517 S1D13522 S1D13781F00A s1d13781 S1D13774 S1D13522A00B S1V30330 S2D13P04 S1D13745
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ARM720T: S1D13521 s1d13517 S1D13522 S1D13781F00A s1d13781 S1D13774 S1D13522A00B S1V30330 S2D13P04 S1D13745 | |
MH8S64AQFC -7
Abstract: M5M51008CFP-70HI sop-32 pin Shipping Trays S1912 M5M5V108DFP-70HI jeida dram 88 pin M5M465165 MH8S64AQFC-6 MH8S64DBKG-6 PC-100
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AT76C502AContextual Info: Features • Wireless Interface Following the IEEE 802.11b Standard • Wireless LAN MAC Unit with ARM7TDMI RISC Processor • Integrated 128-byte Transmit and 128-byte Receive FIFOs for Wireless MAC Layer Functions • 16-bit PCMCIA Bus Interface • Glueless SRAM Interface for All MAC Operations, Supporting up to 16M Bytes of |
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128-byte 16-bit 32-bit 1948AS 03/01/xM AT76C502A | |
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ML86V8101
Abstract: ML610Q794G ML7147 ML610Q488 ML98 ML7138 ML7247-001
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HUN-1119 ML86V8101 ML610Q794G ML7147 ML610Q488 ML98 ML7138 ML7247-001 | |
MARKING HRA
Abstract: 4kw marking
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MB84VD2118XEM-70/MB84VD2119XEM-70 56-ball MB84VD2118XEM/MB84VD2119XEM MARKING HRA 4kw marking | |
MARKING HRA
Abstract: SEC MCP 4kw marking
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MB84VD2108XEM-70/MB84VD2109XEM-70 56-ball MB84VD2108XEM/MB84VD2109XEM MARKING HRA SEC MCP 4kw marking | |
nanotron
Abstract: nanoNET system specifications NanoNET PHY and MAC Nanotron Technologies NA1TR8 802.15.4a NanoNET PHY and MAC System Specifications power supply using 7812 ic CRYSTAL-16 circuit diagram of rf transmitter and receiver
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NA-03-0100-0246-1 nanotron nanoNET system specifications NanoNET PHY and MAC Nanotron Technologies NA1TR8 802.15.4a NanoNET PHY and MAC System Specifications power supply using 7812 ic CRYSTAL-16 circuit diagram of rf transmitter and receiver | |
SOP 8 200MIL
Abstract: serial flash 256Mb fast erase spi TM 1628 IC SOP Micron 512MB NOR FLASH HN29V1G91T-30 HN58C1001FPI-15 M5M51008DFP-70HI 256mb EEPROM Memory CSP-48 TSOP 28 SPI memory Package flash
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D-85622 REJ01C0001-0100Z SOP 8 200MIL serial flash 256Mb fast erase spi TM 1628 IC SOP Micron 512MB NOR FLASH HN29V1G91T-30 HN58C1001FPI-15 M5M51008DFP-70HI 256mb EEPROM Memory CSP-48 TSOP 28 SPI memory Package flash | |
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Contextual Info: WHITE /M IC R O E L E C T R O N IC S WH22DXL2X-002X 68040 MODULE, 16M SRAM/16M FLASH, ASIC MODULAR ADVANCED* FUNCTIONAL DESCRIPTION FEATURES • Based on 68040 juP The 68040 General Purpose Processor M CM is a high perform ance, ■ Processor Clock Frequencies: 50, 66 M H z |
OCR Scan |
WH22DXL2X-002X SRAM/16M 512Kx32 1553B H22DXL2X-002X | |
EMIF sdram full example
Abstract: TIMING DIAGRAM OF MCBSP and E1 interface AC97
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TMS320C62x TMS320C67x EMIF sdram full example TIMING DIAGRAM OF MCBSP and E1 interface AC97 | |
3654P
Abstract: DRAM 4464 jeida dram 88 pin MB814260 4464 dram 1024M-bit 4464 64k dram MB81G83222-008 mb814400a-70 4464 ram
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16M-bit 64M-bit 68-pin) 88-pin) MB98C81013-10 MB98C81123-10 MB98C81233-10 MB98C81333-10 3654P DRAM 4464 jeida dram 88 pin MB814260 4464 dram 1024M-bit 4464 64k dram MB81G83222-008 mb814400a-70 4464 ram | |
S5L9291X01-T0R0
Abstract: a00a AD10 AD11 AD12 S5L9291X 1414f
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S5L9291X 100-TQFP-1414 S5L9291X 10-band S5L9291X. S5L9291X01-T0R0 a00a AD10 AD11 AD12 1414f | |
SAMSUNG NAND Flash Qualification Report
Abstract: K5P2880YCM flash 16M SAMSUNG 128Mb NAND Flash Qualification Reliability 1Mx8 bit Low Power CMOS Static RAM
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K5P2880YCM 16Mx8) 1Mx8/512Kx16) 69-Ball 08MAX SAMSUNG NAND Flash Qualification Report flash 16M SAMSUNG 128Mb NAND Flash Qualification Reliability 1Mx8 bit Low Power CMOS Static RAM | |