10X10X Search Results

Contextual Info: SUNON SPECIFICATION FOR APPROVAL CUSTOMER : MOTOR TYPE : DESCRIPTION : MagLev Motor Fan DIMENSIONS : 10X10X3 mm MODEL : UF3A3-500 SUNON SPEC. NO. : D01001031F-00 CUSTOMER APPROVAL NO. APPROVED BY CUSTOMER : : AUTHORIZED DRAWN Nancy 01/07 CHECKED Kiddy March

A46 SMD

Abstract: THA104 THA104-0R2 THA104-0R6 THA104-0R5 THA104-0R9 THA104-R15 THA104-R33
Contextual Info: Power Inductor SMD TYPE THA104 TYPE FEATURES APPLICATIONS Notebook computers Battery powered equipment DC/DC converters Servers Big current 45A Low profile: 10x10x4mm Footprint compatible with most standard Lower temperature rise at big current Low DCR (0.8m )

24334

Abstract: 16C924 MICROCHIP COUNTRY OF ORIGIN MARKING
Contextual Info: PIC16C9XX 19.0 PACKAGING INFORMATION 19.1 64-Lead Plastic Surface Mount fTQFP 10x10x1 mm Body 1.0/0.10 mm Lead Formi e/2 _L DETAIL A ' . See Detail A 8 Places , 11/13° ^_ L S ee Detail B Package Group: Plastic TQFP Millimeters Symbol Min a 0° A - A1 0.05

cr1a

Contextual Info: K04-071 Package Type: 44-Lead Plastic Quad Flatpack PQ - 10x10x2mm Body 1.6/0.15mm Lead Form E1 E #leads=n1 p D D1 2 1 B n X x 45 ° a L R2 c A R1 f b Units Dimension Limits Pitch Number of Pins Pins along Width Overall Pack. Height Shoulder Height Standoff

7443330150

Abstract: 7443320068
Contextual Info: Power Inductor WE-HCC [Ferrite] 8x8x7; 10x10x9; 12x12x10 mm Size Order Code [mm] Characteristics: • Case size: 8x8x7mm 10x10x9mm 12x12x10mm • Frequency Range: up to 5 MHz • Operating Temperature: up to 125°C • Inductance Range 0.22uH – 10uH • Current Rating:

APM6270

Abstract: generic SPI APM6150 apm62
Contextual Info: APM6270 Малогабаритный 10x10x1.8мм WLAN-модуль, работающий в стандарте 802.11b/g. Он имеет в своем составе интерфейс для подключения одной антенны, радиочастотный и процессорный блоки. Радиочастотный блок обеспечивает высокую

SOP48

Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Contextual Info: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7

Contextual Info: TOP VIEW A A I— I FOR ODD TER M IN AL/SID E DETAIL A SCALE: N /A BOTTOM VIFW NOTE: OFFSET DIE PAD SHOWN IS FOR MAXIM CUSTOM LEAD FRAME. A ll - t A SF.CTION C - C SCALE: N /A y v\ si x i y v\ PROPRIETARY INFORMATION TITLE« PACKAGE O U T LIN E, CUSTDM 68L Q FN , 10x10x0,90 MM

10X10X1

Contextual Info: TOP V I E W sv iyj x ij v \ PROPRIETARY INFORMATION TITLE' P A C K A G E 64L, OUTLINE, 10x10x1,0 MM T Q F P WITH EP DPTIDN DOCUMENT CONTROL NO. 2 1-0084 REV B 1 NOTES! 1. A L L DIMENSIONS AND T O L E R A N C IN G CONFORM TO ANSI Y 1 4.5-1982. 2. DATUM P L A N E I - H - I IS L O C A T E D A T MOLD PARTING L IN E AND COIN CIDEN T WITH L E A D , W H ERE L E A D E X I T S

FL1A-2

Contextual Info: K04-076 Package Type: 44-Lead Plastic Thin Quad Flatpack PT - 10x10x1mm Body 1.0/0.10mm Lead Form E1 E #leads=n1 p D D1 2 1 B n X x 45 ° L a A R2 c Units Dimension Limits Pitch Number of Pins Pins along Width Overall Pack. Height Shoulder Height Standoff

Epcos Ferrite Core Data book 2007

Abstract: B82464Z4XXXM000 EDP marking code 10X10X4
Contextual Info: SMT−Power−Inductors Size 10x10x4,8 mm Datasheet Ordering code: B82464Z4XXXM000 Date: 2007−06−11 Version: 01  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.

