08JUN0 Search Results

1714506

Abstract: 1979842-2 2006989 hssdc - db9 1837 1948134-1
Contextual Info: 107-68675 Packaging Specification 08Jun09 Rev M SFP CABLE 1. PURPOSE 目的 Define the packaging specifiction and packaging method of SFP CABLE. 订定 SFP CABLE 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 Product Description

Contextual Info: THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOG G ALL RIGHTS RESERVED. DIST R E V IS IO N S 05 LTR B1 D DESCRIPTION REV PER ^ ECR 0 5 - 0 0 4 2 4 7 STAMP "AMP 8 * " 0.00254 DWN APVD 08JUN05 JR TM D

Contextual Info: THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. BY TYCO ELECTRONICS CORPORATION. 2 3 4 - ,- R E V IS IO N S P LTR C DESCRIPTION DATE ECO—0 7 —0 1 2 8 6 1 DWN APVD KW DB 08JUN07 D D 0.48 + 0.08 C 0.38 A +-0.25 C 1 .57 + 0.08

Contextual Info: 8 7 THIS DRAWING IS UNPUBLISHED. ARX 'T V COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. 6 5 4 2 3 - ALL RIGHTS RESERVED. LOC DIST GP 00 R E V IS IO N S P LTR DESCRIPTION B D DATE 08JUN06 REVISED PER ECO-06-002423 A H O U S IN G - M A T E R IA L

26B0

Abstract: amp 822030 B334 jedec MO-116
Contextual Info: 6 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 4 5 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. LOC DIST AG 53 REVISIONS LTR DESCRIPTION S A D 1 7 .3 7 [.290] APVD 08JUN06 JDP MDB REVISED PER E C O -0 6 -0 0 2 4 2 3 H O U S I N G - M A T E R I A L : LIQU ID —C R Y S T A L — P O L Y M E R .

Contextual Info: THIS DRAWING IS UNPUBLISHED. kLU COPYRIGHT - 6 7 8 RELEASED FOR PUBLICATION 5 3 2 - ,- ALL RIGHTS RESERVED. BY TYCO ELECTRONICS CORPORATION. LOC DIST DF DO REVISIONS P LTR L DESCRIPTION REVISED PER E C O -0 9-01 31 25 DATE DWN APVD 08JUN09 CT RL D D C C RECOMMENDED

MIL-C-17

Abstract: AMP Spec 109-35
Contextual Info: ~ tL ¡C O J Electronics A M P 1 0 8 -1 2 0 7 8 Product Specification 08Jun00 Rev B EC 0990-0757-00 BNC PCB Straight and Right Angle Connectors 1. SCOPE 1.1. Content This specification covers the performance, tests and quality requirements for the AMP* BNC printed

4-1473562-4

Abstract: MR1000
Contextual Info: 107-68880 Packaging Specification 08Jun09 Rev A RITS CONN ASSY 1. PURPOSE 目的 Define the packaging specifiction and packaging method of RITS CONN ASSY. 订定 RITS CONN ASSY. 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 Product

EIA-364-20

Abstract: EIA-364-21 EIA-364-28 EIA-364-9
Contextual Info: Product Specification 108-1973 08Jun07 Rev B Multi-Beam XL* Board Mount Receptacle or Plug Connector System 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the Tyco Electronics MultiBeam XL* Board Mount Receptacle or Plug Connectors.

B4192

Contextual Info: 107-68032 Packaging Specification 08Jun09 Rev D DDR3 DIMM ASSY 1. PURPOSE 目的 Define the packaging specifiction and packaging method of AMP 1mm std. card edge 242 dual pos. 订定 AMP 1mm std. card edge 242 dual pos. 产品之包装规格及包装方式。

Contextual Info: 4 TH IS DRAWING IS U N P U B L IS H E D . COPYRIGHT 3 RELEASED FOR A LL 2 PUBLIC ATIO N RIG HTS REVIS IO N S R E S ER V ED . BY TYCO ELECTRONICS CORPORATION. P LTR J2 D E S C R IP TIO N DATE REMISED PER E C O - 0 9 - 0 1 3 58 5 DWN 08JUN09 APVD HMR WM PANEL CUT OUT

f936

Abstract: F93-6 F312
Contextual Info: 4 TH IS D R AW IN G IS U N P U B LIS H E D . RELEASED FOR P U B LIC A T IO N ALL C O P Y R IG H T BY TYCO 2 3 ELECTRONICS R IG H TS - , - LOC RESERVED. CORPORATION. D IST REVISIONS 5- D E S C R IP T IO N c E C O —0 7 —0 1 2 8 6 1 08JUN07 KW REVISED

