1206 FUSE MARKING 20 Search Results

Contextual Info: 1206 SMF l l l Slo-Blo@Thin Film Fuse Time delay feature withstands high in-rush currents and prevents nuisance openings. Package IS visually distinct from fast-acting version for easy Identlflcatlon. Top stde marking allows visual verification of amperage

Contextual Info: Mount Fuses Thin-Film Surface Mount 1206 Slo-Blo" Fuse 430 Series • Time delay feature withstands high in-rush currents and prevents nuisance openings. • Package is visually distinct from fast-acting version for easy identification. • Top side marking allows visual verification of amperage rating.

SLO 365 R

Abstract: eia marking code 2A marking transistor F 365 R th 1206 fuse 204D
Contextual Info: Surface Mount Fuses Thin-Film Surface Mount 1206 Slo-Blo Fuse 430 Series ® ® • Time delay feature withstands high in-rush currents and prevents nuisance openings. • Package is visually distinct from fast-acting version for easy identification. • Top side marking allows visual verification of amperage rating.

1 smd fuse marking code 32

Abstract: cfs12V CFS12V3T7R0 smd fuse marking 20 smd fuse marking code 20 CFS12V3T2R50 k smd fuse marking code fuse smd code N smd fuse marking code smd fuse marking code T
Contextual Info: Lead Free Thin Film Chip Fuse Document No TCFS-12OS051E Issued date 2009/5/27 Page 1/15 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

Contextual Info: Thin Film Chip Fuse Document No TCFS-XX0S004I Issued date 2012/11/26 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code J

Abstract: 25 smd fuse marking code smd fuse marking code K smd fuse marking code 4 Fuse 1206 1A CFS12V6T1R25 CFS12V3T2R50 smd fuse marking code T 1206 FUSE marking 20
Contextual Info: Thin Film Chip Fuse Document No TCFS-XXOS004H Issued date 2011/03/01 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 15 0.75A 1206

Contextual Info: Document No TCF-XXOS032J Issued date 2012/06/28 Page 1/20 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 15 0.75A 1206

Abstract: CF06V3T1R25 CF04V cf-06v5T smd fuse marking code K CF06V5TR40 1 smd fuse marking code n CF06V3t2 CF06V 1 smd fuse marking code
Contextual Info: Document No TCF-XXOS032J Issued date 2011/05/17 Page 1/20 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code T

Abstract: smd fuse marking code smd fuse marking code K 1 smd fuse marking code n smd FUSE CODE t smd fuse marking
Contextual Info: Document No TCH-XXOS001A Thin Film Chip Fuse Issued date 2012/01/18 Page 1/13 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code G

Abstract: fuse smd code Y 1 smd fuse marking code 32 CF12V3T2R50 CF06V2T2R50 SMD FUSE CODE M CF12V6TR80 smd fuse p Fuse 1206 1A CF12V6T1R25
Contextual Info: Document No TCF-12OS031D Issued date 2007/7/25 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

smd fuse marking code T

Abstract: CH06 smd fuse marking code K fuse smd code S smd fuse marking code 1 smd fuse marking code n fuse smd code P smd fuse marking x
Contextual Info: Document No TCH-XXOS001A Thin Film Chip Fuse Issued date 2012/06/28 Page 1/13 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

CPS06V3

Abstract: CPS12V3T3R00 CPS06V3T5R0 CPS12V6TR50 smd fuse marking code 20 CPS12V3T2R50 CPS12V6T1R50
Contextual Info: Document No TCPS-XXOS004F Thin Film Chip Fuse Issued date 2012/06/28 Page 1/19 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

CP06V3T2R0

Abstract: CHIP FUSE CP04V3TR50 CP06V3T5R0 fuse smd code t
Contextual Info: Document No TCP-XXOS006H Issued date 2012/06/28 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 20

Contextual Info: Document No TCP-XXOS006H Issued date 2011/04/22 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

Contextual Info: Document No TCPS-XXOS006A Lead Free Thin Film Chip Fuse Issued date 2009/9/2 Page 1/8 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

fuse resistor

Contextual Info: Document No TCPS-XXOS001A Lead Free Thin Film Chip Fuse Issued date 2008/12/12 Page 1/8 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

R50 marking

Contextual Info: Document No TCH-XXOS001A Issued date 2009/04/26 Page 1/8 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

CP06V

Contextual Info: Document No TCP-XXOS001C Issued date 2010/05/12 Page 1/9 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

Contextual Info: Document No TCP-XXOS001A Issued date 2008/12/12 Page 1/8 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

RBS 6402

Abstract: smd code 1Bs smd fuse marking code TN solar cell cnc TRANSISTOR SMD MARKING CODE kn smd transistor 5Bs smd transistor marking DK RH smd transistor marking cf rh RBS 2202 telecom rbs 6102
Contextual Info: Contents 2011 RoHS Compliant CERAMIC METALIZED SUBSTRATE Ceramic Metalized Substrate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . F1-F2 CIRCUIT PROTECTION PRODUCTS Page Over-Current Protection CF/CFS

smd fuse marking 20

Abstract: fuse smd code N smd fuse marking code K fuse smd code k k smd fuse marking code fuse smd code P smd fuse marking code 15 smd fuse marking code T fuse smd code D fuse smd code c
Contextual Info: Document No TCF-04OS029E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

marking C1s

Abstract: 208H 210F 213B 0643A MIL-STD-202G marking 206
Contextual Info: 1206 size RoHS Compliant Type C1S C1SD1004 Surface Mount Slow Blow Chip Fuse O02 Catalog Number Ampere Rating C1S 750 750mA C1S 1 Electrical Characteristics Testing current (UL STD. 248-14) Minimum Maximum 100% 4 hrs N/A 200% 1 sec 120 sec 300% 0.1 sec 3 sec

smd fuse marking S

Abstract: smd fuse p
Contextual Info: 12CT Approvals UL Recognized 0.2A to 7A. Electrical Characteristics: Rated Current 1 In Minimum 2 In Maximum 3 In Maximum 0.2A to 7A 4 Hour 120 Second 3 Second Environmental Temperature at 25°C Interrupting Ratings: 50 amperes at 32V ac. 50 amperes at 63V dc.

F1206hi

Abstract: F1206HI4500V032T F1206HI2500V032T fuse 1812 0805 fuse marking code m
Contextual Info: Rev. Jun. 09 SolidMatrix 1206 High Inrush Current Surface Mount Fuses Features: • • • • • • • High inrush current withstanding capability Ceramic Monolithic structure Silver fusing element and silver termination with nickel and tin plating