132-BALL PACKAGE Search Results

LC4064V

Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
Contextual Info: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch

TFBGA132

Contextual Info: PDF: 2003 Jul 17 Philips Semiconductors Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm SOT599-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 e 1/2 e ball A1 index area P N M L K J H G F

Contextual Info: Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm SOT599-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 e 1/2 e P N M L K J H G F E D C B A ball A1 index area shape optional 4x y1 C ∅v M C A B

Contextual Info: Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls body; 12 x 12 x 0.8 mm A B D SOT599-2 ball A1 index area E A A2 A1 detail X C e1 e 1/2 e ∅v ∅w b M M y y1 C C A B C P N M L K J H G F E D C B A ball A1 index area e e2

TFBGA132

Abstract: sot599
Contextual Info: PDF: 2000 Mar 08 Philips Semiconductors Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm SOT599-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A P N M e L

Contextual Info: PDF: 2003 Mar 19 Philips Semiconductors Package outline TFBGA132: plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm SOT599-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 e 1/2 e P N M L K J H G F E D C B A shape optional 4x

CPG132

Abstract: CP132 132-ball CP132/CPG132
Contextual Info: R Chip Scale BGA CP132/CPG132 Package PK373 (v1.3) June 25, 2008 132-BALL CHIP SCALE BGA 0.50mm PITCH (CP132/CPG132) 2004-2008 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.

BGA-56 DATASHEET

Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
Contextual Info: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3

bga 1296

Abstract: XC2V80 LVDSEXT25 BLVDS-25 LVDSEXT-25
Contextual Info: XILINX FPGA PACKAGE OPTIONS AND USER I/O Pins Body Size I/O’s 88 120 200 264 432 528 624 720 912 1104 1296 176 176 284 316 404 512 660 724 804 804 804 404 556 XC2S200 XC2S150 XC2S100 XC2S50 XC2S30 Spartan-II 2.5V XC2S15 XC2S300E XC2S200E XC2S150E XC2S100E

Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher

amkor CABGA 56

Abstract: chiparray amkor CABGA 8X8 CTBGA CABGA 17 x 17 thermal resistance CABGA CVBGA MO-195 8x8 64 footprint amkor cabga
Contextual Info: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: Amkor’s ChipArray® packages are laminatebased Ball Grid Array BGA packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count,

Contextual Info: t r ä n S w it c h -X-TB-524 TECHNICAL BULLETIN QEIM VLSI Device, TXC-04252 PRODUCT PREVIEW Plastic Ball Grid Array Package Option for OE1M Device PURPOSE OF THTS TECHNICAL BULLETIN TranSwitch is introducing an additional package option for the QEIM Quad E l Mapper VLSI Device. The

AB244A

Abstract: R488A AD9361 AK2177 CMOS-9HD UPD65891 N526A PD65891 tqfp 64 thermal resistance nec PD65881
Contextual Info: Design Manual CMOS Gate Array, Embedded Array Package Ver. 4.0 Target Series CMOS-N5 Series CMOS-9HD Series CMOS-10HD Series EA-9HD Series Document No. A16400EJ4V0DM00 4th edition Date Published December 2004 NS CP(N) NEC Electronics Corporation 2002

im4a3-64

Abstract: lattice im4a3 im4a3 im4a3-128 im4a3-192 lfe3-35ea IM4A3-256 iM4A3-384 LFXP2-8E lfe3-70ea
Contextual Info: Lattice Socket Adapter Listing Rev 4.30 Socket Adapters are the interface between programming hardware such as the Lattice Model 300 desktop programmer , and Lattice programmable devices. This document shows which Lattice Socket Adapters support which Lattice programmable products. Lattice Socket Adapters are

lcmxo2-1200

Abstract: LFE3-17EA LCMXO2 1200 LC4064 LFXP20C 22V10A lfe3-70ea LC4256 HW-USBN-2A LFXP2-40E
Contextual Info: Rev 5.2 Lattice Socket Adapter Listing Lattice Desktop Programmers The Lattice Model 300 Desktop Programmer enables programming of Lattice devices all families except iCE without soldering on a printed circuit board. The Desktop Programmer communicates to software on the PC (ispVM System or Diamond Programmer) via a Lattice Programming Cable (USB: HW-USBN-2A, or Parallel: HW-DLN-3C Parallel cable is included with the Model 300). To program a specific Lattice device, an appropriate Lattice socket adapter must be installed on the Model 300 Desktop

