12402 Search Results

Contextual Info: Doc No. TT4-EA-12402 Revision. 3 Product Standards Switching Diode DA37102D0L DA37102D0L Silicon epitaxial planar type Unit: mm For high speed switching circuits DA3S102D in SSSMini3 type package 1.2 0.3 0.13 3 • Features 0.8 1.2  Short reverse recovery time trr

Contextual Info: 231-124027-000wago Группа изделий Шаг выводов от Шаг выводов от число контактов Поперечное сечение [mm²] Поперечное сечение [AWG] Способ подключения Измеренное напряжение EN

Contextual Info: 231-124026-000wago Группа изделий Вес Цвет Количество подключаемых проводов Количество независимых цепей число контактов Высота Высота Ширина Ширина

Contextual Info: Product catalogue | PCB connection systems | PCB plug-in connectors | Pitch 5.08 mm 0.200 inch - SLA/BLA | Plug connectors, solder connection pitch 5.08 | SLA 180 | SLA 180 General ordering data Order No. Part designation Version EAN Qty. 1240260000 SLA 9/180 3.2SN OR

bfc2 419 43903

Abstract: 41103 43903 bfc2 417 41304 43902 78204 MKP 419
Contextual Info: MKP 416 to 420 Vishay BCcomponents Metallized Polypropylene Film Capacitors MKP Radial Potted Type FEATURES 168x12 halfpage 5, 10 and 15 mm lead pitch. Supplied loose in box, in ammopack and taped on reel. Intermediate values are available of the E96 series

FC-135 32.7680KA-A0

Abstract: FC-135 32.7680KA FC-135 32,7680KA half bridge converter 2kw FC-135 32,7680KA-a0 BAT54SWTI br 8772 sdc 802 diode 32.7680ka-a0
Contextual Info: AD S1 258 ADS1258-EP SBAS445D – MARCH 2009 – REVISED MARCH 2011 www.ti.com 16-CHANNEL, 24-BIT ANALOG-TO-DIGITAL CONVERTER Check for Samples: ADS1258-EP FEATURES 1 • • • • • • • • • • 23 • • • • • • • • 24 Bits, No Missing Codes

DFFC 0.5-1.0

Abstract: 1476 1567060000 B 1359 v 12719 1350710 138731-000 1283310
Contextual Info: Unimate Range - SLA/BLA The pin headers and socket blocks of the SLA/BLA product family will only mate as a pair, i.e. only pin headers and socket blocks of the same number of poles will connect together. This is not the only unique feature of this Weidmueller classic: We make this

ECS-327-12

Contextual Info: AD S1 258 ADS1258-EP SBAS445D – MARCH 2009 – REVISED MARCH 2011 www.ti.com 16-CHANNEL, 24-BIT ANALOG-TO-DIGITAL CONVERTER Check for Samples: ADS1258-EP FEATURES 1 • • • • • • • • • • 23 • • • • • • • • 24 Bits, No Missing Codes

Contextual Info: REV. S ta tu s Line Filter A. Electrical Specifications: 2 5 °C REVISION 0 3 / 2 1 / 0 0 TS 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. Rated Voltage: AC250V Rated Current: 3A Rated Frequency: 5 0 /6 0 H z Operating Temperature: —25’C ~ + 5 5 ’ C Storage Temperature: —25’C ~ + 85'C

B412

Abstract: B412-10-10 B412-10-25 B412-10-5 B412-5-10 B412-5-25 B412-5-5 B412-7-10 B412-7-25 B412-7-5
Contextual Info: -m à i,£ EDAL INDUSTRIES INC ¿iKC V 4SE D SERIES 4 ^ k'^-'y'S'IJeh'-r. • ' 3 0 1 5 7 1 b 00002Mb 4 ■ E] L7-t2 J - o S' S MINIATURE HIGH VOLTAGE SILICON RECTIFIERS □ Sm aller in size than o th e r high voltage re ctifie rs, com pact tu b u la r co n stru ctio n and fle xib le leads fa c ili­

BCV26

Abstract: BCV27 BCV46 BCV47
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET BCV27; BCV47 NPN Darlington transistors Product data sheet Supersedes data of 1999 Apr 08 2004 Jan 13 NXP Semiconductors Product data sheet NPN Darlington transistors BCV27; BCV47 FEATURES PINNING • Medium current max. 500 mA

smd transistor A6

Abstract: smd transistor A6 3 TFDS3000 Telefunken ir receiver SMD a6 Transistor a6 smd transistor
Contextual Info: TFDS3000 Integrated Infrared Transceiver Module IrDA SIR Description The TFDS3000 is an infrared transceiver for data communication systems. The transceiver is compatible to the IrDA standard which allows data rates up to 115 kB/s. An internal AGC (Automatic Gain Control) ensures

