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| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
bare dieContextual Info: TN-00-14: Quality/Reliability Requirements for Bare Die Introduction Technical Note Understanding the Quality and Reliability Requirements for Bare Die Applications Introduction With the advent of multichip modules MCMs and system in a package (SiP) applications, customer demand for known good die (KGD) has increased. In many cases, |
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tn-00-1409005aef83ca256c/source09005aef83ca2578tn0014+1 |