12533 6 Search Results

fujitsu ic 472

Abstract: DIP-64P-M01 FPT-64P-M06 FPT-64P-M09 MB89613R MB89615R MB89PV620
Contextual Info: To Top / Lineup / Index FUJITSU SEMICONDUCTOR DATA SHEET DS07-12533-1E 8-bit Proprietary Microcontroller CMOS F2MC-8L MB89610R Series MB89613R/615R • DESCRIPTION MB89610R series has been developed as a general-purpose version of the F2MC*-8L family of proprietary 8-bit,

DIP-64P-M01

Abstract: FPT-64P-M06 FPT-64P-M09 MB89613R MB89615R MB89PV620
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS07-12533-1E 8-bit Proprietary Microcontroller CMOS F2MC-8L MB89610R Series MB89613R/615R • DESCRIPTION MB89610R series has been developed as a general-purpose version of the F2MC*-8L family of proprietary 8-bit, single-chip microcontrollers.

Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS07-12533-1E 8-bit Proprietary Microcontroller CMOS F2MC-8L MB89610R Series MB89613R/615R • DESCRIPTION MB89610R series has been developed as a general-purpose version of the F2MC*-8L family of proprietary 8-bit, single-chip microcontrollers.

AS400

Abstract: S390 ES9000 S390-G5 CMOS-6S S390G ibm semi
Contextual Info: THIN FILM PGA ON S390-G5 MAINFRAME HIGH DENSITY MCMS A. K. Malhotra*, D. C. McHerron, R. Shields, B. Ghosal, G. Martin, D. Scheider, J. R. Pennacchia IBM Microelectronics Division, Rt. 52, Hopewell Junction, New York 12533 * Tel.: 914 894-3326; Email: malhotra@us.ibm.com

S1998

Abstract: Coffin-Manson Equation CBGA manson 100C 110C N100 N50M IBM supports ccga CBGA 304 motorola
Contextual Info: CBGA FATIGUE LIFE IMPROVEMENT Marie S. Cole, Gregory B. Martin, Peter J. Brofman and Lewis S. Goldmann IBM Microelectronics Hopewell Jct, New York 12533 Biography Marie Cole is a Senior Engineer in Ceramic Packaging Applications at IBM Microelectronics. She holds a B.S.

BGA heatsink compressive force

Abstract: BGA Solder Ball compressive force PowerPC 970 MULTIPLE EFFECT EVAPORATOR bga thermal cycling reliability original Coffin-Manson Equation underfill SMT underfill 100C reflow temperature bga
Contextual Info: Development of BGA Solution for the IBM PowerPC 970 Module in Apple's Power Mac G5 Presented at ECTC 2004 David Edwards*, Hope Chambers*, Mukta Farooq*, Lewis Goldmann*, Amir Salehi* *IBM Microelectronics, 2070 Route 52, Hopewell Jct, NY 12533 *Apple Computer, 1 Infinite Loop, Cupertino, CA 95014

si7642

Abstract: 754E CD7542 si7542 2hby transistor 7550
Contextual Info: SILICONIX INC 03 82 5 4 73 5 S I L I C O N I X D E | A25473S □□12S33 2 1~— INC 03E 12533 D Si7542 Microprocessor-Compatible 12-Bit CMOS Multiplying DAC J3T • “ ~ T -s rated /- FEATURES BENEFITS APPLICATIONS • Double-Buffered 4-Blt TTL-Compatible Latches

12533

Abstract: marking c08 74AHCT2G08 74AHCT2G08DC 74AHCT2G08DP MO-187 74AHC2G08 74AHC2G08DC 74AHC2G08DP
Contextual Info: 74AHC2G08; 74AHCT2G08 Dual 2-input AND gate Rev. 01 — 6 February 2004 Product data sheet 1. General description The 74AHC2G08; 74AHCT2G08 is a high-speed Si-gate CMOS device. The 74AHC2G08; 74AHCT2G08 provides two 2-input AND gates. 2. Features • Symmetrical output impedance

12533

Abstract: 12533 6 LMC6009MTX C1996 LMC6009 LMC6009MT MTD48 vga 16 pin IDC A9 pin contact RRD-B30M56
Contextual Info: April 1996 LMC6009 9 Channel Buffer Amplifier for TFT-LCD General Description Features The LMC6009 is a CMOS integrated circuit that buffers 9 reference voltages for gamma correction in a Thin Film Transistor Liquid Crystal Display TFT-LCD Guaranteed to

29768

Abstract: 2399-6 USP2446
Contextual Info: Reliability Testing DATA SERIAL #3 U.S. Sensor Part Number USP2446 « Previous Initial Testing 1.1 Date: 2/26/99 U.S. Sensor 1832 W. Collins Ave Orange, CA 92867 Tel: 800-777-6467 Tel: 714-639-1000 Fax: 714-639-1220 Email: sales@ussensor.com Temperature

Contextual Info: SANSHA ELECTRIC MFG CO 5bE D • 7 ^ 1 2 4 3 OODObll lb4 ■ S E M J T-2r-// THYRISTOR ■Maxi mum MODUL E FOR GENERAL USE A K g 5 O B Ratings Itea Syabol Unit AK25GB-40 VDRM V 400 Syabol Unit Rating Repetitive Peak Off-State Voltage Itea AK25GB-80 800 Reference

ibm025171lg5

Contextual Info: M e m o r y P r od uc ts 4Mb Video RAM Compatibility SSO G -64 JF D E C standard • TTF compatible • Power supply: 5.0V/3.3V • Performance 60ns/70ns • 15ns/17ns • 35ns/40ns • 25ns/30ns ’ Features access time serial access time Fast page cycle lime