7R0M

Contextual Info: SDRS104 Series Features: ● 10X10X4.0mm package, low-profile shielded inductor ● Inductance range from 1.5uH to 330uH ● Ideally for high density board application ● Reel Qty: 800 pieces per reel Dimensions Outline: Unit:mm Top View B Dimensions: in mm

TDA7715

Contextual Info: TDA7715LV 3 band car audio processor Datasheet - production data '!0'03 LQFP64 10x10x1.4mm •  Input multiplexer – QD0 to QD3: quasi-differential stereo input – SE0 to SE4: stereo single-ended input  Loudness – 2nd order frequency response

Contextual Info: Low Noise & High OIP3 Medium Power Amplifier Module SMD-type Last update: 2009. 12. 30. Ic V (mA) APM0400-P33 5.4 600 380 420 19 0.7 10.0 46 -10 -12 33 13x13x3.8 4G LTE APM0742-P29 5 380 698 787 34 0.9 6.6 47 -14 -8 29 10x10x3.8 CDMA Rx APM0837-P29 5 370

Contextual Info: SIDE VIEW - m - BOTTOM VIEW |A SECTION " C - C " SCALE: NONE yv\j\ x iyv\ PROPRIETARY INFORMATION TITLE' PACKAGE OUTLINE, 68L QFN, 10x10x0.9 MM G6800-3 APPROVAL DOCUMENT CDNTRDL NO. 21-0130 REV. A s Y M B COMMON D IM EN S IO N S N T MIN. NOM. MAX. A - 0.90

TDA7715

Contextual Info: TDA7715 3 band car audio processor Datasheet - production data • '!0'03 LQFP64 10x10x1.4mm  Features  Input multiplexer – QD0 to QD3: quasi-differential stereo input – SE0 to SE4: stereo single-ended input  Loudness – 2nd order frequency response

qsop 16 pcb footprint

Abstract: 16 QSOP pcb footprint 4036N qsop 24 footprint 16 soic pcb footprint SOIC-24 SSOP20 300 mil Footprint QS6611 SSOP20 SSOP48
Contextual Info: QQS Selection Guide and Packaging Information UALITY EMICONDUCTOR, INC. Thermal Characteristics Thermal Characteristics of QSI Packages Package H HQSOP, 150-mil HB LF 10x10x1.4 J PLCC square JR PLCC rectangular P PDIP, 300-mil PA TSSOP 170-mil 240-mil 240-mil

automotive keyless go

Abstract: Helmholtz Coil keyless entry 2 axis Helmholtz coil passive entry system equivalent circuit 04-91J axis inductors
Contextual Info: ZC1003 Single Axis Transponder Inductors SMD Z AXIS COIL Low Profile 10x10x3 mm 2.38 mH - 16.2 mH Features Applications This SMD coil offers a very low profile solution for applications in which it’s needed a transponder vertical coil with high sensitivity in z direction and in a small

Contextual Info: SUNON SPECIFICATION FOR APPROVAL CUSTOMER : MOTOR TYPE : DESCRIPTION : MagLev Motor Fan DIMENSIONS : 10X10X3 mm MODEL : UF3A3-700 SUNON SPEC. NO. : D01001041F-00 CUSTOMER APPROVAL NO. APPROVED BY CUSTOMER : : AUTHORIZED DRAWN Nancy 01/07 CHECKED Kiddy March

208-Lead

Abstract: N100
Contextual Info: Package Diagram Plastic Quad Flatpacks 44-Lead Plastic Quad Flatpack 10x10x2.0 mm N44 51-85134-* 1 Package Diagram 52-Lead Plastic Quad Flatpack N52 51-85042 2 Package Diagram 64-Lead Plastic Quad Flatpack N64 51-85036-A 3 Package Diagram 80-Lead Plastic Quad Flatpack (14x20x2.72 mm) N80

Contextual Info: K04-085 Package Type: 64-Lead Plastic Thin Quad Flatpack PT - 10x10x1mm Body 1.0/0.10mm Lead Form E1 E #leads=n1 p D D1 2 1 B n X x 45 ° L R2 c f R1 A2 0.039 0.015 0.002 0.003 0.003 0.005 0.003 0.004 0.007 0.463 0.463 0.390 0.390 0.025 5 5 INCHES NOM 0.020

ADC16DV160

Contextual Info: ADC16DV160 ADC16DV160 Dual Channel, 16-Bit, 160 MSPS Analog-to-Digital Converter with DDR LVDS Outputs Literature Number: SNAS488G ADC16DV160 Dual Channel, 16-Bit, 160 MSPS Analog-to-Digital Converter with DDR LVDS Outputs General Description The ADC16DV160 is a monolithic dual channel high performance CMOS analog-to-digital converter capable of converting analog input signals into 16-bit digital words at rates up to

dspic30f4011 motor control example codes

Abstract: dspic30f4011 pwm threephase DS70046 DS70157 PIC32 PICC-18 CH123SA UART dspic30f4011 DS70135G SCHEMATIC scaler mcu lvds control
Contextual Info: dsPIC30F4011/4012 Data Sheet High-Performance, 16-Bit Digital Signal Controllers 2010 Microchip Technology Inc. DS70135G Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet.

single phase inverter pic16f877

Abstract: DS30292C PIC16F873 block diagram PIC16C7XX PIC 877-20 pic16f877 pwm servo motor PIC16F873 PIC16F877 Free Projects i2c pic16f876/PIC16F877 and serial port interfacing ds33023 pic16f877
Contextual Info: PIC16F87X Data Sheet 28/40-Pin 8-Bit CMOS FLASH Microcontrollers  2001 Microchip Technology Inc. DS30292C “All rights reserved. Copyright 2001, Microchip Technology Incorporated, USA. Information contained in this publication regarding device applications and the like is intended through