MP1470

Contextual Info: TH I S DRAW ING I S U N P U B L I S H E D . COP Y R I G H T R E L E A S E D POR P U B L I C A T I ON BY 20 TYCO ELECTRONICS CORPORATION ALL RIGHTS REVISIONS RESERVED. LTR D E S C R I P T I ON DATE R E L E A S E PE R O A O O - O I 8 5 - 0 4 R E V I S E PER OAOO-O I 2 8 - 0 5

Contextual Info: 4 3 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. “ . — LOC ALL RIGHTS RESERVED. REVISIONS DIST AD 00 LTR DESCRIPTION OWN DATE MB MZ 08JON04 REV PER EC 0G3C—0212—04 APVD SPECIFICATIONS; .4 1 3 .5 1 2

PTCSL20T071DBE

Abstract: PTCSL20T081DBE PTCSL20T091DBE PTCSL20T111DBE PTCSL20T121DBE PTCSL20T131DBE PTCSL20T141DBE thermistor ntc 104
Contextual Info: 2381 671 911./PTCSL.T.BE Vishay BCcomponents PTC Thermistors, Mini Radial Leaded for Over-Temperature Protection FEATURES • Well-defined protection temperature levels • Fast reaction time < 15 s in still air • Accurate resistance for ease of circuit design

70CRU02

Abstract: IRFP250
Contextual Info: 70CRU02 Vishay High Power Products Ultrafast Rectifier, 2 x 35 A FRED PtTM FEATURES • • • • • • Two common-cathode diodes Ultrafast reverse recovery Ultrafast reverse recovery current shape Low forward voltage drop Low leakage current Optimized for power conversion: welding and industrial

Contextual Info: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: PBT FLAMABILITY RATING: UL94-V0 COLOR: BLACK CONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: GOLD QUALITY CLASS: 3 AS PER CECC 75 301-802 PITCH: 2.54MM A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 125°C

Contextual Info: TSOP18.XG1 Vishay Telefunken Photo Modules for PCM Remote Control Systems Available types for different carrier frequencies Type TSOP1830XG1 TSOP1836XG1 TSOP1838XG1 TSOP1856XG1 fo 30 kHz 36 kHz 38 kHz 56 kHz Type TSOP1833XG1 TSOP1837XG1 TSOP1840XG1 fo 33 kHz

Contextual Info: 572D Vishay Sprague Solid Tantalum Chip Capacitors TANTAMOUNT , Low Profile, Conformal Coated, Maximum CV FEATURES • P case offers single-sided lead Pb -free terminations. • Wraparound lead (Pb)-free terminations: Q, S, A, B and T. • Low Impedance

nec 14312

Abstract: nec 14312 transistor nec 14315 14312 14312 nec 3 pin ir receiver module 38khz TSOP18 application TSAL62 TSAL6200 TSOP1830XG1
Contextual Info: TSOP18.XG1 Obsolete Vishay Semiconductors Photo Modules for PCM Remote Control Systems Available types for different carrier frequencies Type TSOP1830XG1 TSOP1836XG1 TSOP1838XG1 TSOP1856XG1 fo 30 kHz 36 kHz 38 kHz 56 kHz Type TSOP1833XG1 TSOP1837XG1 TSOP1840XG1

4503 MOSFET

Abstract: a 4503 data sheet SUD70N02-04P
Contextual Info: SPICE Device Model SUD70N02-04P Vishay Siliconix N-Channel 20-V D-S 175° MOSFET CHARACTERISTICS • N-Channel Vertical DMOS • Macro Model (Subcircuit Model) • Level 3 MOS • Apply for both Linear and Switching Application • Accurate over the −55 to 125°C Temperature Range

SUD50N02-06P

Contextual Info: SPICE Device Model SUD50N02-06P Vishay Siliconix N-Channel 20-V D-S 175° MOSFET CHARACTERISTICS • N-Channel Vertical DMOS • Macro Model (Subcircuit Model) • Level 3 MOS • Apply for both Linear and Switching Application • Accurate over the −55 to 125°C Temperature Range

manual temperature controller CHB 702

Abstract: MC9S12XF asea MBT 160 S12XF256 NVP 1204 1M64J S12XF384 transistor f a614 729 PIN CONFIGURATION 2M64J Logic Cross-Reference
Contextual Info: MC9S12XF512 Reference Manual Covers MC9S12XF512 MC9S12XF384 MC9S12XF256 MC9S12XF128 S12X Microcontrollers MC9S12XF512V1RM Rev.1.17 02-October-2008 freescale.com To provide the most up-to-date information, the revision of our documents on the World Wide Web will be the most

10K025

Abstract: land pattern 2512 30313 250R EEE-INST-002
Contextual Info: 303134, 303135, 303136, 303137, 303138 Vishay Foil Resistors Models 303134 through to 303138 Ultra High Precision Surface Mount Chip Resistors, VSMP Z-Foil Technology Configuration , Screen/Test Flow in Compliance with EEE-INST-002, (Tables 2A and 3A, Film/Foil, Level 1) and MIL-PRF-55342