Part Number
    Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    1427MM Search Results

    SF Impression Pixel

    1427MM Price and Stock

    Apex Tool Group LLC

    Apex Tool Group LLC SZ-14-27MM

    Bit 7/8 Hex Ins 27Mm Ml Hex 2" Oal; |Apex SZ-14-27MM
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark SZ-14-27MM Bulk 25
    • 1 -
    • 10 -
    • 100 $165.47
    • 1000 $154.61
    • 10000 $154.61
    Buy Now

    Apex Tool Group LLC SZ-8-14-27MM

    Bit 1" Sq Dr 27Mm Ml Hex 3.251" Oal; |Apex SZ-8-14-27MM
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark SZ-8-14-27MM Bulk 25
    • 1 -
    • 10 -
    • 100 $190.26
    • 1000 $190.26
    • 10000 $190.26
    Buy Now

    1427MM Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    ht 13003

    Abstract: LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e HT 1000-4 amp 12011p 87c196
    Contextual Info: Correct-A-Chip Adapters DIP-to-JEDEC TO Adapter Socket – www.arieselec.com/products/18012.pdf Correct-A-Chip™ with Collet Contacts – www.arieselec.com/products/18003.pdf SOIC-to-JEDEC TO Adapter – www.arieselec.com/products/18013.pdf Series 350000-HT High-Temperature


    Original
    com/products/18012com/products/18003com/products/18013350000-ht+16com/products/18005com/products/18013rc35w000com/products/18007com/products/1801435w000-11-rcht 13003lcd 16002aromat relay hb2eht 1200-4hb2emotorola 13003aromat hb2eht 1000-4 amp12011p87c196 PDF

    1720G

    Contextual Info: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to


    Original
    device171720g PDF

    Contextual Info: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to


    Original
    PDF

    Contextual Info: TELEPRESENCE SERIES BrightCom’s Lumina Telepresence series is the next step in telecommunication technology. Offering fully integrated HD video and data conferencing solutions, Lumina Telepresence delivers a complete immersive conference experience. With the natural feeling of face to face


    Original
    50-60hz4579mm1427mm10mbit PDF

    Contextual Info: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to


    Original
    device17 PDF