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87052-106HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 6 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail. |
PDF
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98426-S12-05-210LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch. |
PDF
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87052-108HLF
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|
Amphenol Communications Solutions
|
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail. |
PDF
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87052-104HLF
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|
Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 4 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail. |
PDF
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98426-G12-05-210LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch. |
PDF
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