160UM Search Results
160UM Price and Stock
Phoenix Contact 2200160 (UM-PRO 122 FOOT BK)ENCLOSURES, UM-PRO 122 FOOT BK |
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2200160 (UM-PRO 122 FOOT BK) | Bulk | 10 | 1 |
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Fairchild Semiconductor Corporation FM25C160UM8EEPROM 16kbit 2k x 8 4.5V - 5.5V SPI 2.1MHz 10ms 8-SOIC Rail |
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FM25C160UM8 | 1,567 | 1 |
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Sugatsune Kogyo Co Ltd BTK-UB160UMUB BRACKET UMBER 12-12 55L |
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BTK-UB160UM |
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160UM Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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ic 8259
Abstract: OPB0642 opb064
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opb0642160um000lux2856k+3 | |
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Contextual Info: OPD3030 Silicon PIN Photo Diode HIGH SPEED SENSITIVITY 1. Structure 1.1 Chip Size : 3.00mm X 3.00mm 1.2 Chip thickness : 400 20um 1.3 Metallization : Top - Al, Bottom - Au 1.4 Passivation : Silicon Oxide 1.5 Bonding Pad Size - Anode top : 160um X 160um 1.6 Active Area : 2.86mm X 2.86mm |
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opd3030160um000lux | |
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Contextual Info: Silicon Photo Transistor OPB0642 1. Structure 1.1 Chip Size : 0.62mm X 0.42mm 1.2 Chip thickness : 220 30um 1.3 Metallization : Top - Al, Bottom - Au 1.4 Passivation : Silicon Nitride 1.5 Bonding Pad Size - Emitter : 160um : Emitter Electrode : Base Electrode |
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opb0642160um000lux2856k+1 | |
OPD3030
Abstract: ir10
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opd3030160um000luxir10 | |
Asp1251
Abstract: J-STD-020 SAC305 land pattern for WLCSP RCN310 ASPIC320 ism Transceiver SAC305 reflow system in package SAC305 reflow csp IPD filter IPDiA filter
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100nftd431111615116asp1251j-std-020 sac305+8 | |
FMM5826X
Abstract: Ka-band ED-4701
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fmm5826x37dbm1906bka-band+1 | |
gl 9608Contextual Info: FMM5820X Ka-Band Power Amplifier MMIC FEATURES •High Output Power; Pout = 35.5 dBm Typ. •High Linear Gain; GL = 24 dB(Typ.) •Frequency Band ; 29.5 - 30.0 GHz •Impedance Matched Zin/Zout = 50Ω DESCRIPTION The FMM5820X is a power amplifier MMIC that contains a fourstages amplifier, internally matched, for standard communications |
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fmm5820x1906bgl 9608 | |
gs32
Abstract: Maruwa substrate amorphous head AS970 maruwa network resistor
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110160mmax430mgs32maruwa substrate+4 | |
sem 5025
Abstract: gs 31 thermal printer head Al2O3 HA-96-2 AS970 amorphous head laser cutting circuit drilling machine applications
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sem 5025gs 31thermal printer headal2o3+5 | |
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Contextual Info: 1C Foundry Facilities/Capabilities Features • MBE and Ion Implant Technologies • Three Optimized Processes HI2 - Low N oise/H igh Efficiency SI1 - Switch/Low Loss PE3 - Pow er/H igh Efficiency • Power and Low Noise On a Single Wafer • Design Service Available |
OCR Scan |
mil-883 | |
ZENER Vr 3V
Abstract: Zener Diode 3v zener- diode WT-Z111N
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wt-z111n160umzener vr 3vzener diode 3v+1 | |
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Contextual Info: Yellow Green LED Chip OPA5615H GaP/GaP 1. Material Substrate GaP Epitaxial Layer GaP 2. Electrode N Cathode Side Gold Alloy P(Anode) Side Gold Alloy 3. Electro-Optical Characteristics Parameter (N Type) (P/N Type) Symbol Min Forward Voltage Typ Unit Condition |
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opa5615h13mil14mil160um+1 | |
32 v dc 1500ma
Abstract: ka-band amplifier ED-4701 FMM5820X EIAJ ED-4701 305 chip 7490 power amplifier mmic gl 9608
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fmm5820x1906b32 v dc 1500maka-band amplifier+5 | |
ac-rx
Abstract: MTU410
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mtu410ph11-15ac-rx | |
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Contextual Info: ES/EMM5075X Preliminary Ku-Band Power Amplifier MMIC FEATURES ・High Output Power: Pout=33.0dBm typ. ・High Linear Gain: GL=26.0dB (typ.) ・Broad Band: 12.7~15.4GHz ・Impedance Matched Zin/Zout=50Ω DESCRIPTION The ES/EMM5075X is a MMIC amplifier that contains a three-stage |
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es/emm5075x | |
EMM5834X
Abstract: 7313 28 pin pin diagram of 8355 04482 an 7073 Eudyna Devices X BAND power amplifiers ED-4701 1380um
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emm5834x1906b7313 28 pinpin diagram of 8355+5 | |
FMM5063X
Abstract: "ku band" amplifier Eudyna Devices power amplifiers 5KW* GHZ ED-4701
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fmm5063x1906bku band" amplifiereudyna devices power amplifiers+2 | |
EMM5075Contextual Info: EMM5075X Ku-Band Power Amplifier MMIC FEATURES High Output Power: Pout=33.0dBm typ. High Linear Gain: GL=26.0dB (typ.) Broad Band: 12.7~15.4GHz Impedance Matched Zin/Zout=50 DESCRIPTION The EMM5075X is a MMIC amplifier that contains a three-stages amplifier, internally matched, for standard communications band in the |
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emm5075xemm5075 | |
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Contextual Info: OPA5615N Yellow Green LED Chip GaP/GaP N Side-Up 1. Material Substrate GaP Epitaxial Layer GaP 2. Electrode N Cathode Side Gold Alloy P(Anode) Side Gold Alloy 3. Electro-Optical Characteristics Parameter (P Type) (N/P Type) Symbol Min Forward Voltage Typ |
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opa5615n13mil14mil160um+1 | |
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Contextual Info: FMM5063X Ku-Band Power Amplifier MMIC FEATURES •High Output Power; P1dB = 32.0 dBm Typ. •High Linear Gain; GL = 30 dB(Typ) •Wide Frequency Band : 12.75 - 15.4 GHz •Impedance Matched Zin/Zout = 50Ω DESCRIPTION The FMM5063X is a power amplifier MMIC that contains a three |
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fmm5063x | |
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Contextual Info: ES/EMM5075X Preliminary Ku-Band Power Amplifier MMIC FEATURES High Output Power: Pout=33.0dBm typ. High Linear Gain: GL=26.0dB (typ.) Broad Band: 12.7~15.4GHz Impedance Matched Zin/Zout=50 ✁ DESCRIPTION The ES/EMM5075X is a MMIC amplifier that contains a three-stage |
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es/emm5075x | |
FANUC POWER SUPPLY
Abstract: AC200 B360 C360 PV20 air bearing convex lens
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0500mm/min500mgfr41mmr45mm+7 | |
DBM28
Abstract: ED-4701 FMM5823X power amplifier mmic
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fmm5823x1906bdbm28ed-4701+1 | |
14MILContextual Info: Yellow Green LED Chip OPA5615H GaP/GaP 1. Material Substrate GaP Epitaxial Layer GaP 2. Electrode N Cathode Side Gold Alloy P(Anode) Side Gold Alloy 3. Electro-Optical Characteristics Parameter (N Type) (P/N Type) Symbol Min Forward Voltage Typ Unit Condition |
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opa5615h13mil14mil160um+1 | |