164X Search Results

Contextual Info: 0.2 4X C E A 164X 0.15 A 0.25 A 0.35 A D1 D E1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS. 3. DIMENSION b IS THE MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A. B TOP VIEW E2 10X R P N M L K J H G

1136a

Contextual Info: 0.20 4X C E A 164X 0.15 A 0.25 A 0.35 A D1 D E1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS. 3. DIMENSION b IS THE MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A. B TOP VIEW E2 10X R P N M L K J H G

Contextual Info: 1 used for: 11 D-SUB — 1— - t — i If III c :z z o /— fli # « § -2 8.02i+00.25 SEE NOTE 3 - fn1 vd No. of Pos. A -0.76 B -0.25 9 31.19 16.46 15 25 39.52 24.79 53.42 69.70 38.50 54.96 37 c Part-NO. 25.00 SH 164X11769X 33.30 !o:!5 164X11779X

peb 2091 errata

Abstract: smd code marking 27H
Contextual Info: SIEMENS ICs for Communications ISDN Echocancellation Circuit IEC-Q PEB 2091 Version 5.3 PEF 2091 Version 5.3 Delta Sheet 09.98 PEB/F 2091 Revision History: Original Version: 09.98 Previous Version: Point in previous Version Point (in new Version) Subjects (major changes since last revision)

164X11989X

Abstract: 164X
Contextual Info: D-S U B Co n n e c t o r s D-SUB High Density Crimp body without contacts – For wire size AWG 22 Description For wire size AWG 22 precision machined contacts Mounting style: with through-hole Ø .118" 3 mm Shell: Steel tin plated (brass tin plated or stainless steel

4XPXXG03

Abstract: 4XSXXG03 DSS1XSXXG04X 10029X
Contextual Info: D-SUB C o n n e c t o r s D-SUB Standard Crimp body without contacts – For wire size AWG 24…20 and AWG 28…24 Description For machined and stamped contacts, AWG 24.20 and AWG 28.24 Mounting styles: - with through-hole, Ø .118” 3 mm - with 4-40 UNC or M3 threaded insert

DG24321

Abstract: ALC1001-131 AL1004 DG243 ALM0305 320X AL1301 alm1004
Contextual Info: LCD Module Lineup & Multi-gray Level Processor LSI ALC100H31 IL C D i S ' H . — Multi-gray level processor LSI Main Specifications A LC 1001-131l i , S i fê â S Ü & iiy n-ty-y-X-hV .5 1 2 fe Ü jS S fc li. — mM. 7 rS U -« « * Ä -y S P ä lilB iffc

ragone

Abstract: rechargeable batteries ultracapacitors Electric double-layer capacitor
Contextual Info: High energy density with ultracapacitors Bursting with power Ultracapacitors, also known as super or double-layer capacitors, represent a new generation of electrochemical components for energy storage. In terms of energy density and speed of access to the energy

KD 2107

Abstract: A5515 A5568-01 A54450 PQFP 132 PACKAGE DIMENSION intel A5500-01 A5522-01 A5506 Intel 1702 eprom PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS
Contextual Info: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type A B C

Contextual Info: FACTSHEET F-199 amtec / '/ u. BKT Next DAY BKT i POLARIZED H E A D E R bktseries SPECIFICATIONS Shroud option available for blind mating Mates with: BKS Materials: In su la tor M aterial: . • ■ ■ Liquid Crystal Polymer Term inal M aterial: Phosphor Bronze

Contextual Info: 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM SST34HF162x / 164x SST31VF201 / 401 / 8012Mb/4Mb/8Mb Flash x16 + 1MbSRAM (x16) ComboMemories Preliminary Specifications FEATURES: • Flash Organization: 1M x16 • Dual-Bank Architecture for Concurrent

EATON CM20A

Abstract: A5 GNE mosfet Hall sensor 44e 402 2N8491 FTG 1087 S TRIAC BCR 10km FEB3T smd transistor marking 352a sharp EIA 577 sharp color tv schematic diagram MP-130 M mh-ce 10268
Contextual Info: Table of Contents N E W A R K E L E C T R O N IC S “Where serving you begins even before you call” Newark Electronics is a UNIQUE broadline distributor of electronic components, dedicated to provid­ ing complete service, fast delivery and in-depth inventory. Our main

