16188 Search Results

MDL-16188

Abstract: 16188 HD44780 LED04
Contextual Info: 16 CHARACTERS X 1 LINE CHARACTER SIZE: 4.84W X 9.22H mm MDL S -16168* (5 X 8 DOTS) *ALSO AVAILABLE IN 8 WAY MULTIPLEX - M D L-16188 4.84 15,0 MAX 11.0MAX 0 .9 2 9 .2 2 9,4+0,5- / / / / / / / / / / / / / / / / / / / / £ £ / / 0 .0 6 / / 1.6 1.6 WITH LED04

Contextual Info: 16188SP ABSOLUTE MAXIMUM RATINGS Item Supply Voltage for Logic Supply Voltage for LCD Drive Input Voltage LED Forward Current LED Reverse Voltage LED Power Loss Operating Temperature Storage Temperature Symbol VCC-VSS VCC-VEE VI IF VR PD Topr Tstg Test Standard Value

Contextual Info: TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors High Power Infrared Emitting Diode, RoHS Compliant, 940 nm, GaAlAs/GaAs FEATURES TSML1020 TSML1000 • Package type: surface mount • Package form: GW, RGW, yoke, axial • Dimensions L x W x H in mm : 2.5 x 2 x 2.7

D125

Contextual Info: Extract from the online catalog SACC-DSI-MS-4CON-M12 SCO Order No.: 1551820 Sensor/actuator flush-type connector, 4-pos., M12 SPEEDCON, Acoded, rear/screw mounting with M12 thread, with straight solder

Contextual Info: TSML1000/1020/1030/1040 Vishay Telefunken Extented Power IR Emitting Diode in SMD Package Description TSML1000 TSML10.0 is a high efficiency infrared emitting diode in GaAlAs on GaAs technology molded in clear SMD package This technology represents best performance for

Contextual Info: TCND5000 VISHAY Vishay Semiconductors Reflective Optical Sensor with PIN Photodiode Output Description C TCND5000 is a reflective sensor SMD in plastic package including IR emitter and PIN Photodiode. Optical axes of emitter and detector are parallel aligned for

14335

Contextual Info: TSML1000/1020/1030/1040 Vishay Telefunken Extented Power IR Emitting Diode in SMD Package Description TSML10.0 is a high efficiency infrared emitting diode in GaAlAs on GaAs technology molded in clear SMD package. This technology represents best performance for

74F253

Abstract: 74F353 N74F353D N74F353N
Contextual Info: INTEGRATED CIRCUITS 74F353 Dual 4-input multiplexer 3-State Product specification IC15 Data Handbook Philips Semiconductors 1996 Jan 05 Philips Semiconductors Product specification Dual 4-input multiplexer (3-State) 74F353 FEATURES PIN CONFIGURATION • Inverting version of 74F253

Contextual Info: TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors High Power Infrared Emitting Diode, RoHS Compliant, 940 nm, GaAlAs/GaAs FEATURES TSML1020 TSML1000 • Package type: surface mount • Package form: GW, RGW, yoke, axial • Dimensions L x W x H in mm : 2.5 x 2 x 2.7

tCnd5000

Contextual Info: TCND5000 Vishay Semiconductors Reflective Optical Sensor with PIN Photodiode Output Description The TCND5000 is a reflective sensor that includes an infrared emitter and PIN photodiode in a surface mount package which blocks visible light. Top view A Features

Contextual Info: TCND5000 Vishay Semiconductors Reflective Optical Sensor with PIN Photodiode Output FEATURES Top view A • Package type: surface mount A • Detector type: pin photodiode • Dimensions L x W x H in mm : 6 x 4.3 x 3.75 Detector Emitter C 19967 • Operating range within > 20 % relative collector

smd diode GW

Contextual Info: TSML1000, TSML1020, TSML1030, TSML1040 Vishay Semiconductors High Power Infrared Emitting Diode, RoHS Compliant, 940 nm, GaAlAs/GaAs FEATURES TSML1000 TSML1020 • Package type: surface mount • Package form: GW, RGW, yoke, axial • Dimensions L x W x H in mm : 2.5 x 2 x 2.7

philips lcd 15.4 pinout

Abstract: mbus master broadcom switch D14290 lt 8219 CQ 523
Contextual Info: MSC8154 Reference Manual Quad Core Digital Signal Processor MSC8154RM Rev 0, September 2010 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516

ms27752-1

Abstract: MS25224-3 MS25224-1 MS25224 ms25224-2 MS25225-1 ms25214-2 MS24417-1 MS25196-1 b9001b
Contextual Info: SECTION F ACCESSORIES Introduction Switch Guar ds • Prevent accidental operation of switches • Switch operation limited to selected functions • Adaptable to one, two and four pole configurations • One hole or flush mounted variations Pushbutton Shields

