100 QFP 14 X 14 Search Results

SMC91C94

Abstract: 7S747
Contextual Info: PIN CONFIGURATION [§8b.s lot SSftSiS 11§ 11 2 iu % B 'j # 3 5 g S » < x l a ïïlïiS iiïil^is^ Ê ïssiso S S ïlaî 1 1 1 &C797877 7 6 7S747 3 7 2 7 1 7 0 6 9 6 8 6 7 8 6 6S 646 3 9 2 6 1 6 0 S 9W S ?S 6S S *J 48 48 SMC91C94 100 Pin QFP 1 2 3 4 & S 7 8 » 10 11 12 13 14 15 19 17 18 18 W 2 1 2 2 » 2 4 2 S ? 6 27282®

z80 pio

Abstract: Z80 CPU DIMENSIONS zilog z86E08 DRAM 18DIP Z80 SIO z86c04 package Z16C3001ZCO zilog ctc datasheet z80 z80 dma
Contextual Info: 2002 Product Line Card Z8 OTP Multi-Purpose Microcontrollers OTP KB 8 8 0.5 0.5 1 1 2 4 8 8 8 RAM (Bytes) 237 236 61 61 125 125 125 188 236 236 236 I/O 24 32 14 14 14 14 14 32 32 32 32 INT 6 6 5 6 6 6 6 5 6 6 6 On-Chip Special Features POR POR POR, LV Protect

TMP90PM40N

Abstract: TMP91C640N TMP91C642AN TMP87CM38N TMP90PM40F TMP86PP11AN TMP97CW42AF TMP91C640 tmp90ch42df TMP90P802AP
Contextual Info: Microcomputer & Peripheral LSIs 4-Bit Microcontrollers z 14 8-Bit Microcontrollers z 18 16-Bit Microcontrollers z 25 Development System Tools z 30 64-Bit RISC Processors z 58 32-Bit RISC Processors z 58 LL Microcontrollers and Peripheral LSIs z 61 Microcontrollers with Built-in CAN z 62

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Contextual Info: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

MSC1937-01

Abstract: rockwell 10937 4 digit 7 segment display 36 pin configuration 4 digit 7 segment display 36 pin internal configuration MSC1937-01RS 14 segment display 38 PIN vacuum fluorescent display 10937 AD14 MSC1937-01GS-K
Contextual Info: E2C0026-27-Y3 ¡ Semiconductor MSC1937-01 ¡ Semiconductor This version:MSC1937-01 Nov. 1997 Previous version: Jul. 1996 14/16-Segment ¥ 16-Digit Display Controller/Driver GENERAL DESCRIPTION MSC1937-01 is a Bi-CMOS alphanumeric display controller designed to interface with either

Contextual Info: Spartan-XL 3.3V FPGA Automotive IQ Family: Introduction and Ordering R DS107-1 v1.3 June 14, 2004 Product Specification Introduction The Spartan -XL 3.3V FPGA Automotive IQ product family is a high-volume production FPGA solution that delivers all the key requirements for ASIC replacement up to 40,000

rockwell 10937

Abstract: 16 segment display pin configuration 2f 1001 oki 38 PIN vacuum fluorescent display alphanumeric display 16 pin MSC1937 MARK AD9 AD10 AD11 MSC1937-01
Contextual Info: E2C0026-27-Y3 O K I Semiconductor P revious version: Jul. 1996 MSC1937-01 14/16-Segment x 16-Digit Display Controller/Driver GENERAL DESCRIPTION MSC1937-01 is a Bi-CMOS alphanumeric display controller designed to interface with either vacuum fluorescent display.

rockwell 10937

Abstract: MSC1937 4 digit 7 segment display 36 pin configuration 38 PIN vacuum fluorescent display
Contextual Info: M SC1937-01 14/16-Segment x 16-Digit Display Controller/Driver GENERAL DESCRIPTION MSC1937-01 is a Bi-CMOS alphanumeric display controller designed to interface with either vacuum fluorescent or LED type displays. MSC1937-01 can drive displays with up to 16 digits with either 14 or 16 segments plus a decimal

AN 7823

Abstract: 100L JESD51-2 JESD51-7 Techpoint
Contextual Info: MQFP-d Heat Spreader Metric Quad Flat Pack • 14 x 14mm to 32 x 32mm • 64 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 14mm to 32 x 32mm STATS ChipPAC’s Heat Spreader Metric Quad Flat Pack MQFP-d is a thermally enhanced version of the QFP

