J-STD-005
Abstract: 1092-03A-5 62NCLR-A 292-06A-5 1092-04A-5 hakko AVX0402YG104ZAT2A SMA end launch for pcb 142-0761-841-A SN62 PB36 ag2 heat conductivity
Contextual Info: AMMP-XXXX Production Assembly Process Application Note 5386 Description Package Features This document describes and illustrates the attachment and detachment of Avago’s 5x5mm packaged products in a PCB soft board environment. The AMMP package has a solid copper filled cavity to allow optimum thermal transfer of the packaged device to the PCB and associated heat
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42-0761-891-adc-40ghz092-04a-5092-03a-5+15dc-50ghz492-03a-5493-03a-5avx0402yg104zat2asmt-080508052f47sz6bbodj-std-0051092-03a-562nclr-a292-06a-51092-04a-5hakkosma end launch for pcb142-0761-841-asn62 pb36 ag2 heat conductivity
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