MS27217-1

Contextual Info: SNAP ACTION SWITCHES S UB -M INIATURE 10.1 AMP D OUBLE -B REAK SERIES 16: ACTUAL SIZE APPLICATIONS SUB-MINIATURE 10.1 AMP DOUBLE-BREAK SNAP ACTION SWITCHES Series 16 switches feature the Butterfly double-break momentary switch mechanism. This offers the capability of handling high or low current loads in a

weidmuller 170125

Abstract: 160505 din 46228 25nm 161871 Weidmuller BLZ 5.00 H07V-K analoge schaltkreise 132166 BL35
Contextual Info: Steckverbindersysteme in metrischer Bauform Systemübersicht • BL 3.5/SL 3.5 Raster 3,5 mm Die Systeme zeichnen sich durch • BLZ 5.00/SL 5.00 (Raster 5,00 mm) • eine platzsparende Bauweise • BLZ 7.50/SL 7.50 (Raster 7,50 mm) • eine konische Drahteinführung

Contextual Info: SHEET 1 OF 1 A C 12 3 7 8 9 CONTACT CONFIGURATION TIMING MBB SHORTING 14.20 [.559 in] HARDWARE SUPPIED ON SWITCH 2.00 [.079 in] 8.00 [.315 in] n26.00 [1.024 in] 30.00 [1.181 in] .5 n ] 27 83 i .0 [1 n6.35 [.250] 5.50 [.217 in] FLAT n3.00 [.118 in] 30.0°

GT25H101

Abstract: GT25H Opto Speed SA
Contextual Info: TOSHIBA {DIS CR ETE/O PT O! 90D 9097250 TOSHIBA DISCRETE/OPTO TOSHIBA D E_| ciO,:17BSD D D l b l ñ ? TD SEMICONDUCTOR 16187 1 D T - 3 3 ' ^ 3 TOSHIBA INSULATED GATE BIPOLAR TRANSISTOR GT25H101 TECHNICAL DATA SILICON N-CHANNEL MOS TYPE HIGH POWER SWITCHING APPLICATIONS.

Contextual Info: TSMF1000/1020/1030/1040 VISHAY Vishay Semiconductors High Speed IR Emitting Diode in SMD Package Description TSMF1000 TSMF1000 series are high speed infrared emitting diodes in GaAlAs/GaAs/GaAlAs double hetero technology DH molded in clear SMD package with dome

ms27217-2

Abstract: MS27217-1 MS27217 SPECIALTY SWITCH MS25476-1 16-4034 16-488051 MIL-S-8805
Contextual Info: b a s i c s n a p - a c t i o n s w i t c h e s Type 16 – Sub-Miniature, 10.1 Amp Typical Applications – Lift truck seat switch – Aircraft contactors – Basic switches for pushbutton switch assemblies – Basic switches for thermal switching units – Basic switches for specialty switch products

SKIIP 33 nec 125 t2

Abstract: skiip 613 gb 123 ct RBS 6302 ericsson SKIIP 513 gb 173 ct THERMISTOR ml TDK 150M pioneer PAL 010a Project Report of smoke alarm using IC 555 doc SKiip 83 EC 125 T1 ericsson RBS 6000 series INSTALLATION MANUAL Ericsson Installation guide for RBS 6302
Contextual Info: Discontinued and Superseded Stock Number History. This document contains Discontinued and Superseded Stock Number History. The information is listed in the following format: Stock Number: The original RS Stock Number of the item. Brief Description: The Invoice Description of the item.

GIGABYTE G41

Abstract: SIEMENS BST p49 SIEMENS BST P 61 33f MPC 68020 marking code WM4 C-16 MC68360 xpc860e schematic LG lcd power supply unit mpc860 powerPC
Contextual Info: MPC860 PowerQUICC User’s Manual Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and

MS27217-1

Contextual Info: SNAP ACTION SWITCHES SUB-MINIATURE 10.1 AMP DOUBLE-BREAK SNAP ACTION SWITCHES Series 16 switches feature the Butterfly doublebreak momentary switch mechanism. This offers the capability of handling high or low current loads in a small switch and gives the options of

PSE 16-201

Abstract: pin diagram for core i3 processor 82489dx i3 processor pin diagram for core i7 processor i3 i5 i7 processor core i3 addressing modes pin diagram i3 processor pin configuration of i3 processor intel CORE i3 instruction set
Contextual Info: Component Operation 16 The embedded Pentium processor has an optimized superscalar micro-architecture capable of executing two instructions in a single clock. A 64-bit external bus, separate data and instruction caches, write buffers, branch prediction, and a pipelined floating-point unit combine to sustain the