132AH Search Results

NEC asu

Abstract: 13E3h 1442H
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

pico fuse color code

Abstract: UFN 432 fuse smd code ud smd 1R10 diode SBF32 Kamaya OHM RMC rmc r910 smd diode marking codes 2U SMD marking CODE 2U walsin 0603 capacitor
Contextual Info: KAMAYA OHM Chip Resistors General Purpose High Voltage Surge Trimmable Sensing NEW NEW Fixed Thick Film Chip Resistors; Rectangular Type Fixed Thick Film Chip Resistors; Rectangular Type & Precision Fixed Thin Film Chip Resistors; Rectangular Type Fixed Thick Film Chip Resistors; Rectangular Type & High Voltage

13CD

Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
Contextual Info: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is

77FE

Contextual Info: G 12 V -1 4 0 A h ! G elled ele c tro ly te b a tte ry PHYSICAL SPECIFICATION Nominal Voltage 12V Nominal Capacity 20HR 140AH Length 485 ± 3mm (19.09 inches) Width 170±2mm (6.69 inches) Container Height 242 ± 2mm (9.53 inches) Total Height (with Cover)

smd marking STPA

Abstract: 1488h stpa smd PM5354 sx 460 k2462 0741H AM 702 0B48H E22/6/AS7620/MSP430/AS7620/Datasheet-091/ITT TCA 700 Y
Contextual Info: 08 AM S/UNI MULTI-2x12 ASSP Telecom Standard Product Data Sheet Released be r, 20 04 07 :2 4: PM5354 y, 14 Se pt em S/UNI® MULTI-2x12 in er In co n Tu es da Multi-rate SATURN® User Network Interface for 2x622, and 4x155 Released Issue No. 2: September 2003

63A52

Abstract: PM5360 Hex schmitt trigger ecl isp connector block diagram 0521H 10A1H 0836H 1E6C
Contextual Info: 22 AM S/UNI MULTI-48 ASSP Telecom Standard Product Data Sheet Released be r, 20 04 07 :2 3: PM5360 y, 14 Se pt em S/UNI® MULTI-48 in er In co n Tu es da Multi-rate SATURN® User Network Interface for 1x2488, 4x622, and 4x155 Released Issue No. 5: September 2003

102AH

Contextual Info: CHIP FUSES; RECTANGULAR TYPE KAMAYA OHM FMC16 Option Code :AH/In-rush Withstand •Features 1. High anti pulse performance. 2. Pb*1, Halogen*2 and Antimony*3 free product *1 Pb 1000ppm *2 Cl or Br *3 Sb2O3 900ppm, Cl+Br 1500ppm 900ppm HF HF 3. Certified UL, c-UL.

1312H

Abstract: 144BH 1458h 1351h 13D0H 1444H
Contextual Info: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level

SI 1340H

Abstract: 1542H mx-126 1488h integrators si 1340h PSL 26 SA8 357 T1E1-7 DATA SHEET Equivalent MX12 MX23
Contextual Info: PM5365 TEMAP STANDARD PRODUCT REGISTER DESCRIPTION PMC-1990682 ISSUE 2 HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER PM5365 TEMAP HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTION Proprietary and Confidential ISSUE 2: JULY 2001 PMC-Sierra, Inc.

Contextual Info: CHIP FUSES; RECTANGULAR TYPE KAMAYA OHM FMC16 Option Code :AH/In-rush Withstand •Features 1. High anti pulse performance. 2. Pb*1, Halogen*2 and Antimony*3 free product *1 Pb 1000ppm *2 Cl or Br *3 Sb2O3 900ppm, Cl+Br 1500ppm 900ppm HF HF 3. Certified UL, c-UL.

R5F2123

Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
Contextual Info: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level

r5f2122ckfp

Abstract: r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H
Contextual Info: REJ09B0251-0200 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/2x SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by

SI 1360H

Abstract: 1542H 1488h 1558h PSL 26 MX12 MX23 PM8315 SI 1340H
Contextual Info: PM8315 TEMUX STANDARD PRODUCT REGISTER DESCRIPTIONS PMC-1990495 ISSUE 5 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX PM8315 TEMUX HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MULTIPLEXER REGISTER DESCRIPTIONS Proprietary and Confidential

NEC 1378h

Abstract: R5F2123CKFP 1347h 13F9H R5F21226DFP R5F21226JFP R5F2123 R5F21227JFP R5F21228DFP R5F21228JFP
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

PM5360

Abstract: 63A52 PMC-2020735 0719h 0837H BC 459 3627AM 1602h* lcd BCD 548 BC 558 EQUIVALENT BC 309
Contextual Info: 6: 27 AM S/UNI MULTI-48 ASSP Telecom Standard Product Data Sheet Released em be r, 20 11 08 :3 PM5360 Mo nd ay ,2 8N ov S/UNI® MULTI-48 nd ar es an of IH S on Multi-rate SATURN® User Network Interface for 1x2488, 4x622, and 4x155 Released Issue No. 5: September 2003

13D2H

Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
Contextual Info: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU

Contextual Info: REJ09B0251-0110 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU M16C FAMILY / R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by