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77311-102T17LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch. |
PDF
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20021111-02016T1LF
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Amphenol Communications Solutions
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Minitek127®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions, 1.27mm (0.050in) pitch. |
PDF
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10114829-11102LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer, Vertical, Through Hole, 2 Positions |
PDF
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77311-102S02LF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board, Unshrouded Header, 2.54 mm Pitch, Vertical, Single Row,Through Hole, 2 positions. |
PDF
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77311-102S16LF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board, Unshrouded Header, 2.54 mm Pitch, Vertical, Single Row,Through Hole, 5 positions. |
PDF
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