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82350DT EISA Chip Set Design Guide

Abstract: intel 82353 intel 82350DT
Contextual Info: in te i Intel486 DX2 MICROPROCESSOR IEEE 1149.1 Boundary Scan Compatibility Binary Compatible with Large Software Base - M S -D O S ’ , O S /2 *’ , Windows — UNIX” ’ System V/lntel386 — IRMX , iRMK Kernels High Performance Design — 50 MHz/66 MHz Core Speed Using

Contextual Info: 625 Fem ale Header SM T type 2.54mm pitch Technical D a ta : High Tem perature Insulator Material: Therm oplastic.UL 9 4 V -0 C o n ta c t: stam ped and form ed,Phosphor Bronze Plating: Au or Sn over Nickel Current R a tin g : 3 Am p Contact resistance: 20 milliohms Max.