14 LEAD FLATPACK Search Results

Contextual Info: 3.0 ORDERING INFORMATION RadHard MSI - 14-Lead Packages: Military Temperature Range UT54 * * - * * * * Lead Finish: A = Solder (C) = Gold (X) = Optional Screening: (C) = Mil Temp Package Type: (P) = 14-lead ceramic side-brazed DIP (U) = 14-lead ceramic bottom-brazed dual-in-line Flatpack

smd cross reference

Abstract: dual flatpack 8
Contextual Info: 3.0 ORDERING INFORMATION RadHard MSI - 14-Lead Packages: Military Temperature Range UT54 * * - * * * * Lead Finish: See Notes 1 and 2 (A) = Solder (C) = Gold (X) = Optional Screening: (See Note 3) (C) = Mil Temp Package Type: (P) = 14-lead ceramic side-brazed DIP

UT54ACS04

Abstract: UT54ACTS04
Contextual Info: UT54ACS04/UT54ACTS04 Radiation-Hardened Hex Inverters FEATURES PINOUTS 14-Pin DIP Top View radiation-hardened CMOS - Latchup immune High speed Low power consumption Single 5 volt supply Available QML Q or V processes Flexible package - 14-pin DIP - 14-lead flatpack

A101

Abstract: A144
Contextual Info: Package Diagrams Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 51-85063-B 44-Lead Thin Plastic Quad Flat Pack A44 51-85064-B 1 Package Diagrams 64-Pin Thin Plastic Quad Flat Pack 10 x 10 x 1.4 mm A64 51-85051-A 64-Lead Thin Plastic Quad Flat Pack (14 x 14 x 1.4 mm) A65

transistor A144

Abstract: A101 TQFP 144 PACKAGE 51-85050-A 85049 A144 plastic quad flat pack
Contextual Info: Package Diagram Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 51-85063-B 44-Lead Thin Plastic Quad Flat Pack A44 51-85064-B 1 Package Diagram 64-Pin Thin Plastic Quad Flat Pack 10 x 10 x 1.4 mm A64 51-85051-A 64-Lead Thin Plastic Quad Flat Pack (14 x 14 x 1.4 mm) A65

plastic quad flat pack

Contextual Info: Package Diagrams Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 51-85063-B 44-Lead Thin Plastic Quad Flat Pack A44 51-85064-B 1 Package Diagrams 64-Pin Thin Plastic Quad Flat Pack 10 x 10 x 1.4 mm A64 51-85051-A 64-Lead Thin Plastic Quad Flat Pack (14 x 14 x 1.4 mm) A65

UT54ACTS220

Abstract: UT69151
Contextual Info: UT54ACTS220 Clock and Wait-State Generation Circuit FEATURES PINOUTS radiation-hardened CMOS - Latchup immune High speed Low power consumption Single 5-volt supply Available QML Q or V processes Flexible package - 14-pin DIP - 14-lead flatpack 14-Pin DIP Top View

CERAMIC FLATPACK

Abstract: F14C F10B F16B FA32A FA36A
Contextual Info: Ceramic Flatpack 10 Lead Ceramic Flatpack NS Package Number F10B 2000 National Semiconductor Corporation MS101108 www.national.com Ceramic Flatpack August 1999 Ceramic Flatpack 14 Lead Ceramic Flatpack NS Package Number F14C 16 Lead Ceramic Flatpack NS Package Number F16B

UT54ACS54

Abstract: UT54ACTS54
Contextual Info: UT54ACS54/UT54ACTS54 Radiation-Hardened FEATURES • • • • • PINOUTS 14-Pin DIP Top View radiation-hardened CMOS - Latchup immune High speed Low power consumption Single 5 volt supply Available QML Q or V processes Flexible package - 14-pin DIP - 14-lead flatpack

UT54ACS02

Abstract: UT54ACTS02
Contextual Info: UT54ACS02/UT54ACTS02 Radiation-Hardened Quadruple 2-Input NOR Gates FEATURES PINOUTS radiation-hardened CMOS - Latchup immune High speed Low power consumption Single 5 volt supply Available QML Q or V processes Flexible package - 14-pin DIP - 14-lead flatpack

Contextual Info: UT54ACS04/UT54ACTS04 Radiation-Hardened Hex Inverters FEATURES • 1.2 1 radiation-hardened CMOS - Latchup immune • Highspeed • Low power consumption • Single 5 volt supply • Available QML Q or V processes • Flexible package - 14-pin DIP - 14-lead flatpack

