06V MARKING Search Results

T7SS5E612

Abstract: T7SS5E6-12 T7SV5H6-12 T7SS5E6 T7SS5H6-24-W
Contextual Info: 4 THIS DRAWING IS UNPUBLISHED. RELEASED FOR PUBLICATION COPYRIGHT BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. 3 2 1 LO C D IS T R E V IS IO N S HH P LTR DESCRIPTION ECN DATE A1 CHANGE LOT NUMBER ECO-05-016997 2 3 — Dec— 05 JG,L C.H.HSU D t if is a

TYCO electronics marking code date

Abstract: T7SS5E4-12
Contextual Info: THIS DRAWING IS UNPUBLISHED. RELEASED FOR PUBLICATION D COPYRIGHT BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. LOC DIST REVISIONS HH DESCRIPTION LTR DATE ECN RELEASED DWN APVD 6 —Jan—06 JG,L C.H.HSU REMOVER MARKE TO THE BOTTOM OF BOBBIN &CORRECT MISTAKE

augat

Abstract: MIL-T-10727 intcon MIL-G-45024
Contextual Info: AUGAT/ INTCON PRDT GP 57E D • 10^5335 0 0 02 6 1 4 30b H A U I P Female 4 Row Box Pac Features ■ High density ■ 40 to 264 Single Cluster 80 to 320 Double Cluster ■ UL Recognized % Materials ■ Insulator: Polyphenylene Sulfide UL94V0 ■ Contact: Copper alloy per Federal Specifica­

R50 marking

Contextual Info: Document No TCH-XXOS001A Issued date 2009/04/26 Page 1/8 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

Contextual Info: Document No TCP-XXOS001A Issued date 2008/12/12 Page 1/8 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

Contextual Info: Document No TCPS-XXOS006A Lead Free Thin Film Chip Fuse Issued date 2009/9/2 Page 1/8 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

fuse resistor

Contextual Info: Document No TCPS-XXOS001A Lead Free Thin Film Chip Fuse Issued date 2008/12/12 Page 1/8 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

Contextual Info: Axial Leaded Capacitors Metallized Polypropylene Dielectric High Current Capacitors Type ARPS, AFPS Tape Wrapped with Epoxy Endfill » ' ir:-,*' * 1 ' S * ' » ' •* ' ' ‘ ' ' * ’ ■ Insulation Resistance Category % \\t .j&:,*■■■ - * 1 ’ * '

MARKING CODE WU

Contextual Info: Axial Leaded Capacitors Metallized Polypropylene Dielectric Tape Wrapped with Epoxy Endfill Type ARPM Insulation Resistance Category mmm 200,000 MegOhms Maximum Need Not Exceed 500,000 Test Voltage 100VDC Electrification Time 1Minute Performance Testing

CP06V

Contextual Info: Document No TCP-XXOS001C Issued date 2010/05/12 Page 1/9 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS uv n ielli con SB 6mmL Chip Type, Long Life Assurance series ForS M D Long Life • Chip type with load life of 5000 hours at 4-105"C. • Designed for surface mounting on high density PC board. • Applicable to automatic insertion machine using carrier tape.

fuse smd code N

Abstract: smd fuse marking code M smd fuse marking 20 1 smd fuse marking code n CFS06V5TR50 k smd fuse marking code smd fuse marking code K smd fuse marking code T SMD 1206 fuse fuse smd code P
Contextual Info: Lead Free Thin Film Chip Fuse Document No TCFS-06OS050E Issued date 2007/7/25 Page 1/15 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

CF06V2T2R50

Abstract: CF06V fuse i2t CF06V3T1R25 fuse smd code c fuse smd code N CF06V3T1R0 Chip Fuse smd marking code 45 Smd fuse marking 45 CF06V3TR63
Contextual Info: Document No TCF-06OS030E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

GQ102

Contextual Info: A xial Leaded Capacitors M etallized Polyester D ielectric Tape W rapped with Epoxy Endfill Type AREM, AFEO lnsu4stiort R e sista n ce Category <100VDC >100VDC 1,000 5,000 M egOhms x M egOhms Maximum Need Not Exceed 10,000 30,000 Test Voltage 50VDC 100VDC

