13226 Search Results

AMD79C978

Abstract: CN7221 EPB5034
Contextual Info: Home Phone Networking Analog Magnetics Module with 10/100 Base-T ELECTRONICS INC. EPB5034 • Optimized for AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •

AMD79C978

Abstract: CN7221 EPB5135G
Contextual Info: Low Profile Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5135G • Optimized for AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File # 132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •

AMD79C978

Abstract: EPB5048G
Contextual Info: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5048G • Optimized for AMD79C978, Conexant CN 7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •

AMD79C978

Abstract: CN7221 EPB5032 RX513
Contextual Info: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5032 • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •

AMD79C978

Abstract: CN7221 EPB5035GM
Contextual Info: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5035GM • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •

EPF8185SL

Contextual Info: 10/100 LAN Interface Module for PC Card Applications ELECTRONICS INC. EPF8185SL • UL/IEC 950 Approved File #132261 • including Nordic deviations for creepage and clearance • Guaranteed to operate with 8 mA DC bias at 70°C • • Low profile, fully integrated with two channels •

Contextual Info: Mouser Electronics Related Product Links 523-132267 - Amphenol 132267

AMD79C978

Abstract: CN7221 EPB5037GM
Contextual Info: Home Phone NetworkingAnalog Magnetics Module with 10/100 Base-T ELECTRONICS INC. EPB5037GM • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •

AMD79C978

Abstract: CN7221 EPB5040GM SIDACTOR
Contextual Info: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5040GM • Optimized for AMD79C978 ,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •

AMD79C978

Abstract: CN7221 EPB5040G a539
Contextual Info: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5040G • Opitimized for AMD79C978 , Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •

CSB503

Abstract: AMD79C978 EPB5032G CN7221
Contextual Info: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5032G • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEC 802.3 Requirements •

Contextual Info: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5098G • Optimized for Intel Chipset • • UL/IEL 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes • • Temperature Range -40°C to +85°C •

EPB5036G

Abstract: AMD79C978 CN7221 132261
Contextual Info: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5036G • Optimized For AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •

SN100C

Abstract: robotic vacuum cleaner litton CONNECTOR POKE L012 led strip
Contextual Info: Application Specification 114-13226 Low Insertion Force LIF Poke-In Connectors NOTE 02 JUL 08 Rev A All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless _ otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2 . Figures and

EPB5047AS

Contextual Info: Home Phone Networking Magnetic Module ELECTRONICS INC. EPB5047AS • Designed to work with Broadcom’s BCM 4210 • • UL/IEC 950 Approved File #132261 • • Robust construction allows for IR processes • • 1500 Vrms Isolation • • Enhanced Common Mode Attenuation to pass FCC Class B •

transformers electronics

Abstract: MC145175 29C53 EPA1155-1 EPA1155-2 EPA1155-3 EPA1155-X MT8930 PEB2080 TP3420
Contextual Info: ISDN “S” Interface Isolation Transformers ELECTRONICS INC. EPA1155-X • UL1459 Approved, File #132261 • Meets CCITT 1.430 Four Wire “S” Interface • Single Low Profile Packages • Hipot : 2000 Vrms Electrical Parameters @ 25° C PCA Part Number

AMD79C978

Abstract: CN7221 EPB5035G C 6090
Contextual Info: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5035G • Optimized for AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Robust construction allows for reflow processes •

AMD79C978

Abstract: CN7221 EPB5037G
Contextual Info: Home Phone Networking Analog Magnetics Module with 10/100 Base-T ELECTRONICS INC. EPB5037G • Optimized for AMD79C978,Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • • Supports TUT Systems HPN Architecture • • Meets or exceeds IEEE 802.3 Requirements •

EPB5047S

Contextual Info: Home Phone Networking Magnetic Module ELECTRONICS INC. EPB5047S • Optimized for Broadcom’s BCM 4210 • • UL/IEC 950 Approved File #132261 • • Robust construction allows for IR/VP processes • • 1500 Vrms Isolation • • Enhanced Common Mode Attenuation to pass FCC Class B •

AMD79C978

Abstract: CN7221 EPB5036GM
Contextual Info: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5036GM • Optimized for AMD79C978 & Conexant CN7221 Chips • • UL/IEC 950 Approved File #132261 • • Includes 10 Base-T Magnetics with Common Mode Chokes • • Supports TUT Systems HPN Architecture •

hpna

Abstract: EPB5174G
Contextual Info: Home Phone Networking Analog Magnetics Module with 10 Base-T ELECTRONICS INC. EPB5174G • Supports TUT Systems HPN Architecture • • UL/IEC 950 Approved File #132261 • • Meets UL 1950 Spplementary Insulation Requirements • • Meets or exceeds IEEE802.3 Requirements •

Contextual Info: 8 7 6 5 3 4 1 2 REVISIONS REV ECN, ERN NO. A PRODUCT DWG EAR 13226 50.22 1.977 REF F 8.90 .350 5.50 [.217] DEEP THREADED HOLES SEE ORDERING CODE THREAD OPTION 2.50 .098 9.00 .354 18.00 .709 APPRD. K.L. F 10 POSITION OR 8 POSITION WITH LED'S M1.6 CAPTIVE

AMD79C978

Abstract: CN7221 EPB5045G
Contextual Info: Home Phone Networking Analog Magnetics Module ELECTRONICS INC. EPB5045G • Optimized for AMD79C978, Conexant CN7221 • & National DP83851 Chips • UL/IEC 950 Approved File #132261 • Supports TUT Sysems HPN Architecture • • Robust construction allows for reflow processes •

SM-0150000002

Abstract: hypertac LHS 682-20-G1 hypertac 0250 202-23-G1 0150 761-20-OG SM-0150000000 hypertac connector insertion tools SE-0250000001 daniels ft8 astro tools
Contextual Info: LHS Series Rack & Panel Blind Mating Modular Connectors • Railway flat floating connector • Modularity mixed power, signal & coaxial contacts. • Up to 70 signal contacts. • Guiding pins. • Rack/Panel applications norm XPF61-005 • One size only: 14 units (5.5mm)