153 TSS Search Results

14558

Abstract: LT1782 LT1783 LT1784 9934
Contextual Info: RELIABILITY DATA LT1782 / LT1783 / LT1784 8/21/2006 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE SOIC/SOT/MSOP 153 9940 153 • PRESSURE COOKER TEST AT 15 PSIG, +121°C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP SSOP/TSSOP 1,342 50 1,392 • TEMP CYCLE FROM -65°C to +150°C

JEDEC MO-153

Abstract: MO153 44mm MO-153
Contextual Info: 4 5.00±0.10 4.55 5.90 4.45 7.35 4.4±0.1 0.65 1.45 5.00 0.11 12° MTC16rev4 16LD, TSSOP, JEDEC MO-153, 4.4MM WIDE

BiCD-0

Abstract: TX4939XBG-400 TX4939 DDR400 EN60747-5-2 TB62737FUG TLP261J TLP361J TSSOP14 NAND Flash part number toshiba
Contextual Info: TOSHIBA SEMICONDUCTOR BULLETIN EYE APRIL 2005 VOLUME 153 CONTENTS New Products White LED Driver 6-Pin MFSOP Photo Triac

JEDEC MO-153

Abstract: MTC16
Contextual Info: Revised January 1999 Package MTC16 16-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 4.4mm Wide Package Number MTC16 1999 Fairchild Semiconductor Corporation mtc16.prf www.fairchildsemi.com Package MTC16 January 1999

JEDEC MO-153

Abstract: MTD56
Contextual Info: Revised January 1999 Package MTD56 56-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 6.1mm Wide Package Number MTD56 1999 Fairchild Semiconductor Corporation mtd56.prf www.fairchildsemi.com Package MTD56 January 1999

JEDEC MO-153

Abstract: MTC24 MO-153
Contextual Info: Revised January 1999 Package MTC24 24-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 4.4mm Wide Package Number MTC24 1999 Fairchild Semiconductor Corporation mtc24.prf www.fairchildsemi.com Package MTC24 January 1999

jedec MO-153

Abstract: MO-153 98ARH98352A MO153
Contextual Info: AA FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. MECHANICAL OUTLINE TITLE: 30 LD. TSSOP, PITCH 0.50MM PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARH98352A REV: B CASE NUMBER: 1294-01 20 MAY 2005 STANDARD: JEDEC MO-153 DETAIL ”E” 0.22 SECTION B - B

JEDEC MO-153

Abstract: MO-153-BD-1 MO-153BD-1
Contextual Info: Plastic Packages for Integrated Circuits Thin Shrink Small Outline Plastic Packages TSSOP M38.173 N INDEX AREA E 0.25(0.010) M E1 2 INCHES GAUGE PLANE -B1 38 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-153-BD-1 ISSUE F) B M SYMBOL

LT1567

Abstract: LT1568 8549
Contextual Info: RELIABILITY DATA LT1567 / LT1568 / LT6600 8/21/2006 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE SIDEBRAZE SOIC/SOT/MSOP 153 0213 70 0201 223 • PRESSURE COOKER TEST AT 15 PSIG, +121°C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP SSOP/TSSOP

MK6006GAH

Abstract: MK3006GAL mcd-d50 D33003 DDK mcd Connectors MCD-D50P MCD-D50SA-3 HDD1442 MK4006GAH EG 8010
Contextual Info: 1.1.1.1.1.1.1.1 TOSHIBA TOSHIBA Hard Disk Drive Specification 1.8 inch Hard Disk Drive MK6006GAH/MK4006GAH /MK3006GAL Rev. 01 REF 360050398 Toshiba Corporation Digital Media Network Company Page 1 of 153 2003, Copyright TOSHIBA Corporation All Rights Reserved

vme bus specification

Abstract: D2316 IDT73720 VME64
Contextual Info: USING THE IDT73720 BUS EXCHANGER IN A VME64 DESIGN APPLICATION NOTE AN-153 Integrated Device Technology, Inc. By David P. D’Aurelio, Eastman Kodak Company and Dean Smith, Integrated Device Technology INTRODUCTION Many system designers that deal with very large quantities

