13226 Search Results

Contextual Info: Mouser Electronics Related Product Links 523-132267 - Amphenol 132267

AMD79C978

Abstract: CN7221 EPB5037GM
Contextual Info: Home Phone NetworkingAnalog Magnetics Module with 10/100 Base-T ELECTRONICS INC. EPB5037GM • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •

AMD79C978

Abstract: CN7221 EPB5040GM SIDACTOR
Contextual Info: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5040GM • Optimized for AMD79C978 ,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •

AMD79C978

Abstract: CN7221 EPB5040G a539
Contextual Info: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5040G • Opitimized for AMD79C978 , Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •

CSB503

Abstract: AMD79C978 EPB5032G CN7221
Contextual Info: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5032G • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEC 802.3 Requirements •

Contextual Info: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5098G • Optimized for Intel Chipset • • UL/IEL 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes • • Temperature Range -40°C to +85°C •

EPB5036G

Abstract: AMD79C978 CN7221 132261
Contextual Info: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5036G • Optimized For AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •

SN100C

Abstract: robotic vacuum cleaner litton CONNECTOR POKE L012 led strip
Contextual Info: Application Specification 114-13226 Low Insertion Force LIF Poke-In Connectors NOTE 02 JUL 08 Rev A All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless _ otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2 . Figures and

AMD79C978

Abstract: CN7221 EPB5036WG
Contextual Info: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5036WG • Optimized For AMD79C978 ,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •

EPB5047AS

Contextual Info: Home Phone Networking Magnetic Module ELECTRONICS INC. EPB5047AS • Designed to work with Broadcom’s BCM 4210 • • UL/IEC 950 Approved File #132261 • • Robust construction allows for IR processes • • 1500 Vrms Isolation • • Enhanced Common Mode Attenuation to pass FCC Class B •

transformers electronics

Abstract: MC145175 29C53 EPA1155-1 EPA1155-2 EPA1155-3 EPA1155-X MT8930 PEB2080 TP3420
Contextual Info: ISDN “S” Interface Isolation Transformers ELECTRONICS INC. EPA1155-X • UL1459 Approved, File #132261 • Meets CCITT 1.430 Four Wire “S” Interface • Single Low Profile Packages • Hipot : 2000 Vrms Electrical Parameters @ 25° C PCA Part Number

AMD79C978

Abstract: CN7221 EPB5035G C 6090
Contextual Info: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5035G • Optimized for AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •

AMD79C978

Abstract: CN7221 EPB5037G
Contextual Info: Home Phone Networking Analog Magnetics Module with 10/100 Base-T ELECTRONICS INC. EPB5037G • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •

EPB5047S

Contextual Info: Home Phone Networking Magnetic Module ELECTRONICS INC. EPB5047S • Optimized for Broadcom’s BCM 4210 • • UL/IEC 950 Approved File #132261 • • Robust construction allows for IR/VP processes • • 1500 Vrms Isolation • • Enhanced Common Mode Attenuation to pass FCC Class B •

hpna

Abstract: EPB5174G
Contextual Info: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5174G • Supports TUT Systems HPN Architecture • • UL/IEC 950 Approved File #132261 • • Meets UL 1950 Spplementary Insulation Requirements • • Meets or exceeds IEEE802.3 Requirements •

Contextual Info: 8 7 6 5 3 4 1 2 REVISIONS REV ECN, ERN NO. A PRODUCT DWG EAR 13226 50.22 1.977 REF F 8.90 .350 5.50 [.217] DEEP THREADED HOLES SEE ORDERING CODE THREAD OPTION 2.50 .098 9.00 .354 18.00 .709 APPRD. K.L. F 10 POSITION OR 8 POSITION WITH LED'S M1.6 CAPTIVE

AMD79C978

Abstract: CN7221 EPB5045G
Contextual Info: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5045G • Optimized for AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • Supports TUT Sysems HPN Architecture • • Robust construction allows for reflow processes •

cmps a44

Contextual Info: 13 13.1 INSTRUCTION SET OVERVIEW The instruction set used by the Am186EM and Am188EM microcontrollers is identical to the 80C186/188 instruction set. An instruction can reference from zero to several operands. An operand can reside in a register, in the instruction itself, or in memory.

AMP 59974-1 crimper

Abstract: AMP 90277-1 amp 825590-3 90277-1 ferrule crimper pull test 734536-1 AMP 47387 crimper AMP junior power timer contact 734535-1 654149-1
Contextual Info: TYCO ELECTRONICS TECHNOLOGY PORTFOLIO Connector Systems / Electromechanical Components Circuit Protection Devices Magnetics Wireless Components Racks and Panels Antennas, GPS Antennas, Integrated Antenna Systems Touch Screens Resistors and Inductors Printed Circuit Board

MC1322x

Abstract: MC1322x-SRB mc13224 802154MPSRM HCS08 MC13224V MC13226 board weather station Accelerometers 22xSMAC
Contextual Info: MC1322x Simple Media Access Controller Demonstration Applications User's Guide Document Number: 22xSMACDAUG Rev. 1.2 10/2010 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor

V850E2

Abstract: TSG20 v850E2M architecture Users Manual v850e2/dx4
Contextual Info: User’s Manual 32 V850E2/Px4 User’s Manual: Hardware Renesas microcomputers V850 Series All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by

Contextual Info: Not Available for New Designs, Use 04x ASH or 138 AML 132/133 ALL-DIN www.vishay.com Vishay BCcomponents Aluminum Capacitors Axial Long-Life, DIN-Based FEATURES • Long useful life: Up to 15 000 h at 85 °C • Taped versions up to case Ø 15 mm x 30 mm available for automatic insertion

2222 041-043 Aluminum Electrolytic Capacitor

Abstract: 132/133 ALL-DIN MAL21 MAL2
Contextual Info: 132/133 ALL-DIN Vishay BCcomponents Aluminum Capacitors Axial Long Life, DIN-Based FEATURES • Polarized aluminum non-solid electrolyte 042/043 ASH high voltage smaller dimensions 132/133 ALL-DIN longer life 119 AHT 120 ATC QUICK REFERENCE DATA DESCRIPTION

0159

Abstract: 015-91-6103 PK-70873-0805 PK-70873-0353 015-91-3600 015-91-3148 015-91-6060
Contextual Info: OPTIONAL PICK ANO PLACO L27 „050 2.54±O„08 TYP. ’ . I00±.0 03 NON-ACCUM. CA O •iTLh .4 2 0 RECOMMENDED P.C. BOARD PAD LAYOUT AT ENDS FOR NO PEG VERSION. P I C K AND P L A C E CAP AVAILABLE S E E N O T E S 8 & 9. L27 .050 -"C"- VQP; REF. ROW ”A ”