Contextual Info: PXO Hybrid Clocks ECL OSCILLATORS REFERENCE TABLE MODEL 069 082 769 770 771 FREQUENCY PACKAGE 30 MHz to 130 MHz 30 MHz to 130 MHz 30 MHz to 130 MHz 30 MHz to 130 MHz 30 MHz to 130 MHz COMPLEMENTARY OUTPUT 14 Lead Flatpack 32 Pad LCC 14 Pin DIP 4 Pin DIP 14 Pin DIP

Contextual Info: UT54ACTS220 Clock and Wait-State Generation Circuit FEATURES • 1.2 radiation-hardened CMOS - Latchup immune • High speed • Low power consumption • Single 5-volt supply • Available QML Q or V processes • Flexible package - 14-pin DIP - 14-lead flatpack

UT54ACTS220

Abstract: ut69151 lxe/dxe UT69151 SUmmit E
Contextual Info: UT54ACTS220 Clock and Wait-State Generation Circuit FEATURES • 1.2µ radiation-hardened CMOS - Latchup immune • High speed • Low power consumption • Single 5-volt supply • Available QML Q or V processes • Flexible package - 14-pin DIP - 14-lead flatpack

TB466

Abstract: qfn 32 land pattern moisture sensitivity ISL29001
Contextual Info: Surface Mount Assembly Guidelines for Optical Dual FlatPack No Lead ODFN Package Technical Brief March 14, 2008 TB466.1 Introduction Part I - ODFN Board Mounting Guidelines Optical Dual-in-line Flat No-lead (ODFN) packages are developed for light sensor applications. The mechanical

Solder bar of Senju M705

Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Contextual Info: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold

Contextual Info: UT54ACS04/UT54ACTS04 Radiation-Hardened Hex Inverters FEATURES • 1.2|i radiation-hardened CMOS - Lgtchup immune • Highspeed • Low power consumption • Single 5 volt supply • Available QML Q or V processes • Flexible package - 14-pin DIP - 14-lead fl&tpack

MIL-PRF-385353

Abstract: 1E6 MARKING 1E5 MARKING
Contextual Info: 3,0 Ordering Information Rad-Hard MSI - 14-LEAD PACKAGES: MILITARY TEMPERATURE RANGE, CLASS Q, & CLASS V UT54 * * - * * * * Total Dose: H = 1E6 rads(Si) (R) = 1E5 rads(Si) ( ) = Total dose characteristics neither tested nor guaranteed Lead Finish:1 (A) = Hot solder dipped

HCTS10D

Abstract: HCTS10DMSR HCTS10HMSR HCTS10K HCTS10KMSR HCTS10MS
Contextual Info: HCTS10MS Radiation Hardened Triple 3-Input NAND Gate September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si)

HCS05D

Abstract: HCS05DMSR HCS05HMSR HCS05K HCS05KMSR HCS05MS
Contextual Info: HCS05MS Radiation Hardened Hex Inverter with Open Drain September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si)

HCS27D

Abstract: HCS27DMSR HCS27HMSR HCS27K HCS27KMSR HCS27MS
Contextual Info: HCS27MS Radiation Hardened Triple 3-Input NOR Gate September 1995 Features Pinouts 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW • 3 Micron Radiation Hardened SOS CMOS • Total Dose 200K RAD (Si)

JM7000

Abstract: ACS86DMSR ACS86HMSR ACS86KMSR ACS86MS
Contextual Info: ACS86MS Semiconductor Radiation Hardened Quad 2-Input Exclusive OR Gate April 1995 Features Pinouts 14 LEAD CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T14, LEAD FINISH C TOP VIEW • 1.25 Micron Radiation Hardened SOS CMOS • Total Dose 300K RAD Si

Contextual Info: HCTS74MS Semiconductor Radiation Hardened Dual-D Flip-Flop with Set and Reset September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAM IC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP M IL-STD-183S CDIP2-T14, LEAD FINISH C TOP VIEW

5004

Abstract: HCS05D HCS05DMSR HCS05HMSR HCS05K HCS05KMSR HCS05MS
Contextual Info: HCS05MS Radiation Hardened Hex Inverter with Open Drain September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si)