Contextual Info: REV. 4.00 [.157] DATE ECR NO. DESCRIPTION A 11/20/97 - ADD CENTER CONTACT B 04/08/98 - ADD LMR240 CABLE TO TITLE C 12/12/06 - UPDATE DRAWING FORMAT D 04/01/08 - REVISE INSULATOR TO PTFE E 06/23/10 2062 ADD CRIMP DIMENSIONS AND CRIMP TOOL INFORMATION TO DRAWINGS

top 243 cn

Abstract: 12533
Contextual Info: REV. S ta tu s REVISION 0 7 / 1 1 / 0 0 JC DC/DC CONVERTER 0.3W ±12Vout O' Ld m A. Electrical Specifications 1. Input Voltage 19.2—28.8Vdc Rating 24V CH1 CH2 2. Output Voltage + 12V±0.12 —12V±0.12 3. Output Current 3 .75 -12.5mA 3 .75 -12.5mA 4. Output Ripple

Contextual Info: MITSUBISHI íDGTL LOGIcTtL ¿il ^54=1027 D015S31 0"T p -* • ■ MITSUBISHI ALSTTLs M 74A LS466A P 7 OCTAL BUFFER W ITH 3-STATE OUTPUT INVERTED 9 1D 12531 6249827 MITSUBISHI CDGTL LOGIC) DESCRIPTION The M74ALS466AP is a semiconductor integrated circuit

"silicon steel"

Contextual Info: flexible split-core CURRENT TRANSformers PROVIDE SAFE CONVENIENT INSTALLATION FEATURES DESCRIPTION The OSI flexible split-core current transformers provide the lowest cost installation available. The transformers are made of a silicon steel core which allows the units to actually be split

"silicon steel"

Contextual Info: FLEXIBLE SPLIT-CORE CURRENT TRANSFORMERS PROVIDES SAFE CONVENIENT INSTALLATION DESCRIPTION FEATURES The OSI flexible split-core current transformers provide the lowest cost installation available. The transformers are made of a silicon steel core which allows the units to actually be split

sdram pcb layout gerber pc 133 unbuffered

Abstract: sdram pcb gerber
Contextual Info: V436632S24VD 3.3 VOLT 32M x 64 HIGH PERFORMANCE PC133 UNBUFFERED SDRAM MODULE Features Description • JEDEC-standard 168 pin, Dual Inline Memory Module DIMM ■ Serial Presence Detect (SPD) with E2PROM ■ Nonbuffered ■ Fully PC Board Layout Compatible to INTEL’S

PCXXXU-XXX-542-A

Contextual Info: V436664Z24VD 512MB 144-PIN UNBUFFERED SDRAM SODIMM, 64M x 64 3.3 VOLT Features Description • JEDEC-standard 144 pin, Small-Outline, Dual in line Memory Module SODIMM ■ Serial Presence Detect with E2PROM ■ Nonbuffered ■ Fully Synchronous, All Signals Registered on

Contextual Info: V437464E24VD 3.3 VOLT 64M x 72 HIGH PERFORMANCE REGISTERED SDRAM ECC MODULE Features Description • 168 Pin Registered ECC 67,108,864 x 72 bit Oganization SDRAM Modules ■ Utilizes High Performance 32M x 8 SDRAM in TSOPII-54 Packages ■ Fully PC Board Layout Compatible to INTEL’S

Contextual Info: V436632Y24VD 256MB 144-PIN UNBUFFERED SDRAM SODIMM, INDUSTRIAL TEMPERATURE 32M X 64 3.3VOLT Features Description • JEDEC-standard 144 pin, Small-Outline, Dual in line Memory Module SODIMM ■ Serial Presence Detect with E2PROM ■ Industrial Temp -40oC to +85oC

Contextual Info: V437464S24VD 3.3 VOLT 64M x 72 HIGH PERFORMANCE UNBUFFERED ECC SDRAM MODULE Features Description • 168 Pin Unbuffered ECC 67,108,864 x 72 bit Oganization SDRAM Modules ■ Utilizes High Performance 32M x 8 SDRAM in TSOPII-54 Packages ■ Fully PC Board Layout Compatible to INTEL’S

Contextual Info: V436632Y24VD 256MB 144-PIN UNBUFFERED SDRAM SODIMM 32M X 64 3.3VOLT Features Description • JEDEC-standard 144 pin, Small-Outline, Dual in line Memory Module SODIMM ■ Serial Presence Detect with E2PROM ■ Fully Synchronous, All Signals Registered on

PPC750GX

Abstract: PPC440GX ppc750fx PPC970FX PPC405LP PPC-970FX PPC405EP epos RISCwatch API RISCWatch Programming Interface
Contextual Info: Application Note PIBS Overview PIBS Overview 1 Abstract PIBS PowerPC Initialization and Boot Software provides initialization and system boot services for the IBM PowerPC evaluation and reference boards. PIBS initializes the processor, memory subsystem as well as other components found