Texas Instruments TTL integrated circuits catalog

Contextual Info: CD74HCU04-Q1 www.ti.com SCHS381 – JUNE 2010 HIGH-SPEED CMOS LOGIC HEX INVERTER Check for Samples: CD74HCU04-Q1 FEATURES 1 • • • • • • Qualified for Automotive Applications Wide Operating Temperature Range: -40°C to 125°C Balanced Propagation Delay and Transition

Contextual Info: CD74HCU04-Q1 www.ti.com SCHS381 – JUNE 2010 HIGH-SPEED CMOS LOGIC HEX INVERTER Check for Samples: CD74HCU04-Q1 FEATURES 1 • • • • • • Qualified for Automotive Applications Wide Operating Temperature Range: -40°C to 125°C Balanced Propagation Delay and Transition

HJU04Q

Abstract: CD74HCU04-Q1 Texas Instruments TTL integrated circuits catalog
Contextual Info: CD74HCU04-Q1 www.ti.com SCHS381 – JUNE 2010 HIGH-SPEED CMOS LOGIC HEX INVERTER Check for Samples: CD74HCU04-Q1 FEATURES 1 • • • • • • Qualified for Automotive Applications Wide Operating Temperature Range: -40°C to 125°C Balanced Propagation Delay and Transition

Texas Instruments TTL integrated circuits catalog

Contextual Info: CD74HCU04-Q1 www.ti.com SCHS381 – JUNE 2010 HIGH-SPEED CMOS LOGIC HEX INVERTER Check for Samples: CD74HCU04-Q1 FEATURES 1 • • • • • • Qualified for Automotive Applications Wide Operating Temperature Range: -40°C to 125°C Balanced Propagation Delay and Transition

MP2494DS

Abstract: MP2494 MP2494DN 4.5V TO 100V INPUT REGULATOR schematic diagram converter input 12v MPS 1411
Contextual Info: MP2494 2A, 55V, 100kHz Step-Down Converter The Future of Analog IC Technology DESCRIPTION FEATURES The MP2494 is a monolithic step-down switch mode converter. It achieves 2A continuous output current over a wide input supply range with excellent load and line regulation.

Contextual Info: [ /Title CD74 HCU04 /Subject (High Speed CMOS Logic Hex Inverter CD74HCU04 Data sheet acquired from Harris Semiconductor SCHS127D High-Speed CMOS Logic Hex Inverter February 1998 - Revised May 2004 Features Description • Typical Propagation Delay: 6ns at VCC = 5V,

capacitor 0.33 MPS

Abstract: 100v input regulator 4.5V to 100v input regulator
Contextual Info: MP2499 The Future of Analog IC Technology Integrated 100V Load Dump Protection 2A, 100kHz Step Down Regulator with Programmable Output Current DESCRIPTION FEATURES The MP2499 is a monolithic step-down switch mode converter with a programmable output current limit and an integrated input overvoltage protection switch. It achieves 2.0A

Contextual Info: MP24943 3A, 55V, 100kHz Step-Down Converter with Programmable Output OVP Threshold The Future of Analog IC Technology DESCRIPTION FEATURES The MP24943 is a monolithic, step-down, switch-mode converter. It supplies 3A of continuous output current over a wide inputsupply range with excellent load and line

Contextual Info: MP24943 3A, 55V, 100kHz Step-Down Converter with Programmable Output OVP Threshold The Future of Analog IC Technology DESCRIPTION FEATURES The MP24943 is a monolithic, step-down, switch-mode converter. It supplies 3A of continuous output current over a wide inputsupply range with excellent load and line

MPS 3302

Abstract: mp24
Contextual Info: MP2494 The Future of Analog IC Technology 2A, 55V, 100kHz Step-Down Converter DESCRIPTION FEATURES The MP2494 is a monolithic step-down switch mode converter. It achieves 2A continuous output current over a wide input supply range with excellent load and line regulation.