050508HC02 Search Results
050508HC02 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: Reportable Substances in Components Package Type : Lead #: No 1 2 3 3 4 5 6 Rev A B C MSOP 10 Material Molding Compound Copper Alloy Frame Spot Silver Plating Silver Die Attach Epoxy Gold Wire External Lead Plating Silicon Die ECN 120904HC33 050508HC02 072309HC06 |
Original |
msopep-10ld-pby-rs-3120904hc33050508hc02072309hc06 |