1206 FUSE MARKING 20 Search Results

1 smd fuse marking code 32

Abstract: cfs12V CFS12V3T7R0 smd fuse marking 20 smd fuse marking code 20 CFS12V3T2R50 k smd fuse marking code fuse smd code N smd fuse marking code smd fuse marking code T
Contextual Info: Lead Free Thin Film Chip Fuse Document No TCFS-12OS051E Issued date 2009/5/27 Page 1/15 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

Contextual Info: Thin Film Chip Fuse Document No TCFS-XX0S004I Issued date 2012/11/26 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code J

Abstract: 25 smd fuse marking code smd fuse marking code K smd fuse marking code 4 Fuse 1206 1A CFS12V6T1R25 CFS12V3T2R50 smd fuse marking code T 1206 FUSE marking 20
Contextual Info: Thin Film Chip Fuse Document No TCFS-XXOS004H Issued date 2011/03/01 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 15 0.75A 1206

Contextual Info: Document No TCF-XXOS032J Issued date 2012/06/28 Page 1/20 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 15 0.75A 1206

Abstract: CF06V3T1R25 CF04V cf-06v5T smd fuse marking code K CF06V5TR40 1 smd fuse marking code n CF06V3t2 CF06V 1 smd fuse marking code
Contextual Info: Document No TCF-XXOS032J Issued date 2011/05/17 Page 1/20 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code T

Abstract: smd fuse marking code smd fuse marking code K 1 smd fuse marking code n smd FUSE CODE t smd fuse marking
Contextual Info: Document No TCH-XXOS001A Thin Film Chip Fuse Issued date 2012/01/18 Page 1/13 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code G

Abstract: fuse smd code Y 1 smd fuse marking code 32 CF12V3T2R50 CF06V2T2R50 SMD FUSE CODE M CF12V6TR80 smd fuse p Fuse 1206 1A CF12V6T1R25
Contextual Info: Document No TCF-12OS031D Issued date 2007/7/25 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

smd fuse marking code 20

Contextual Info: Document No TCP-XXOS006H Issued date 2011/04/22 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 20

Abstract: fuse i2t fuse smd code t
Contextual Info: Document No TCPS-XXOS004F Thin Film Chip Fuse Issued date 2011/03/01 Page 1/18 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

Contextual Info: Document No TCPS-XXOS006A Lead Free Thin Film Chip Fuse Issued date 2009/9/2 Page 1/8 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

fuse resistor

Contextual Info: Document No TCPS-XXOS001A Lead Free Thin Film Chip Fuse Issued date 2008/12/12 Page 1/8 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

R50 marking

Contextual Info: Document No TCH-XXOS001A Issued date 2009/04/26 Page 1/8 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

CP06V

Contextual Info: Document No TCP-XXOS001C Issued date 2010/05/12 Page 1/9 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

Contextual Info: Document No TCP-XXOS001A Issued date 2008/12/12 Page 1/8 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

smd fuse marking 20

Abstract: fuse smd code N smd fuse marking code K fuse smd code k k smd fuse marking code fuse smd code P smd fuse marking code 15 smd fuse marking code T fuse smd code D fuse smd code c
Contextual Info: Document No TCF-04OS029E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

smd fuse marking S

Abstract: smd fuse p
Contextual Info: 12CT Approvals UL Recognized 0.2A to 7A. Electrical Characteristics: Rated Current 1 In Minimum 2 In Maximum 3 In Maximum 0.2A to 7A 4 Hour 120 Second 3 Second Environmental Temperature at 25°C Interrupting Ratings: 50 amperes at 32V ac. 50 amperes at 63V dc.

F1206hi

Abstract: F1206HI4500V032T F1206HI2500V032T fuse 1812 0805 fuse marking code m
Contextual Info: Rev. Jun. 09 SolidMatrix 1206 High Inrush Current Surface Mount Fuses Features: • • • • • • • High inrush current withstanding capability Ceramic Monolithic structure Silver fusing element and silver termination with nickel and tin plating

F1206HA20V024T

Abstract: Fuse 1206 1A F1206HA15V024T F1206HA20V024 "MARKING CODE M" fuse 1812 QIQ007 QIQ106 V024
Contextual Info: NEW! Rev. Jun. 09 SolidMatrix 1206 High Current Rating Fast Acting Surface Mount Fuses Features: • • • • • • • • Special products for high current rating applications Glass ceramic monolithic structure Silver fusing element and silver termination with nickel and tin plating

F1206FA

Abstract: F1206FA2000V063T F1206FA3000V032T F1206FA4000V032T F1206FA0500V063T F1206FA5000V032T F1206FA1000V063T multimeter F1206FA1750V063T fuse 1812
Contextual Info: Rev. Jun. 09 SolidMatrix 1206 Fast Acting Surface Mount Fuses Features: • • • • • • Multilayer monolithic structure with glass ceramic body and silver fusing element Silver termination with nickel and pure-tin solder plating, providing excellent solderability

F1206SB2000V063

Abstract: marking code p 05 fuse F1206SB5000V032T fuse 1812 F1206SB1000V063 F1206SB5500V024T marking p-8a V024 4532 fuse
Contextual Info: Rev. Jun. 09 SolidMatrix 1206 Slow Blow Surface Mount Fuses Features: • • • • • • • High inrush current withstanding capability Multilayer monolithic structure with glass ceramic body and silver fusing element Silver termination with nickel and pure-tin solder plating, providing

Contextual Info: Surface Mount Fuses NANO2 > 458 Series 1206 Size Inrush Withstand Fuse 458 Series Fuse Description The 458 Series Nano2® Fuse is an ultra-small, square surface mount fuse designed to support a variety of space constrained overcurrent protection applications. Offering a

E232989

Abstract: fuse 1812 F0603SB1000V032 4532 fuse "MARKING CODE M" ceramic fuses eia0603 V024 QIQ007 EIA-0603
Contextual Info: Rev. Jun. 09 SolidMatrix 0603 Slow Blow Surface Mount Fuses Features: • • • • • • High inrush current withstanding capability Ceramic Monolithic structure Silver fusing element and silver termination with nickel and tin plating RoHS compliant materials

Contextual Info: THIN FILM CHIP FUSE HOW TO ORDER TCF Q 05 -V2- 1R0 M Packaging M = tape/reel FEATURES Thin Film Chip Fuse Rated Current R50 = 0.5A 1R0 = 1A Small and lightweight design Rated Voltage VA = 125V V6 = 63V V5 = 50V V3 = 32V V2 = 24V Suitable for over current protection

F0603hi

Abstract: 4532 fuse FUSE 1A 0805 MIL-PRF-23419 eia marking code F0603HI1000V032T F0603HI5000V032T F0603HI2000V032T F0603HI1500V032T EIAJ1608
Contextual Info: Rev. Jun. 09 SolidMatrix 0603 High Inrush Current Surface Mount Fuses Features: • • • • • • • High inrush current withstanding capability Ceramic Monolithic structure Silver fusing element and silver termination with nickel and tin plating