JEDEC MO-153

Abstract: e 430
Contextual Info: ISSI PACKAGING INFORMATION Thin Shrink Small Outline TSSOP Package Code: Z N E H α 1 A1 D A2 e B TSSOP Z Ref. Std. JEDEC MO-153 No. Leads 8 Millimeters Inches Symbol Min Max Min Max A — 1.20 — 0.047 A1 0.05 0.15 0.002 0.006 A2 0.80 1.05 0.032 0.041

100MHZ

Abstract: 133MHZ WED3DL644V
Contextual Info: White Electronic Designs WED3DL644V 4Mx64 SDRAM FEATURES DESCRIPTION The WED3DL644V is a 4Mx64 Synchronous DRAM configured as 4x1Mx64. The SDRAM BGA is constructed with four 4Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 153 lead, 17mm by

MTC08

Contextual Info: Revised January 2002 Package MTC08 8-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 4.4mm Wide Package Number MTC08 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.

MTD64

Contextual Info: Revised April 2002 Package MTD64 64-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 6.1mm Wide Package Number MTD64 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.

MTD48

Contextual Info: Revised August 2000 Package MTD48 48-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 6.1mm Wide Package Number MTD48 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.

MTC20

Contextual Info: Revised August 2000 Package MTC20 20-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 4.4mm Wide Package Number MTC20 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.

100MHZ

Abstract: 133MHZ WED3DL644V
Contextual Info: White Electronic Designs WED3DL644V 4Mx64 SDRAM FEATURES DESCRIPTION The WED3DL644V is a 4Mx64 Synchronous DRAM configured as 4x1Mx64. The SDRAM BGA is constructed with four 4Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 153 lead, 17mm by

MO-153

Abstract: JEDEC MO-153 MO-153-AE JEDEC TSSOP 28 LEAD PACKAGE coplanarity RU-28
Contextual Info: 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28 Dimensions shown in millimeters a 9.80 9.70 9.60 28 15 4.50 4.40 4.30 1 6.40 BSC 14 PIN 1 0.15 0.05 COPLANARITY 0.10 0.65 BSC 0.30 0.19 1.20 MAX SEATING PLANE 0.20 0.09 8° 0° COMPLIANT TO JEDEC STANDARDS MO-153-AE

Contextual Info: White Electronic Designs WED3DL644V 4Mx64 SDRAM FEATURES DESCRIPTION The WED3DL644V is a 4Mx64 Synchronous DRAM configured as 4x1Mx64. The SDRAM BGA is constructed with four 4Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 153 lead, 17mm by

MTC14

Contextual Info: Revised August 2000 Package MTC14 14-Lead Thin Shrink Small Outline Package TSSOP , JEDEC MO-153, 4.4mm Wide Package Number MTC14 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.

Contextual Info: Package Information Vishay Siliconix TSSOP: 8-LEAD POWER IC ONLY JEDEC Part Number: MO-153 R 0.10 Corners) e A1 A A2 D 0.25 (Gage Plane) E1 MILLIMETERS E C B Document Number: 72803 28-Jan-04 L R 0.10 (4 Corners) L1 oK1 Dim A A1 A2 B C D E E1 e L L1 Y oK1

JEDEC MO-153

Contextual Info: ISSI PACKAGING INFORMATION Thin Shrink Small Outline TSSOP Package Code: Z 8 pin, 14 pin N E1 1 E α N/2 A1 D A2 A L C e B TSSOP (Z) Ref. Std. JEDEC MO-153 No. Leads 8 Millimeters Inches Symbol Min Max Min Max A — 1.20 — 0.047 A1 0.05 0.15 0.002 0.006

Contextual Info: White Electronic Designs WED3DL644V 4Mx64 SDRAM FEATURES DESCRIPTION The WED3DL644V is a 4Mx64 Synchronous DRAM configured as 4x1Mx64. The SDRAM BGA is constructed with four 4Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 153 lead, 17mm by