1.27 PAD LAYOUT Search Results

C10943X

Contextual Info: Mounting pad of tape BGA The drawings of tape BGA mounting pads are shown in Figure 1-15, followed by Table 1-9, which provides detailed information of these pads. Figure 1-15. Mounting Pad Dimensions of Tape BGA 352 pins 35 x 35 1.27 x 25 = 31.75 1.27 x 19 = 24.13

Stanyl

Contextual Info: MOUNTING PAD LAYOUT 1.723 [43.76] MIN.-282 [7.16] REF. 078 [1.98] DIA. HOLE. .265 [6.73] a -I .289 [7.34] MIN ± . 0 0 5 [ ± 0 .15 ] 2 PLS 250 [6.35] MIN. (2) PLS 1.360 [34.52] MAX. rex + 1.723 [43.76] 1.030 [26.16] U .050 [1.27] DIA. x .050[1.27] L. LEG

LS 7112

Contextual Info: PCB-Mounted Receptacle Assemblies _ 2.54 mm 0.100 in. D escription Double Row (Dual-Entry) 68046 RECOMMENDED PCB PAD LAYOUT DIM A Double Row With Holddowns (Top Entry Only) RECOMMENDED PCB PAD LAYOUT 1.27 mm (0.050 in.) MIN Double Row With Holddowns (Dual-Entry)

a 69154

Abstract: 69154 BERG 6 pin dual row BUS-12-055 LR46923 dc/s41 621
Contextual Info: PCB-Mounted Receptacle Assemblies 2.54 mm 0.100 in. D escription Double Row (Dual-Entry) 68046 RECOMMENDED PCB PAD LAYOUT Double Row With Holddowns (Top Entry Only) 68622 RECOMMENDED PCB PAD LAYOUT 1.27 mm (0.050 in.) MIN Double Row With Holddowns (Dual-Entry)

TCXO rakon E3179

Abstract: RAKON E3179
Contextual Info: E3179 SMD TCXO GR-1244 & GR-253 STRATUM 3 -Outline mm 7.0±0.15 Supply Voltage 1 2 3 8 7 6 0.81 4 5 9 0.6 Underside View 2.03 0.80 10 Solder Pad Layout 2.54 0.63 2.03 1.0 1.27 1.27 ▪▪ HCMOS ▪▪ Load: 15pF max ▪▪ VOL: <10% VS ▪▪ VOH: >90% VS

Contextual Info: 7 8 1. MECHANICAL DIMENSIONS B B 8.89 [0.350] GO CT> 00 o □□□□□□O' 0.76 [0.030] 1.27 [0.050] SUGGESTED PAD LAYOUT D D o. j=snn r a n p 0.51 [0.020] 0.89 [0,035] ©mpQononit 1.27 [0.050] re x MULTIPLE MULTIPLE ASM 4F, Ha Guang S t, No. 347,Yarn

Contextual Info: 8 1. MECHANICAL DIMENSIONS : .89 [0.350 IE,70 [0.500] •nnnnnnnn B f nj B KXmultiple XDGS1601CC1 YYWW ooooooo: yyyyyy 8.89 [0.350] 0,76 [0,030] 1.91 [0.075] 1.27 [0,050] SUGGESTED PAD LAYOUT Jn rü-0-l L o m a u OJ 0.51 [0,020] 0,89 [0,035] 1.27 [0.050] o m p Q I a o iift

E3199

Contextual Info: E3199 SMD TCXO STRATUM 3 Outline mm 7.0±0.15 Supply Voltage 1 2 3 8 7 6 0.81 4 5 9 0.6 Underside View 2.03 0.80 10 Solder Pad Layout 2.54 0.63 2.03 1.0 1.27 1.27 ▪▪ HCMOS ▪▪ 15pF max ▪▪ VoL: ≤10% VS ▪▪ VoH: ≥90% VS ▪▪ Duty Cycle @ 50%: 45/55%

Contextual Info: E2747 SMD TCXO STRATUM 3 Outline mm 7.0±0.15 Supply Voltage 1 2 3 8 7 6 0.81 4 5 9 0.6 Underside View 2.03 0.80 10 Solder Pad Layout 2.54 0.63 2.03 1.0 1.27 1.27 ▪▪ HCMOS ▪▪ 15pF max ▪▪ VoL: ≤10% VS ▪▪ VoH: ≥90% VS ▪▪ Duty Cycle @ 50%: 45% to 55%

