16 PIN IC 810 Search Results

5 PEN PC TECHNOLOGY advance

Contextual Info: ADVANCE M IC R O N 16 MEG X MT9D169 9 DRAM M OD ULE 16 MEG x 9 DRAM FAST PAGE MODE FEATURES PIN ASSIGNMENT Top View • Industry standard pinout in a 30-pin single-in-line package • High-performance, CM OS silicon-gate process • Single 5V ±10% power supply

transistor D613 equivalent

Abstract: AD2S80ATE
Contextual Info: A N A LO G D E V IC E S F E A TU R E S M onolithic B iM O S II Tracking R/D Converter 40-Pin DIP Package 44-Pin LCC Package 10-, 12-, 14- and 16-Bit Resolution Set by User Ratiom etric Conversion Low Pow er Consum ption: 300 m W typ D ynam ic Perform ance Set by User

PIC16C51

Contextual Info: PIC16C5X M ic r o c h ip EPROM/ROM-Based 8-Bit CMOS Microcontroller Series Pin Diagrams Devices Included in this Data Sheet • PIC16C54 PDIP, SOIC, Windowed CERDIP • P IC 16 C R 5 4 ^ ►RA1 Æ- • PIC16C55 RA2-«- > • PIC16C56 RA3-«- >

Contextual Info: P r e l im in a r y P r o d u c t S p e c if ic a tio n c % \ Z 8 7 0 1 0 /Z 8 7 L 1 0 A u d io E n c o d e r / D e c o d e r s FEATURES Device ROM Kbyte I/O Lines Package Information Z87010 4 16 Z87L10 4 44-Pin PLCC 44-Pin QFP 44-Pin QFP 16 Hardware •

aaav

Contextual Info: [M IC R O N 32K X MT2S3216 16 SRAM MODULE 32Kx 16 SRAM SRAM MODULE FEATURES PIN ASSIGNMENT Top View • High speed: 20*, 25 and 30ns • High-performance, low-power CMOS double-metal process • Single +5V ±10% power supply • Easy memory expansion with CE and OE functions

Contextual Info: ADVANCE M IC R O N 16 MEG DRAM MODULE X MT9D169 9 DRAM MODULE 16 MEG x 9 DRAM FEATURES • Industry standard pinout in a 30-pin single-in-line package • High-performance, CMOS silicon-gate process • Single 5V ±10% power supply • All device pins are fully TTL compatible

Hongfa Relay HFD2

Abstract: Telecom Relays latching relays pcb set coil reset coil hfd2 relay 40VA 8 pin relay 30vdc Hongfa Relay relay 220vdc 10a 105OPS E133481
Contextual Info: HFD2 SUBMINIATURE DIP RELAY Features •2 Form C contact,Polarized relay • High • Fits sensitivity 150mW standard 16 pin IC socket • High switching capacity 60W,125VA • Epoxy and cleaning File No.:E133481 COIL CONTACT DATA 50m Initial Contact Resistance

Contextual Info: M IC R Q N I 8, 16 MEG x 72 SDRAM DIMMs TECHNOLOGY, INC. MT9LSDT872A, MT18LSDT1672A SYNCHRONOUS DRAM MODULE For the latest data sheet revisions, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html FEATURES PIN ASSIGNMENT Front View

Contextual Info: ADVANCE MT9LD272A X , MT18LD472A(X) 2, 4 MEG X 72 DRAM MODULES I^ IC R O fV I DRAM MODULE 2, 4 MEG x 72 16, 32 MEGABYTE, ECC, NONBUFFERED, 3.3V, 8 CAS, FAST PAGE OR EDO PAGE MODE FEATURES PIN ASSIGNMENT (Front View) • Eight CAS, ECC pinout in a 168-pin, dual-in-line

tc 97101

Abstract: D472
Contextual Info: ADVANCE M IC B D N I ' I 4 MEG BURST EDO DRAM MODULE MT9LD272 B N , MT18LD472 B(N) 72 BURST ED0 DRAM MODULES 2, 4 MEG X 72 16, 32 MEGABYTE, 3.3V, ECC, BURST EDO FEATURES • • • • • • • • • 168-pin, dual-in-line memory module (DIMM) ECC pin-out

Contextual Info: CXG1097EN Low Noise Amplifier with Bypass Switch/Mixer Description The CXG1097EN is a dual mode low noise amplifier with a bypass switch/ mixer MMIC for Japan CDMA cellular. This IC is designed using the Sony's GaAs J-FET process. 16 pin VSON Plastic Features

16PIN

Abstract: CXG1097EN
Contextual Info: CXG1097EN Low Noise Amplifier with Bypass Switch/Mixer Description The CXG1097EN is a dual mode low noise amplifier with a bypass switch/ mixer MMIC for Japan CDMA cellular. This IC is designed using the Sony's GaAs J-FET process. 16 pin VSON Plastic Features

AD2S46

Abstract: twist drc1745 ujt operation of principle drc1746
Contextual Info: Low Cost, 16-Bit Synchro/ Resolver-to-Digital Converter ANALOG DEVICES FEATURES 1.3 Arc M in u te Accuracy 16-B it R esolution S m all 28-Pin C eram ic DIP L o w Cost T he device incorporates a high accuracy differential conditioning circuit for signal inputs providing m ore than 74 dB of com m on­