Light

Abstract: K1-U39JA2-0509050SI SCU-A501 232C 500VA A501 UPS SMU RS-232C 9pin
Contextual Info: 落 雷 や 停 電 電 源ト ラ ブ ル か ら 大 切 な パ ソ コ ン や デ ー タ を 保 護 出力容量500VA/300Wで 強力なバックアップ パソコンなら約10分、ハブなら約40分 （150W程度のパソコン、50W程度のスイッチングハブを例に当社試算）

siemens matsua kondensator

Contextual Info: UltraCap: Energie aus leistungsstarken Kondensatoren Doppelschicht eröffnet neue Dimensionen Ultra-Kondensatoren – oft auch Superkondensatoren oder Doppelschichtkondensatoren genannt – stellen eine neue Methode der elektrochemischen Energiespeicherung dar. Sie liegen hinsichtlich der Energiedichte und der Zugriffszeit auf

schematic diagram atx Power supply 500w

Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455

R5F72543

Abstract: r5f61725 SH7724 R5F2136Can R5F72543RKBGV R5F35L83 R8A77240D500BG 2332 prom R5F70834AD80FTV R5F70835
Contextual Info: Renesas MPU & MCU General Catalog 2009.10 2009.10 Renesas MPU & MCU General Catalog Renesas MPU & MCU General Catalog RJJ01B0001-1200 2009. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon 11.1 Renesas Technology www.renesas.com

TG1608

Abstract: TK77
Contextual Info: Accessories Combination Kits Used to combine series specific enclosures to make larger units. Connect horizontally or vertically. Fitting Type Combination Kit Threaded with locknut seal for connecting sidewalls. Fits standard Pg knockouts. Drilling template included to

74LS164

Abstract: 25LS164 QE Logica 21
Contextual Info: Am25LS164 • Am54LS/74LS164 8-Bit Serial-ln, Parallel-Out Shift Register D IS T IN C T IV E C H AR AC TER ISTIC S F U N C T IO N A L DESCRIPTION • • Gated serial inputs Asynchronous clear • A m 25LS devices o ffe r the follow ing improvements over A m 54/74 LS

Contextual Info: m F-199-1 sam lëc BKT-125—0 5 -L -V B K T -111-01-L-V SPECIFICATION S Shroud option available for N blind mating Mates with BKS Materials: Insulate r Material: Liquid C r y s ta l P o ly m e r Terminal Material: 1,00mm .03937pitch OPTIONS P h o s p h o r B ro n z e

58-0020-012-x

Contextual Info: TALEMA product catalogues intro | company profile | products | "toroidal" advantages | certificates a recognitions | quality | mounting styles | contacts OK = Transformers = Standard toroidal transformers, 58-XXX-XXX-x Series Power: 12 VA - 800 VA Primary: 230 V

HP100

Abstract: enclosure HP80
Contextual Info: The HP Series are economy junction boxes for lighter duty applications. The HP70, 80 and 90 feature snap on covers, while the HP100 features 4 quick release screws. HP Enclosures are supplied with universal entry seals that can be easily cut to create the required wire, cable or

CyOptics ROSA

Contextual Info: 1640 PIN and 1641 (APD) 10 Gb/s Small Form-Factor Detector + TIA Receiver Optical Sub-Assemblies (ROSAs) Product Brief Description Features The 1640 and 1641 -Type 10 Gb/s receiver optical subassembly (ROSA) integrates a 10 Gb/s APD or PIN photodetector and a transimpedance amplifier (TIA) in a metal/

Contextual Info: F-206 S u rfa c e 1mmPOLARIZED HEADER SERIES^ SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?BKT or www.samtec.com?BKS BKT BASE HEIGHT NO. OF POSITIONS Specify BODY STYLE from chart Insulator Material: Liquid Crystal

Contextual Info: 16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM SST34HF162x / 164x SST31VF201 / 401 / 8012Mb/4Mb/8Mb Flash x16 + 1MbSRAM (x16) ComboMemories Preliminary Specifications FEATURES: • Flash Organization: 1M x16 • Dual-Bank Architecture for Concurrent