144 PIN QFP Search Results

Contextual Info: QUAD FLAT L-LEADED PACKAGE 144 PIN CERAMIC FPT-144C-C02 144-pin ceramic QFP Lead pitch 0.50mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50mm Ceramic material Alumina Mounting height 2.0mm MAX FPT-144C-C02 144-pin ceramic QFP

FPT-144P-M05

Contextual Info: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M05 144-pin plastic QFP Lead pitch 0.50mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold Mounting height 2.45mm MAX FPT-144P-M05 144-pin plastic QFP (FPT-144P-M05)

QFP144

Abstract: QFP144-P-2020-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M03 EIAJ code : ∗QFP144-P-2020-1 144-pin plastic QFP Lead pitch 0.50mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M03 144-pin plastic QFP (FPT-144P-M03)

QFP 144 PACKAGE

Abstract: QFP144-P-2828-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M01 EIAJ code : ∗QFP144-P-2828-1 144-pin plastic QFP Lead pitch 0.65mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M01 144-pin plastic QFP (FPT-144P-M01)

QFP 144 PACKAGE

Contextual Info: QUAD FLAT L-LEADED PACKAGE 144 PIN CERAMIC FPT-144C-C01 144-pin ceramic QFP Lead pitch 0.65mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80mm Base ceramic material Alumina FPT-144C-C01 144-pin ceramic QFP (FPT-144C-C01) 3.30(.130) (Mounting height)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN CERAMIC FPT-144C-C01 144-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80 mm Base ceramic material Alumina FPT-144C-C01 144-pin ceramic QFP

Contextual Info: QFP Multiadapter 144 RE471 - Epoxyd FR4 1,50 mm, zweiseitig CU durchkontaktiert - Oberfläche chem. AU - Zwei universelle QFP Layouts für verschiedene Gehäusegrößen und Pin- Anzahl: LQFP; PQFP; TQFP Layer 1 24 - 144 pin, 0,50 mm pitch, sq. Layer 2 24 - 144 pin, 0,65 mm pitch, sq.

QFP144

Abstract: QFP Package 144 lead QFP144-P-2828-2
Contextual Info: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M02 EIAJ code : ∗QFP144-P-2828-2 144-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M02 144-pin plastic QFP (FPT-144P-M02)

RE472

Abstract: 15-poli-ge
Contextual Info: QFP Multiadapter 240 RE472 - Epoxyd FR4 1,50 mm, zweiseitig CU durchkontaktiert - Oberfläche chem. AU - Zwei universelle QFP Layouts für verschiedene Gehäusegrößen und Pin- Anzahl: LQFP; PQFP; TQFP Layer 1 144 - 240 pin, 0,50 mm pitch, sq. Layer 2 144 - 240 pin, 0,65 mm pitch, sq.

FPT-144P-M05

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC To Top / Package Lineup / Package Index FPT-144P-M05 144-pin plastic QFP Lead pitch 0.50 mm Package width x package length 20 × 20 mm Lead shape Gullwing Sealing method Plastic mold

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN CERAMIC To Top / Package Lineup / Package Index FPT-144C-C02 144-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Ceramic material

QFP 144 PACKAGE

Abstract: QFP Package 144 lead
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN CERAMIC To Top / Package Lineup / Package Index FPT-144C-C01 144-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80 mm Base ceramic

frequency hopping spread spectrum

Abstract: spread spectrum receiver circuity TDD synchronizer cordless phone "control signals" cordless phone Transceiver IC direct sequence spread spectrum P115 Z87000 Z87001 Z87010
Contextual Info: PRELIMINARY CUSTOMER PROCUREMENT SPECIFICATION 1 Z87001/Z87L01 1 ROMLESS SPREAD SPECTRUM CORDLESS PHONE CONTROLLER FEATURES Device ROM * KWords Z87001 Z87L01 64 64 RAM I/O (Words) Lines 512 512 32 32 Package Information • 144-Pin QFP 144-Pin QFP Note: *Maximum accessible external ROM

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN CERAMIC FPT-144C-C02 144-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Ceramic material Alumina Mounting height 2.0 mm MAX

QFP144-P-2020-1

Abstract: QFP144 QFP144-P-2020 SQ108
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC To Top / Package Lineup / Package Index FPT-144P-M03 EIAJ code :∗QFP144-P-2020-1 144-pin plastic QFP Lead pitch 0.50 mm Package width x package length 20 × 20 mm Lead shape Gullwing

QFP 144 PACKAGE

Abstract: QFP144-P-2828-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC To Top / Package Lineup / Package Index FPT-144P-M01 EIAJ code :∗QFP144-P-2828-1 144-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing

QFP144-P-2828-2

Abstract: qfp144p
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC FPT-144P-M02 EIAJ code :∗QFP144-P-2828-2 144-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M02

QFP144-P-2828-1

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC FPT-144P-M01 EIAJ code :∗QFP144-P-2828-1 144-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M01

QFP144-P-2020-1

Abstract: FPT-144P-M03 QFP144 qfp144p
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC FPT-144P-M03 EIAJ code :∗QFP144-P-2020-1 144-pin plastic QFP Lead pitch 0.50 mm Package width x package length 20 × 20 mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M03

epoxy resin

Contextual Info: QFP Multiadapter 144 RE471 - EPOXY resin FR4 1.50 mm double-sided 35 µm CU pth - chem. NI/AU - Two universal QFP layouts for various housing sizes and pin numbers: LQFP; PQFP; TQFP Layer 1 24 to 144 pins, 0.50 mm pitch, sq. Layer 2 24 to 144 pins, 0.65 mm pitch, sq.

AE23

Abstract: AF23 EP20K60E
Contextual Info: EP20K60E I/O Pins ver. 1.2 I/O & VREF Bank Pad Pin/Pad Function Number Orientation 144-Pin 208-Pin 240-Pin 144-Pin TQFP 1 PQFP (1) PQFP (1) FineLine BGA 324-Pin FineLine BGA 356-Pin BGA 8 8 8 8 – 8 8 8 8 8 – 8 – – – 8 8 – 8 8 8 8 8 – – 8

T25 4 h5

Abstract: AE23 AF23 EP20K60E 356-pin 215 bga BGA128
Contextual Info: EP20K60E I/O Pins ver. 1.1 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 – Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin 356-Pin FineLine BGA FineLine BGA BGA 1 2 3 4 5 6 7 8 9 10 11 12 13 – –

DSPB56720AG

Abstract: NMI120 DSP DTS DSP56300 DSP56720 DSP56721 DSPA56720AG PH41
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: DSP56720 Rev.1, 12/2007 DSP56720 / DSP56721 DSP56720 144-Pin LQFP 20 mm x 20 mm 0.5 mm pitch SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors 144-Pin LQFP 20 mm x 20 mm 0.5 mm pitch

NMI120

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: DSP56720 Rev. 4, 04/2008 DSP56720 / DSP56721 DSP56720 144-Pin LQFP 20 mm x 20 mm 0.5 mm pitch SymphonyTM DSP56720 / DSP56721 Multi-Core Audio Processors 144-Pin LQFP 20 mm x 20 mm 0.5 mm pitch