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    0F10S Search Results

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    0F10S Price and Stock

    PEI-GENESIS

    PEI-GENESIS MS3100F10SL-4P

    CONN RCPT MALE 2P SILV SLDR CUP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MS3100F10SL-4P Bag 873 1
    • 1 $73.78
    • 10 $59.94
    • 100 $36.89
    • 1000 $36.89
    • 10000 $36.89
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    PEI-GENESIS CA3100F10SL-4SF80

    CONN RCPT FMALE 2P SILVER CRIMP
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    DigiKey CA3100F10SL-4SF80 Bag 873 1
    • 1 $98.65
    • 10 $80.15
    • 100 $49.33
    • 1000 $49.33
    • 10000 $49.33
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    PEI-GENESIS CB0F10SL-4S0

    CB 3C 3#16S SKT RECP WALL
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CB0F10SL-4S0 234 1
    • 1 $40.22
    • 10 $37.92
    • 100 $31.60
    • 1000 $31.60
    • 10000 $31.60
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    PEI-GENESIS CA3100F10SL-4SB

    CONN RCPT FMALE 2P SILV SLDR CUP
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    DigiKey () CA3100F10SL-4SB Bag 234 1
    • 1 $40.37
    • 10 $38.06
    • 100 $31.72
    • 1000 $31.72
    • 10000 $31.72
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    CA3100F10SL-4SB Bag 66 1
    • 1 $111.40
    • 10 $70.14
    • 100 $36.42
    • 1000 $36.42
    • 10000 $36.42
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    PEI-GENESIS CA3100F10SL-4PB

    CONN RCPT MALE 2P SILV SLDR CUP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CA3100F10SL-4PB Bag 234 1
    • 1 $40.25
    • 10 $37.95
    • 100 $31.63
    • 1000 $31.63
    • 10000 $31.63
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    Find more 0F10S price and stock on Findchips.com

    0F10S Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    s46 hall

    Abstract: AL233 hall s41 AL205 s05 hall AL207 XCB56007 s41 hall IDT74FCT821A MCM6206
    Contextual Info: Design Considerations Heat Dissipation Power, Ground, and Noise Design Considerations Heat Dissipation The average chip junction temperature, TJ, in °C, can be obtained from: TJ = TA + PD x ΘJA Where: NOTE: Table 8 (page 17) contains the package thermal


    Original     		XCB56007FJ50 80-pin DSP56004ROM DSP56004FJ50 DSP56004 XCB56007FJ66 DSP56004/007 s46 hall AL233 hall s41 AL205 s05 hall AL207 XCB56007 s41 hall IDT74FCT821A MCM6206 PDF

    htx 3

    Contextual Info: Design Considerations Chip Enhancements The DSP56004 has undergone revisions to incorporate enhanced features and perfor­ mance. To determine the feature set of a specific piece of silicon, check the chip's mask set against the feature list in Table 34 on the following page. Some sections of this document


    OCR Scan     		DSP56004 DSP56007 DSP56L007 DSP56004/007 htx 3 PDF