RAKON

Contextual Info: E2791 SMD TCXO GR-1244 & GR-253 STRATUM 3 Outline mm 7.0±0.15 Supply Voltage 1 2 3 8 7 6 5 0.6 Underside View 9 0.81 4 2.03 0.80 10 Solder Pad Layout 2.54 0.63 2.03 1.0 1.27 1.27 ▪▪ HCMOS ▪▪ 15pF max ▪▪ VoL: ≤10%VS ▪▪ VoH: ≥90%VS ▪▪ Duty Cycle @ 50%: 45/55%

208H

Contextual Info: 1. M echanical Dimensions: 2. S chem afic: 2.54 5X0.71 — 1.27 r - 2 .5 4 1.27 a r-0 d x -i I i I □ un o r □ □ m ca -H □ A 5UGGE5TED PAD LAYOUT 3.81 ± 0.38 3. Electrical S pecifications: Im pedance Ratio: 1.5:1 ± 2 % Turns Ratio: 1.22:1 ± 2 % Bandwidth: 1-1000M H z 1.0dB Typ

Contextual Info: *R oH S CO M PL IA NT Features • 1.27 mm pitch ■ RoHS compliant* - see processing ■ Precious metal contacts information on RoHS compliant modular contacts ■ For applications/processing guidelines, click here ■ Twin hot contacts symmetrical pad layout

Contextual Info: *R oH S CO M PL IA NT Features • 1.27 mm pitch ■ RoHS compliant* - see processing ■ Precious metal contacts information on RoHS compliant modular contacts ■ For applications/processing guidelines, click here ■ Twin hot contacts symmetrical pad layout

Contextual Info: *R oH S CO M PL IA NT Features • 1.27 mm pitch ■ RoHS compliant* - see processing ■ Precious metal contacts information on RoHS compliant modular contacts ■ For applications/processing guidelines, click here ■ Twin hot contacts symmetrical pad layout

c 220nj

Abstract: 330nj 63 470nj 100nj 100 SMCC1008-620NJ SMCC1008-680NJ 680nj
Contextual Info: 2.54 2.03 Max 2.79 Max 1.02 2.92 Max 1.52 1.27 0.51 Dimensions in mm Pad Layout FEATURES • Ceramic core, wire wound for superior performance • Very stable electrical properties • High SRF • Designed for pick and place APPLICATIONS • LC Resonant circuits

Contextual Info: PL IA NT Features CO M • 1.27 mm pitch ■ For applications/processing guidelines, click here *R oH S ■ Precious metal contacts ■ Twin hot contacts symmetrical pad layout ■ Pick & place compatible ■ High cycle life ■ RoHS compliant* - see processing

Contextual Info: PL IA NT Features • For applications/processing CO M ■ 1.27 mm pitch guidelines, click here *R oH S ■ Precious metal contacts ■ Twin hot contacts symmetrical pad layout ■ Pick & place compatible ■ High cycle life ■ RoHS compliant* - see processing

Contextual Info: PL IA N T Features • RoHS compliant* - see processing CO M ■ 1.27 mm pitch *R oH S ■ Precious metal contacts ■ Twin hot contacts symmetrical pad layout ■ Pick & place compatible ■ High cycle life information FOR RoHS compliant modular contacts

70AB

Contextual Info: PL IA NT Features Applications *R oH S CO M 1.27 mm pitch 3 to 4 precious metal contacts Twin hot contacts symmetrical pad layout Pick & place compatible High cycle life RoHS compliant* - see processing information on lead free modular contacts Handheld communications - mobile

Contextual Info: PL IA N T Features • RoHS compliant* - see processing CO M ■ 1.27 mm pitch *R oH S ■ Precious metal contacts ■ Twin hot contacts symmetrical pad layout information on RoHS compliant modular contacts ■ Pick & place compatible ■ High cycle life

Contextual Info: PL IA N T Features • RoHS compliant* - see processing CO M ■ 1.27 mm pitch information on RoHS compliant modular contacts *R oH S ■ Precious metal contacts ■ Twin hot contacts symmetrical pad layout ■ Pick & place compatible ■ High cycle life

SF-BGA119A-B-11

Contextual Info: D Package Code: BGA119A C 7.62mm [0.300"] See BGA pattern code to the right for actual pattern layout Y 20.32mm [0.800"] X Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"] 1.27mm [0.050"]

BGA153

Abstract: SF-BGA153A-B-11
Contextual Info: D Package Code: BGA153A C 10.16mm [0.400"] 1.27mm [0.050"] See BGA pattern code to the right for actual pattern layout Y X 20.32mm [0.800"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"]

Contextual Info: PL IA NT Features CO M • 1.27 mm pitch ■ For applications/processing guidelines, click here *R oH S ■ Precious metal contacts ■ Twin hot contacts symmetrical pad layout ■ Pick & place compatible ■ High cycle life ■ RoHS compliant* - see processing