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78511-421HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch. |
PDF
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94611-421HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 21 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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131-4114-21D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate. |
PDF
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131-3114-21H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP. |
PDF
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131-8114-21H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP. |
PDF
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