0636B Search Results

bt21605

Abstract: Sw 2604 rs232 protocols MSP43063 7812 BT21605 schematics MSP430 MSP430F1121 MSP430P112 TRF6900
Contextual Info: Application Report SLAA121 – March 2001 Implementing a Bidirectional, Half-Duplex FSK RF Link With TRF6900 and MSP430 Peter Spevak MSLP – MSP430 ABSTRACT The advantage of radio frequency RF over infrared (IR) links for communication and data transfer is that with RF a successful communication can be set up even when the participants

4279g

Abstract: G52E111 G74B111 ET-46 microtran t5115 IFS-0505 TTC05 TTC 103 2PC 502 m 8044
Contextual Info: ~tamura Product Number Index MICROTRAIM, Part No. Page Part No. Page 1 0A 006 20 3FD -348 18 Part No. 3FS -2120 Page 18 630A4201 33 A K S 25-12 39 DCM 4-PC 10A 007 20 3FD -356 18 3FS -216 18 630 A 4 3 0 4 33 A K S 25-15 39 DCM 5-PC 6 1 0A 008 20 3FD -410 18

TSOP 66 Package thermal resistance

Abstract: 7244k 20P3 28P6 TSOP 66 thermal resistance
Contextual Info: Packages Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability

0a214

Abstract: 048E3 09376h 036D3 030B9H 036B6 08d06 09-D2 0A211 0817AH
Contextual Info: TMS320 DSP Number 84E DESIGNER’S NOTEBOOK Speech data for Spanish LPC Day-Time-Stamping DTS on TMS320Cxx Contributed by Gerardo Murillo Design Problem Where can I get Spanish speech data allowing generation of a vocal output for Date and Time Stamping (DTS) and voice prompts ?

BT21605

Abstract: sw 2604 msp430 RS232 rs232 protocols rs232 to rf MSP430 pin diagram MSP430 MSP430F1121 MSP430P112 TRF6900
Contextual Info: Application Report SLAA121 – March 2001 Implementing a Bidirectional, Half-Duplex FSK RF Link With TRF6900 and MSP430 Peter Spevak MSLP – MSP430 ABSTRACT The advantage of radio frequency RF over infrared (IR) links for communication and data transfer is that with RF a successful communication can be set up even when the participants

bt21605

Abstract: BT21605 schematics be cq1 1080 270 MSP430-20 MSP430-24 MSP430 MSP430F1121 MSP430P112 TRF6900 MSP430 General Purpose Subroutines
Contextual Info: Application Report Literature Number Implementing a bi-directional, half-duplex FSK RF-Link with TRF6900 and MSP430 Peter Spevak MSLP – MSP430 Abstract Many applications using wireless communication data transfere, were using the 433,92 MHz band. Due to a missing restriction of the maximum allowed duty cycle in this band, this band is

Contextual Info: ADVANCED AN D EVER AD VANCING M ITSUBISHI ELECTRIC MITSUBISHI 8-BIT SINGLE-CHIP MICROCOMPUTER 740 FAMILY / 38000 SERIES 3802 Group U s e r’s Manual MITSUBISHI ELECTRIC keep s a fe ty firs t in y o u r c irc u it d e s ig n s ! • M itsubishi E lectric C orporation puts the m axim um effort into m aking sem iconductor

20P3

Abstract: 28P6 ATMEL 40T
Contextual Info: Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability

0635b

Contextual Info: APPENDIX 3.1 Electrical characteristics 3.1 Electrical characteristics 3.1.1 ABSOLUTE MAXIMUM RATINGS T ab le 3.1.1 A bsolute m axim um ratings Sym bol Vcc Conditions Param eter Ratings Unit -0 .3 to 7.0 V - 0 .3 to V c c +0.3 V Power source voltage Input voltage