1301.9313 Search Results
1301.9313 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| 93135-005LF | Amphenol Communications Solutions | PV® Wire-to-Board Connector System, Crimp to Wire Receptacle, Short Wire Barrel S/Bump | |||
| 93135-003LF | Amphenol Communications Solutions | PV® Wire-to-Board Connector System, Crimp to Wire Receptacle, Short Wire Barrel S/Bump | |||
| 93135-004LF | Amphenol Communications Solutions | PV® Wire-to-Board Connector System, Crimp to Wire Receptacle, Short Wire Barrel S/Bump | |||
| XPH13016MC | Toshiba Electronic Devices & Storage Corporation | P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) | Datasheet | ||
| 10119313-301RLF | Amphenol Communications Solutions | MINI USB 2.0- B Type Receptacle conn. Vertical Type DIP Type |
1301.9313 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
1301-9312
Abstract: 1301.9313 1301.9318 8104 9312 1301.9401
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Original |
pac121301-93121301.93131301.9318+2 | |
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Contextual Info: PRINTMOUNT BENEFITS Simple assembly, long life time, short lead time Reliable tactile feedback Various designs with 1/4 and 1/2 inch are possible with different heights Variable colour design and lettering Available for through hole and SMD assembly Tested to degree of protection IP 40 and IP 67 |
Original |
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1301-9312
Abstract: CECC 00802 zestron
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Original |
1301-9312cecc 00802zestron | |
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Contextual Info: Switches in momentary action LSG, LSH, LPH, LPS, LPV 1/4" Models Construction Dimensions Circuit diagram 1.4*3 Pad land 4-1.4*2.5 Pad land 4.50 2 LSG h Ø3.0 2 4.50 6.60 4 6.20 0.70 0.70 8.40 1 3 1 2 3 4 5 5 2.10 0.3 10.00 4.50 1.40 3.6 LSH h ØA 0.3max 2.25 |
Original |
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Contextual Info: PRINTMOUNT BENEFITS Simple assembly, long life time, short lead time Reliable tactile feedback Various designs with 1/4 and 1/2 inch are possible with different heights Variable colour design and lettering Available for through hole and SMD assembly Tested to degree of protection IP 40 and IP 67 |
Original |
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1301-9312
Abstract: CECC 00802 130-193 X12CrNi177 1301.9313 CECC 00802 classification C
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Original |
1301-9312cecc 00802130-193x12crni177+2 | |
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Contextual Info: PRINTMOUNT BENEFITS Simple assembly, long life time, short lead time Reliable tactile feedback Various designs with 1/4 and 1/2 inch are possible with different heights Variable colour design and lettering Available for through hole and SMD assembly Tested to degree of protection IP 40 and IP 67 |
Original |
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Contextual Info: PRINTMOUNT BENEFITS Simple assembly, long life time, short lead time Reliable tactile feedback Various designs with 1/4 and 1/2 inch are possible with different heights Variable colour design and lettering Available for through hole and SMD assembly Tested to degree of protection IP 40 and IP 67 |
Original |
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CuZn37
Abstract: 1301-9312
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Original |
cuzn371301-9312 | |
lsh 25Contextual Info: PRINTMOUNT BENEFITS Simple assembly, long life time, short lead time Reliable tactile feedback Various designs with 1/4 and 1/2 inch are possible with different heights Variable colour design and lettering Available for through hole and SMD assembly Tested to degree of protection IP 40 and IP 67 |
Original |
lsh 25 | |
1301.9319
Abstract: 1301.9318 1301-9312 Taster 1301.9401
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Original |
1301.93191301.93181301-9312taster+1 |