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Micron NAND

Abstract: TN-00-19 TN0019
Contextual Info: TN-00-19: Thinning Considerations Introduction Technical Note Thinning Considerations for Wafer Products Introduction With increased use of wafer- and die-level products comes added logistic and process considerations. For customers who thin Micron’s wafers, this document contains information helpful for determining the optimal wafer-thinning processes to meet their