Part Number
    Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    0F10S Search Results

    SF Impression Pixel

    0F10S Price and Stock

    Select Manufacturer

    Amphenol Aerospace 9440F10S-2S

    RECEPT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 9440F10S-2S Bulk 9
    • 1 -
    • 10 $137.75
    • 100 $137.75
    • 1000 $137.75
    • 10000 $137.75
    		Buy Now

    Amphenol Aerospace 9440F10S-2A

    RECEPT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 9440F10S-2A Bulk 9
    • 1 -
    • 10 $138.13
    • 100 $138.13
    • 1000 $138.13
    • 10000 $138.13
    		Buy Now

    Amphenol Aerospace 9440F10SL-3B

    RECEPT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 9440F10SL-3B Bulk 8
    • 1 -
    • 10 $159.58
    • 100 $159.58
    • 1000 $159.58
    • 10000 $159.58
    		Buy Now

    Amphenol Aerospace 9440F10SL-4P

    RECEPT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 9440F10SL-4P Bulk 7
    • 1 -
    • 10 $186.26
    • 100 $186.26
    • 1000 $186.26
    • 10000 $186.26
    		Buy Now

    Amphenol Industrial Operations GTS030F-10SL-4P

    RECEPT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey GTS030F-10SL-4P Bulk 25
    • 1 -
    • 10 -
    • 100 $65.69
    • 1000 $65.69
    • 10000 $65.69
    		Buy Now
    RS GTS030F-10SL-4P Bulk 14 Weeks 25
    • 1 -
    • 10 -
    • 100 $138.44
    • 1000 $127.36
    • 10000 $127.36
    		Get Quote
    Find more 0F10S price and stock on Findchips.com

    0F10S Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    s46 hall

    Abstract: AL233 hall s41 AL205 s05 hall AL207 XCB56007 s41 hall IDT74FCT821A MCM6206
    Contextual Info: Design Considerations Heat Dissipation Power, Ground, and Noise Design Considerations Heat Dissipation The average chip junction temperature, TJ, in °C, can be obtained from: TJ = TA + PD x ΘJA Where: NOTE: Table 8 (page 17) contains the package thermal


    Original     		XCB56007FJ50 80-pin DSP56004ROM DSP56004FJ50 DSP56004 XCB56007FJ66 DSP56004/007 s46 hall AL233 hall s41 AL205 s05 hall AL207 XCB56007 s41 hall IDT74FCT821A MCM6206 PDF

    htx 3

    Contextual Info: Design Considerations Chip Enhancements The DSP56004 has undergone revisions to incorporate enhanced features and perfor­ mance. To determine the feature set of a specific piece of silicon, check the chip's mask set against the feature list in Table 34 on the following page. Some sections of this document


    OCR Scan     		DSP56004 DSP56007 DSP56L007 DSP56004/007 htx 3 PDF