10-LEAD FLAT PACK Search Results

Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L32.5x6C (One of 10 Packages in MDP0046) 32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) A MILLIMETERS D N (N-1)

jedec package MO-220

Abstract: l38 transistor MO-220
Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L38.5x7B (One of 10 Packages in MDP0046) 38 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) A MILLIMETERS D N (N-1)

MO-220

Abstract: ne 002
Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L32.5x6B (One of 10 Packages in MDP0046) 32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) A MILLIMETERS D N (N-1)

MO-220

Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L32.5x6C (One of 10 Packages in MDP0046) 32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) A MILLIMETERS D N (N-1)

Contextual Info: Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package QFN Micro Lead Frame Plastic Package (MLFP) L38.5x7B (One of 10 Packages in MDP0046) 38 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) A MILLIMETERS D N (N-1)

MO-255

Abstract: TB389
Contextual Info: Plastic Packages for Integrated Circuits Ultra Thin Quad Flat No-Lead Plastic Package UTQFN D 6 INDEX AREA A L10.1.8x1.4A B N 10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS E SYMBOL 2X MIN NOMINAL MAX NOTES 0.10 C 1 2X 2 0.10 C TOP VIEW

MO-229

Abstract: NX 38 TB389
Contextual Info: Plastic Packages for Integrated Circuits Thin Dual Flat No-Lead Plastic Package TDFN L10.3x3B 2X 10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE 0.15 C A A D MILLIMETERS 2X 0.15 C B E SYMBOL MIN NOMINAL MAX NOTES A 0.70 0.75 0.80 - A1 - - 0.05 - A3 6 INDEX

TB389

Contextual Info: Plastic Packages for Integrated Circuits Dual Flat No-Lead Plastic Package DFN 2X 0.15 C A D A L10.3x3 10 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS 2X 0.15 C B E 6 INDEX AREA SYMBOL MIN 0.80 0.90 1.00 - - - 0.05 - 0.28 5,8 2.05 7,8 1.65 7,8 0.20 REF

TB389

Abstract: TIP 06
Contextual Info: Plastic Packages for Integrated Circuits Ultra Thin Quad Flat No-Lead Plastic Package UTQFN D 6 INDEX AREA A L10.2.1x1.6A B N 10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS E SYMBOL 2X MIN NOMINAL MAX 1 2X 2 0.10 C TOP VIEW C A 0.05 C SEATING PLANE

NX 38

Abstract: TB389
Contextual Info: Plastic Packages for Integrated Circuits Dual Flat No-Lead Plastic Package DFN L10.3x3C 2X 0.10 C A A 10 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE D MILLIMETERS 2X 0.10 C B E MAX NOTES A 0.85 0.90 0.95 - A1 - - 0.05 - A C SEATING PLANE D2 0.10 C D2 0.08 C 7

MO-229

Abstract: TB389
Contextual Info: Plastic Packages for Integrated Circuits Thin Dual Flat No-Lead Plastic Package TDFN L10.3x3A 2X 0.10 C A A 10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE D MILLIMETERS 2X 0.10 C B E B // A C SEATING PLANE D2 (DATUM B) 6 INDEX AREA 0.10 C 0.08 C A3 SIDE VIEW

JESD51-7

Abstract: 100L JESD51-2 STATS ChipPAC Techpoint
Contextual Info: MQFP Metric Quad Flat Pack • 10 x 10mm to 32 x 32mm body sizes • 44 to 240 lead counts • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 10 x 10mm to 32 x 32mm STATS ChipPAC’s Metric Quad Flat Pack MQFP is a leadframe based, plastic encapsulated package with gull

FPT48PM13

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M13 48-pin plastic QFP Lead pitch 0.80 mm Package width x package length 10 × 10 mm Lead shape Gullwing Sealing method Plastic mold

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M11 44-pin plastic QFP Lead pitch 0.80 mm Package width x package length 10 × 10 mm Lead shape Gullwing Sealing method Plastic mold

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L10.2.1x1.6A 10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 5, 3/10 8. PIN 1 INDEX AREA 2.10 A B PIN #1 ID 1 0.05 MIN. 1 8. 4 4X 0.20 MIN. 1.60 0.10 MIN. 10 5 0.80 10X 0.40 0.10 6 9

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L40.6x6 40 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 3, 10/06 4X 4.5 6.00 36X 0.50 A B 6 PIN 1 INDEX AREA 6 PIN #1 INDEX AREA 40 31 30 1 6.00 4 . 10 ± 0 . 15 21 10 0.15 4X 11 20 0.10 M C A B

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L20.4.0x5.5 20 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 5, 3/15 0.10 10X 0.50 2.10 4.00 0.300 A 0.66 R0.0750 0.30 B 11 4 20 10 X 0.50 2X1.30 5.50 R0.0750 2.20 PIN #1 INDEX AREA 6 0.10 10 2X

MO-229-WEED-3

Abstract: JEDEC MO-229
Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L10.3x3A 10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 5, 3/10 3.00 A 2.0 REF 6 PIN 1 INDEX AREA 8X 0.50 BSC B 5 1 6 PIN 1 INDEX AREA 10X 0 . 30 3.00 1.50 0.15 4X 10 0.10 M C A B 0.05 M C

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L16.4x4G 16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 4/10 4X 1.95 4.00 12X 0.65 A B 13 6 PIN 1 INDEX AREA 6 PIN #1 INDEX AREA 16 1 4.00 12 2 . 10 ± 0 . 10 9 4X 4 0.15 8 TOP VIEW

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L40.6x6S 40 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 10/09 4X 4.5 6.00 36X 0.50 A B 31 40 30 6 PIN #1 INDEX AREA 1 6 PIN 1 INDEX AREA 6.00 3 . 20 ± 0 . 10 21 4X 10 0.15 20 11 0.10 M C A B

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L36.6x6C 36 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 4/10 4X 4.0 6.00 36X 0.50 A B 28 6 PIN 1 INDEX AREA 36 27 6 PIN #1 INDEX AREA 6.00 1 4 .10 ± 0.10 9 19 4X 0.15 18 10 TOP VIEW 36X 0.60 ± 0.10

MO-229

Abstract: ISL99202
Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L12.3x3Z 12 LEAD THIN QUAD FLAT NO LEAD PLASTIC PACKAGE FOR ISL99202 USE ONLY WITH REDUCED e-PAD SIZE TO 1.4mm ON LAND PATTERN Rev 0, 10/08 3.00 0.5 BSC A B 6 12 10 PIN #1 INDEX AREA 6 3.00 4X 1.70 REF

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L26.17x17 26 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE PUNCH QFN Rev 4, 10/12 17.8±0.2 17.0±0.2 9 8 9 7 6 5 4 3 2 8 7 6 5 4 3 2 1 26 1 26 10 10 25 25 17.0±0.2 17.8±0.2 11 11 24 23 12 24 23

MO-255

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L10.1.8x1.4A 10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 5, 3/10 1.80 B 6 PIN #1 ID A 1 1 1.40 3 10 0.50 6 PIN 1 INDEX AREA 9 X 0.40 2 10X 0.20 4 0.10 M C A B 0.05 M C 0.70 8 5 0.10