Lattice Socket Products

Abstract: LFE3-95EA
Contextual Info: Rev 5.7 Lattice Socket Adapter Listing Lattice Desktop Programmers The Lattice Model 300 Desktop Programmer enables programming of all Lattice families except iCE without soldering on a printed circuit board. The Model 300 is supported by the Lattice Programming Cable (HW-USBN-2A is included with the Model 300). To program a specific Lattice device, an appropriate Lattice socket adapter must

pqfp 132

Contextual Info: MC68HC16Z1VEH16 Information General information Package information Environmental and Compliance information Manufacturing and Qualification information Ordering information Operating Characteristics General Information Parameter Value Part Number MC68HC16Z1VEH16

BGA-132

Abstract: SF-BGA132A-B-11 1.27 pad layout
Contextual Info: D Package Code: BGA132A C 16.51mm [0.650"] See BGA pattern code to the right for actual pattern layout Y 1.91mm [0.075"] 0.76mm [0.030"] X 16.51mm [0.650"] Top View reference only 1.91mm [0.075"] 2 1.27 mm [0.050"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

MMC02G

Abstract: LFBGA169 BGA 221 eMMC
Contextual Info: NAND08GAH0J NAND16GAH0H 1-Gbyte, 2-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface LFBGA153 ■ Up to 2 Gbytes of formatted data storage

XC95288XV

Abstract: XC95288XV Family XC2C256
Contextual Info: XILINX CPLD http://www.xilinx.com/products/cpldsolutions PACKAGE OPTIONS AND USER I/O PRODUCT SELECTION MATRIX I/O Features 28 x 28 mm 173 173 173 164 172 180 168 168 VQFP Packages VQ 44 12 x 12 mm 64 12 x 12 mm 100 16 x 16 mm 33 33 64 36 80 80 36 68 34

MMC04G

Abstract: MMC08G FBGA169 "Manufacturer ID" eMMC LFBGA169 MMC16G eMMC driver MMC32G emmc bga TFBGA169
Contextual Info: NAND32GAHOK NAND64GAHOK NAND128AHOK NAND256AHOK 4-Gbyte, 8-Gbyte, 16-Gbyte, 32-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ Up to 32 Gbytes of formatted data storage

LCMXO1200C-3TN100C

Abstract: LCMXO640 LVCMOS15 LCMXO1200 LCMXO2280 LCMXO256 LVCMOS25 LVCMOS33 pb7a marking
Contextual Info: MachXO Family Data Sheet Version 02.3_4W February 2007 MachXO Family Data Sheet Introduction April 2006 Data Sheet • Flexible I/O Buffer Features • Programmable sysIO buffer supports wide range of interfaces: − LVCMOS 3.3/2.5/1.8/1.5/1.2 − LVTTL

Contextual Info: MachXO Family Data Sheet Version 02.0_4W April 2006 MachXO Family Data Sheet Introduction April 2006 Data Sheet • Flexible I/O Buffer Features • Programmable sysIO buffer supports wide range of interfaces: − LVCMOS 3.3/2.5/1.8/1.5/1.2 − LVTTL − PCI

MMC02G

Abstract: emmc bga "Manufacturer ID" eMMC emmc csd NUMONYX emmc NAND08GAH0J NAND16GAH0H 221 ball eMMC memory emmc CID Manufacturer ID list eMMC
Contextual Info: NAND08GAH0J NAND16GAH0H 1-Gbyte, 2-Gbyte, 1.8 V/3.3 V supply, NAND flash memories with MultiMediaCard interface Preliminary Data Features • Packaged NAND flash memory with MultiMediaCard interface ■ Up to 2 Gbytes of formatted data storage ■ eMMC/MultiMediaCard system specification,