100HOURS Search Results

Auto Fuse

Abstract: C0010 C0040302Z 075S 1800-S c0035
Contextual Info: www.elecsound.cn Elecsound Electronics Company Limited Auto Fuse Small Functional Characteristics Testing Blow Time current Min Max 110% 100hours / 135% 0.75s 1800s 200% 0.15s 5s 350% 0.08s 0.25s Min Current Voltage Parts No. Email: jasmine@elecsound.cn Rating

6.2V Zener Diode

Abstract: 12v zener diode voltage reference Zener Chip MB4214 VR 100K FF12 FR 151 diode diode zener 3c2 MB421
Contextual Info: To Top / Lineup / Index FUJITSU SEMICONDUCTOR DATA SHEET DS04-29106-2E ASSP TIMER MB4214 LONG PERIOD TIMER The Fujitsu MB4214 is designed for a long period timer. It contains oscillator, divider 13 stages of flip-flop , output circuit, power supply circuit and comparator (2-ch).

Contextual Info: Reliability Test Result DEVICE : BD9160FVM RESULT n pn pcs (pcs) － 22 100℃(5min) / 0℃ (5min) 10cycles 22 Tstg min (30min) / Tstg max (30min) 100cycles 22 Steady State Operating Life Test Apply the specified voltage at Topr max 1000hours 22 High Temperature Storage

AL-10MR-D

Abstract: AL-20MR-A Mitsubishi Logic Controller AL-6MR-A AL-10MT-D Software AL-20MR-A mitsubishi AL-10MR-D software mitsubishi AL-10MR-A AL-10MR-A mitsubishi AL-10MR-D program SMS BASED DC MOTOR SPEED CONTROLLER
Contextual Info: a The Mitsubishi Alpha Controller A new concept in control solutions, designed for simplicity. Overview Do you need control? Do you Have a building services process to automate? Welcome to the a series controller from Mitsubishi, The Tiny Giant. The a has been designed to provide

resonator SMD MARKING CODE X D

Abstract: LD109 RW109
Contextual Info: REV. ECO REVISIONS DESCRIPTION - DATE Initial Release APPROVED 10/9/2003 RW SPECIFICATIONS OUTLINE DRAWING Part Number XX.X denotes freq. in MHz Frequency Tolerance at 25°C Frequency Stability at - 20°C to +80°C AWSZT-XX.XMWS 8.00 MHz - 13.0 MHz AWSZT-XX.XMWD

BA2901

Contextual Info: Reliability Test Result DEVICE: BA2901 Family RESULT ITEM METHOD n pn pcs (pcs) - 22x3 10sec 22×3 CONDITION Resistance to Soldering Heat<#1> Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat<#1> Soak into solder tub 260±3°C

BD9701CP-V5

Contextual Info: Reliability Test Result DEVICE : BD9701CP-V5 RESULT ITEM Resistance to Soldering Heat *2 METHOD n pn (pcs) (pcs) － 22 CONDITION After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat(*2)

VSON008X2030

Contextual Info: Reliability Test Result DEVICE : BR93H□□-W Series RESULT ITEM METHOD CONDITION n pcs pn(pcs) － 77 x 3 Resistance to Soldering Heat (*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat (*2)

BU52013HFV

Contextual Info: Reliability Test Result DEVICE : BU52013HFV RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock(*1) 100℃(5min) / 0℃ (5min)

bd9842

Abstract: bd98 BD9842FV
Contextual Info: Reliability Test Result DEVICE : BD9842FV RESULT ITEM METHOD n pn pcs (pcs) － 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat(*2)

Contextual Info: Reliability Test Result DEVICE : BA2903S Family RESULT ITEM METHOD n pn pcs (pcs) − 22 x 3 10sec 22 x 3 CONDITION Resistance to Soldering Heat (#1) Soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat (#1) Soak into solder tub 260±3℃

Contextual Info: Reliability Test Result DEVICE : BD9192GUL RESULT ITEM METHOD n pn pcs (pcs) － 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock(*1) 100℃(5min) / 0℃ (5min)

BU52003GUL

Contextual Info: Reliability Test Result DEVICE : BU52003GUL RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock(*1) 100℃(5min) / 0℃ (5min)

BD9134MUV

Contextual Info: Reliability Test Result DEVICE : BD9134MUV RESULT ITEM Resistance to Soldering Heat *2 METHOD n pn (pcs) (pcs) － 22 CONDITION After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260°C) Thermal Shock(*1) 100°C (5min) / 0°C (5min)

BU52004GUL

Contextual Info: Reliability Test Result DEVICE : BU52004GUL RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock(*1) 100℃(5min) / 0℃ (5min)

BR24C21F

Contextual Info: Reliability Test Result DEVICE : BR24C21F RESULT ITEM METHOD n pn pcs (pcs) － 22 CONDITION Resistance to Soldering Heat (*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat (*2)

BA10339

Contextual Info: Reliability Test Result DEVICE: BA10339 Family RESULT ITEM METHOD n pn pcs (pcs) - 22x3 10sec 22×3 CONDITION Resistance to Soldering Heat<#1> Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat<#1> Soak into solder tub 260±3°C

Contextual Info: Reliability Test Result DEVICE : BD9007F RESULT ITEM Resistance to Soldering Heat *2 METHOD n pn (pcs) (pcs) － 22 CONDITION After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat(*2)

BD9300F

Contextual Info: Reliability Test Result DEVICE : BD9300F RESULT ITEM METHOD n pn pcs (pcs) － 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat(*2)

Contextual Info: Reliability Test Result DEVICE : BD2206G RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat (*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat (*2)

Contextual Info: Reliability Test Result DEVICE : BA□□DD0 Series, BA□□DD0W Series RESULT ITEM METHOD n pn pcs (pcs) - 22x3 10sec 22×3 CONDITION Resistance to Soldering Heat<#1> Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat<#1> Soak into solder tub 260±3°C

BD9111NV

Contextual Info: Reliability Test Result DEVICE : BD9111NV RESULT ITEM Resistance to Soldering Heat *2 METHOD n pn (pcs) (pcs) － 22 CONDITION After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260°C) Thermal Shock(*1) 100°C (5min) / 0°C (5min)

ROHM Electronics

Abstract: BD6524HFV
Contextual Info: Reliability Test Result DEVICE : BD6524HFV RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat (*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock (*1) 100℃(5min) / 0℃ (5min)

Contextual Info: Reliability Test Result DEVICE : BD□□KA5 Series, BD□□KA5W Series RESULT ITEM METHOD n pn pcs (pcs) - 22x3 10sec 22×3 CONDITION Resistance to Soldering Heat<#1> Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat<#1> Soak into solder tub 260±3°C