16PIN

Abstract: CXG1097EN
Contextual Info: CXG1097EN Low Noise Amplifier with Bypass Switch/Mixer Description The CXG1097EN is a dual mode low noise amplifier with a bypass switch/ mixer MMIC for Japan CDMA cellular. This IC is designed using the Sony's GaAs J-FET process. 16 pin VSON Plastic Features

L9150

Abstract: 16PIN CXG1109EN
Contextual Info: CXG1109EN Receive Dual Low Noise Amplifier/Mixer Description The CXG1109EN is a receive dual low noise amplifier/ mixer MMIC. This IC is designed using the Sony’s GaAs J-FET process. 16 pin VSON Plastic Features • High conversion gain: Gp = 16.5 to 17dB (LNA Typ.)

16PIN

Abstract: CXG1109EN
Contextual Info: CXG1109EN Receive Dual Low Noise Amplifier/Mixer Description The CXG1109EN is a receive dual low noise amplifier/ mixer MMIC. This IC is designed using the Sony’s GaAs J-FET process. 16 pin VSON Plastic Features • High conversion gain: Gp = 16.5 to 17dB (LNA Typ.)

Hongmei Relay

Abstract: HFD2 datasheet for 14 PIN 120VAC relay relay 1A 125VAC 2A 30VDC 003-M-L1 851A 024-S 2A30VDC
Contextual Info: HONGMEI RELAY SUBMINIATURE DIP RELAYS 2 Form C HFD2 150mW • 2 Form C contact • High sensitivity 150 mW • Fits standard 16 pin IC socket • High switching capacity 60W,125VA • Epoxy sealed for automatic wave soldering and cleaning • Single side stable and latching type is available

ad7507kd

Abstract: AD7507SD AD7506SD AD7506JN 400S AD7506 AD7507 AD7507JN ad7506jd
Contextual Info: ANALOG DEVICES INC 11 AN ALO G D EV IC ES c i | DaibBOO DD1341C1 3 | ~ CMOS 8-and 16-Channel Analog Multiplexers AD7506/AD7507 FEA TU RES Rom ! 30012 Power Dissipation: 1.5mW TTL/DTL/CMOS Direct Interface . Break-Before-Make Switching Standard 28-Pin DIPs and 28-Terminal Surface

Contextual Info: P r e l im in a r y P r o d u c t S p e c if ic a t io n Z89321/371/391 16- B it D ig it a l S ig n a l P r o c e s s o r s FEATURES Device DSP ROM KW Z89321 4 OTP (KW) Z89371 Z89391 4 64* DSP RAM (Words) MIPS (Max) Device 40-Pin DIP 44-Pin PLCC 44-Pin QFP

Contextual Info: P r e l im in a r y P r o d u c t S p e c if ic a t io n Z89321/371/391 16- B it D ig it a l S ig n a l P r o c e s s o r s FEATURES Device DSP ROM KW Z89321 4 Z89371 Z89391 OTP (KW) 4 64* DSP RAM Lines MIPS (Max) Device 40-Pin DIP 44-Pin PLCC 44-Pin QFP

HFD2/005-M

Abstract: Hongmei Relay HFD2 datasheet for 14 PIN 120VAC relay 003-M-L1 HFD2/24-M(210)(257) hfd2 relay 72/015-S-L2
Contextual Info: HONGMEI RELAY HFD2 SUBMINIATURE DIP RELAYS 2 Form C HFD2 150mW • 2 Form C contact • High sensitivity 150 mW • Fits standard 16 pin IC socket • High switching capacity 60W,125VA • Epoxy sealed for automatic wave soldering and cleaning • Single side stable and latching type is available

h995

Contextual Info: ADVANCE M IC R O N 1 M T9LD 272 B N , M T18LD 472 B(N) 2, 4 MEG X 72 B U R S T EDO DRAM M O D U LE S BURST EDO DRAM MODULE 2, 4 MEG X 72 16, 32 MEGABYTE, 3.3V, ECC, BURST EDO FEATURES • • • • • • • • • 168-pin, dual-in-line m em ory m odule (DIMM)

FX003QZ

Abstract: M83T oa 1160 FX003QC FX003QE ZVEI Tone decoder FX-003-QZ
Contextual Info: ~ r-i5 -2 1 -0 5 P R E L IM IN A R Y IN F O R M A T IO N 1 2 3 4 5 6 P U B L IC A T IO N D /2 2 4 PIN FUNCTIONS 23kHz clock out 9 03 O s e .o u t 10 Q2 O s e .in 11 Q1 Vss 1 2 Oo HOLD 13 V d d Po wer up reset 14 S i g n a l 7 8 Data 15 16 •k change *Connected

la TRANSISTOR SMD MARKING CODE

Abstract: MARKING SMD IC CODE HL
Contextual Info: T h a t HEW LETT PACKARD rn L 'fiM Herm etically Sealed, High Speed, High CMR, Logic Gate Optocouplers 6N134* 81028 HCPL-563X HCPL-663X Technical Data HCPL-665X 5962-90855 HCPL-560X * S ee m a tr ix fo r a v a ila b le e x te n s io n s . Features • Dual Marked w ith D evice