Contextual Info: P ' SEMICONDUCTOR 256K x 4 Static R A M M od u le Features Functional D escription • High-density 1-megabit SRAM module T h e CYM1240 is a very high perform ance 1-megabit static R A M m odule organized as 256K words by 4 bits. T h e m odule is con­ structed using four 256K x 1 static R A M s

1571840000

Abstract: E60693 1238060000 1567060000 v 12719 180B PBT GF 20
Contextual Info: PCB_G001_GB.qxd 10.11.2003 7:39 Uhr Seite G.1 Unimate Range – Pitch 5.08 Socket connectors PCB connection Solder connection Cable connection SLA 90 G.2 250 V / 17.5 A SLA 180 G.3 250 V / 17.5 A Double level connection offset SLAD 90 G.4 250 V / 9.5 A SLAD 180

B57550G0103F000

Abstract: 13844 B57550G0104H000 B57550G0202G000 B57550G0202F000 263640 33260 B57550 B57550G0103J000 533390
Contextual Info: NTC thermistors for temperature measurement Glass-encapsulated sensors, standard type Series/Type: Date: B57550 March 2006 EPCOS AG 2006. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

LM6800

Abstract: CSA8.00MT LM8600 LM8800 5CCK 700MT 2732A eprom LM8802 LM8804 LM8854
Contextual Info: jjj_ V n LM 88PG99A No. 2326 ! N Channel E/0 MOS LSI EPROM-mountable 8-bit microcomputer for evaluating the LM8800 Mr tot microcomputers . _i • i i S A N Y O 1. Overview The LM88PG99A is an EPROM-mountable single-chlp 8-bit microcomputer, and can be used to develop and evaluate

MKP 419

Contextual Info: MKP 416 to 420 Vishay BCcomponents Metallized Polypropylene Film Capacitors MKP Radial Potted Type FEATURES 168x12 halfpage 5, 10 and 15 mm lead pitch. Supplied loose in box, in ammopack and taped on reel. Intermediate values are available of the E96 series

75604

Abstract: MKP 419
Contextual Info: MKP 416 to 420 Vishay BCcomponents Metallized Polypropylene Film Capacitors MKP Radial Potted Type FEATURES 168x12 halfpage 5, 10 and 15 mm lead pitch. Supplied loose in box, in ammopack and taped on reel. Intermediate values are available of the E96 series

usb modem e153

Abstract: IBM POWER3 processor 40A00000 E20A package Foot Pattern 41L6173 E212 mca date sheet of btu 25C38 20EE0007 e174
Contextual Info: RS/6000 44P Series Model 170 Service Guide SA38-0560-01 Second Edition October 2000 Before using this information and the product it supports, read the information in “Safety Notices” on page xi, “Appendix A. Environmental Notices” on page 267, and “Appendix B. Notices” on page 269.

KP 460

Contextual Info: KP 460 to 464 Vishay BCcomponents Polypropylene Film Foil Capacitors KP Axial Epoxy Lacquered Type APPLICATIONS In circuits where close tolerance, reliability and low losses are of prime importance, for example: tuned circuits, filter and timing networks 168x12 halfpage

77509

Abstract: transistor 13002 78202 IEC 384-13 film and foil capacitors 74302 KP 460
Contextual Info: KP 460 to 464 Vishay BCcomponents Polypropylene Film Foil Capacitors KP Axial Epoxy Lacquered Type APPLICATIONS In circuits where close tolerance, reliability and low losses are of prime importance, for example: tuned circuits, filter and timing networks 168x12 halfpage

7812 ct

Abstract: 7812 ct OPERATING VOLTAGE code lock circuit CMOS 4066 7809 ct IC 7806 working ic 4081 5942 B 8836 9085 SSOP t 7815 ct
Contextual Info: IMICT269/270 COMPLETE CT-0 FREQUENCY SYNTHESIZER Feb. 1996 CMOS LSI Complete Frequency Synthesizer For Worldwide CT-0 Designs P R O D U C T D E S C R IP TIO N IMICT269/270 are complete PLL frequency synthesizers for worldwide CT-0 cordless phone designs with eight existing different country frequency

QML-38535

Abstract: 5962-89921
Contextual Info: REVISIONS LTR DESCRIPTION A DATE YR-MO-DA APPROVED 01-01-17 R. MONNIN Drawing updated to reflect current requirements. - ro THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV A A A A A A A OF SHEETS SHEET 1 2 3

SANSUI all circuit diagram

Abstract: sansui tv diagram digital ic cd 4074 ic 7490 which divide by 2 SANSUI all tv circuit diagram ic 7490 which divide by 5 cd 4074 BD 4914 SANSUI diagram chip amp ba 4908
Contextual Info: Order this docum ent by MC13108/D ^ MOTOROLA Advance Information Universal Cordless Telephone Subsystem 1C UNIVERSAL CT-1 SUBSYSTEM INTEGRATED CIRCUIT The MC13108 integrates several of the functions required for a cordless telephone into a single integrated circuit. This significantly reduces