100L

Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint
Contextual Info: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP

780824b

Abstract: 780851 78p064 78F0233 NEC 78F0078 780021AS 78074B NEC Electronics uPD Series 78F0058 78F0828
Contextual Info: HOME SOLUTIONS PRODUCTS TECHNOLOGY HIGHLIGHTS SUPPORT COMPANY PROFILE NEWS AND EVENTS MICROCOMPUTER Microcomputer HOME Product Overview 8bit 78K0 Series : Development Environment NEC Electronics Tools Hardware Tools Product Lineup Development Environment Common Hardware Tools

PCB footprint cqfp 132

Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

zpd n

Abstract: Mouse Controllers Z86CCP00ZEM Z86C02 Z86C03 Z86C04 Z86C06 Z86E02 Z86E03 UART 40-pin DIP
Contextual Info: Z8 Microcontroller & DSP Line Card MA PSP DSD GC ard click on product names below IIRR Set-Top Set-Top MMOODE DEMM p hiip C V h V- C ceD Ti A VDo W W WW W WW W W W W W V TTTTVVV t IIInInnntttteeeerrrrnnnneeeettt io on at ti ul ula nn Em m E tiotio ua a al lu

FPT-100P-M15

Abstract: 216-0040
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M15 100-pin plastic QFP Lead pitch 0.65 mm Package width x package length 14 × 20 mm Lead shape Gullwing Sealing method Plastic mold

MO-83-AF

Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

SCF5250LAG100

Abstract: SCF5250AG120 SCF5250CAG120 SCF5250CPV120 SCF5250PV120 LQFP-144 SCF5250 memory stick m2 specs MAPBGA196 low cost processor
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: SCF5250EC Rev. 1.3, 07/2006 SCF5250 Package Information MAPBGA–196 LQFP-144 SCF5250 Integrated ColdFire Microprocessor Data Sheet 1 Introduction This document provides an overview of the SCF5250

QFP100-P-1420-4

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M06 EIAJ code :∗QFP100-P-1420-4 100-pin plastic QFP Lead pitch 0.65 mm Package width x package length 14 × 20 mm Lead shape Gullwing

QFP100-P-1420-5

Abstract: fujitsu
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M07 EIAJ code :∗QFP100-P-1420-5 100-pin plastic QFP Lead pitch 0.65 mm Package width x package length 14 × 20 mm Lead shape Gullwing

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
Contextual Info: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

Contextual Info: Document Number: SCF5250EC Rev. 1.3, 07/2006 Freescale Semiconductor Data Sheet: Technical Data SCF5250 Package Information MAPBGA–196 LQFP-144 SCF5250 Integrated ColdFire Microprocessor Data Sheet 1 Introduction This document provides an overview of the SCF5250

AD5327

Abstract: AD5805 AD5065 AD7801 AD5300 AD5301 AD5302 AD5330 AD5337 AD557
Contextual Info: Precision DACs Part Number Bits Outputs Interface Package Price @ 1k $U.S. Description Low Voltage, Single Supply (Unipolar Voltage Output with Operation at 5 V and Below) AD5300 8 1 SPI 6-lead SOT-23 1.12 140 A typ at 5 V AD5601 8 1 SPI 6-lead SC70 0.89

LQFP-48 thermal pad

Abstract: exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad 2-CQFP SOT23-6 1152 BGA 144
Contextual Info: Thermal Characteristics of IC Assembly method for using this board is specified by the SEMI standard G38-87. These standards are available in the SEMI International Standards book, Volume 4, for packaging. INTRODUCTION The purpose of this document is to provide a centralized

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MCF51JM128 Rev. 4, 05/2012 MCF51JM128 MCF51JM128 ColdFire Microcontroller 80 LQFP 14 mm  14 mm 64 LQFP 10 mm  10 mm 44 LQFP 10 mm  10 mm 64 QFP 14 mm  14 mm The MCF51JM128 is a member of the ColdFire family of

AD5327

Abstract: AD7849 AD5372 ad5627 AD5628 ad7112 AD7808 DAC8413 AD5390 AD7248
Contextual Info: 型号 AD5379 AD5371 新 AD569 位数 输出 接口 14 40 SPI, parallel 108 引脚 CSP_BGA SPI, LVDS 80 引脚 LQFP, 100 引脚 CSP_BGA 14 16 AD669 16 40 1 Parallel 1 Parallel 封装 描述 型号 denseDAC; 用户可编程增益与失调；17.5 V输出范围