103NA Search Results

sd 4841 p

Abstract: sd 4841
Contextual Info: A COMPANY OF M O DEL LPE-4841 In d u c to rs S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d F E A TU R ES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled

sd 4841 p

Abstract: sd 4841 DALE 100MB 471mb marking 333*A
Contextual Info: A COMPANY OF M O DEL LPE-4841 In d u c to rs S u rfa c e M ount, G apped and U ngapped FE A T U R E S • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints

Contextual Info: MODEL LPE-6855 Inductors S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d FEATURES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available

Contextual Info: MODEL LPE-5047 Inductors S u rfa c e M o u n t, G a p p e d an d U n g a p p e d FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available

proton rx 4000 watts power amplifier circuit diagram

Abstract: RCA-CD401 cd22014 ICAN-6362 vogt 545 44 vogt inductor j9 570 17 013 20 RCA-CD4046B common cathode 7 SEGMENT DISPLAY LT 543 CD22014E CD22011
Contextual Info: RCA COS/MOS Integrated Circuits This DATABOOK contains complete technical information on RCA stand­ ard commercial COS/MOS integrated circuits. It covers the full line of RCA standard A- and B-series digital logic circuits, special-function circuits crosspoint switches and level shifters ,

102MB

Contextual Info: M ODEL LPE-4841 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost

o 103na

Abstract: PENI Ci HP 2200
Contextual Info: A COMPANY MODEL LPE-6855 Inductors . O A L E OF , Surface Mount, Gapped and Ungapped FE A T U R E S • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C

micro sd interface with 8051 with circuit

Abstract: BELL MOUTH HP MMIC INA IC Speakerphone sinusoidal "signals generation" table for speaker crossover MSAN-126 128X MT8993
Contextual Info: MT8992/3B Digital Telephone with HDLC i s o 2- c m o s s t - b u s f a m i l y MITEL* H-Phone 9161-002- 103-NA ISSUE 3 Features • • • • • • • • • • • Integrated digital teleph o ne circuit /¿-Law/A-Law codec and filte rs Program m able receive gain

Contextual Info: M ODEL LPE-6562 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available

Contextual Info: MODEL LPE-6855 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times

cl 6562

Abstract: o 103na DALE ELECTRONICS 154NA
Contextual Info: A COMPANY M O D EL L P E -6 562 In d u c to rs . a M C OF , Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available

o 103na

Contextual Info: A COMPANY OF M O D EL L P E -5 047 In d u c to rs Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C

Contextual Info: A COMPANY OF M O DEL L P E -5047 In d u c to rs S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d F E A TU R ES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints

Contextual Info: A COMPANY OF MODEL LPE-6855 Inductors S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints

o 103na

Contextual Info: M ODEL LPE-5047 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C

Contextual Info: MODEL LPE-4841 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times

Contextual Info: M O DEL L P E -6562 In d u c to rs S u rfa c e M o u n t, G a p p e d an d U n g a p p e d FEATURES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled

Contextual Info: M ODEL LPE-5047 Inductors Surface Mount, Gapped and Ungapped j m i O FEATURES • • • • • • • • • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost