0402 SOLDER MASK Search Results

schematic diagram CORDLESS DRILL

Abstract: ATR2820 DECT RF Transceiver 1.9 ghz A264 ATR2406 C140 C141 QFN32 DECT Transceiver 4hbs
Contextual Info: ATR2820 Applications ATR2820 • • • • Application Note 5.8 GHz Digital Cordless Phones Game Controllers Wireless Head Set FCC Part 15 Compliant Radio Link 1. Description The ATR2820 is a single-chip RF-transceiver for applications in the 5.8 GHz ISM

GRP155R71E103K

Abstract: ldb20c201a900 LDB20C GRP1555C1H220J GRP155R71H221K MAX2045 MAX2045EVKIT MAX2046 MAX2046EVKIT MAX2047
Contextual Info: 19-2793; Rev 0a; 4/03 MAX2045/MAX2046/MAX2047 Evaluation Kits Features ♦ Easy Evaluation of the MAX2045/MAX2046/ MAX2047 ♦ +4.75V to +5.25V Single-Supply Operation ♦ Include RF Input and Output Matching 2040MHz to 2240MHz MAX2045 1740MHz to 2060MHz (MAX2046)

epoxy prepreg panasonic

Abstract: Capacitor tantalum 0402 10uF/16V IPC-600-A IPC-SM-840 type b class 2 ceramic capacitor 1uf/16v UAR10-4W5100 IPC-6011 ipc sm 840 CMD15-21VRC smd diode s1
Contextual Info: WirelessUSB LS Micro-Bridge Layout Guidelines The PCB Is a Component of Your Wireless Communication Product Design This application note provides guidelines for micro-bridge printed circuit board PCB design using the WirelessUSB™ LS 2.4-GHz DSSS Radio IC and its application as an

450MHz CDMA Handset Circuit Diagram

Abstract: 800MHz CDMA Handset Circuit Diagram marking aaa CDMA450 mobile phone frequency receiver IC NX 38 RF Receiver ITM1010 ITM1010EV ITM1010EV45
Contextual Info: ITM1010 CDMA Cellular/CDMA450 Receiver RF Front-end IC Description Features World’s smallest 2.5 mm x 2.5 mm CDMA The ITM1010 is an integrated receiver front-end IC for 800 MHz Cellular CDMA and receiver chip 450MHz Operating frequency: CDMA450 mobile phones. The device has an LNA

24 GHz transceiver

Abstract: XTL1021
Contextual Info: TRC104 2.4 GHz Transceiver Reference Design Introduction This application note presents a PCB reference design for RFM’s TRC104 2.4 GHz transceiver IC. The reference design, including a PCB antenna, easily fits on one square inch of circuit board. Two RF inductors are implemented as circuit board traces, avoiding the cost of discrete inductors. The reference design

Contextual Info: TVS Avalanche Diode 0402 Chip Scale Package SP0501BAC Transient Voltage Suppression Avalanche Diode in a Chip Scale Package 0402 Size Features • Single channel suppressor in an EIA 0402 device size - ESD Capability The product is a silicon P/N structure tailored for ESD protection and is offered in the standard EIA 0402 size. The

Nihon handa rx303-92skho

Abstract: RX303-92SKHO VMMK-125 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design VMMK-1225 AV02-1078EN land pattern for WLCSP
Contextual Info: VMMK-1225 production assembly process Application Note 5378 Description Package Features Avago Technologies has combined our industry leading EpHEMT technology with a revolutionary wafer level chip scale package design WLCSP . This wafer level chip scale

EMP110 electra

Contextual Info: KW01 Development Hardware Reference Manual Document Number: KW01DHRM Rev. 1 1/2014 How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright

Contextual Info: TAT2814A DOCSIS 3.0 / Edge QAM Variable Gain Amplifier Applications •  Integrated DOCSIS 3.0 / Edge QAM RF Amplifier chain Forward path 45 – 1003 MHz variable-gain applications Product Features           Meets DOCSIS 3.0 with +4 dB typical performance

Contextual Info: TAT2814A DOCSIS 3.0 / Edge QAM Variable Gain Amplifier Applications •  Integrated DOCSIS 3.0 / Edge QAM RF Amplifier chain Forward path 45 – 1003 MHz variable-gain applications Product Features           Meets DOCSIS 3.0 with +4 dB typical performance

power amplifier rf

Abstract: "docsis 3.0" TAT2814 J-STD-020 SAC305 TAT2814A
Contextual Info: TAT2814A DOCSIS 3.0 / Edge QAM Variable Gain Amplifier Applications • • Integrated DOCSIS 3.0 / Edge QAM RF Amplifier chain Forward path 45 – 1003 MHz variable-gain applications Product Features • • • • • • • • • • Meets DOCSIS 3.0 with +4 dB typical performance

C1448

Abstract: J-STD-020 SAC305
Contextual Info: TAT2814A DOCSIS 3.0 / Edge QAM Variable Gain Amplifier Applications •  Integrated DOCSIS 3.0 / Edge QAM RF Amplifier chain Forward path 45 – 1003 MHz variable-gain applications Product Features           Meets DOCSIS 3.0 with +4 dB typical performance

1R00

Abstract: 210E
Contextual Info: RNCP Series Stackpole Electronics, Inc. High Power Anti-Sulfur Thin Film Chip Resistor Features: • • • • • • Resistive Product Solutions Higher power ratings than standard thick film chips Absolute TCRs to ±100ppm/°C Impervious to Sulfur contamination, no silver present in

Resistor 162 value package 1210

Abstract: RMCP
Contextual Info: RMCP Series Stackpole Electronics, Inc. General Purpose High Power Thick Film Chip Resistor Features: • • • • Resistive Product Solutions High Power Rating Nickel Barrier terminations standard Power derating from 100% at 70ºC to zero at +155ºC RoHS compliant

1R00

Abstract: 2512 pcb layout RMCP
Contextual Info: RMCP Series Stackpole Electronics, Inc. General Purpose High Power Thick Film Chip Resistor Features: • • • • Resistive Product Solutions High Power Rating Nickel Barrier terminations standard Power derating from 100% at 70ºC to zero at +155ºC RoHS compliant

GMC04CG470J50NT

Contextual Info: 12311 Development Hardware Reference Manual Document Number: 12311DHRM Rev. 0.0 10/2011 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370

Contextual Info: Fillet Less Thick Film Chip Resistors Fillet Less Thick Film Chip Resistors 0402 Type: ERJ2FL n Features l Small size and lightweight This chip resistor series realizes an ultimate high density mounting l High reliability Metal glaze thick film resistive element and three layers of electrodes result in high reliability

Contextual Info: Fillet Less Thick Film Chip Resistors Fillet Less Thick Film Chip Resistors 0402 Type: ERJ2FL n Features l Small size and lightweight This chip resistor series realizes an ultimate high density mounting l High reliability Metal glaze thick film resistive element and three layers of electrodes result in high reliability

Contextual Info: MAX3948 Evaluation Kit Evaluates: MAX3948 General Description The MAX3948 evaluation kit EV kit is a fully tested and assembled demonstration board that provides optical evaluation of the MAX3948 DC-coupled, 1Gbps to 11.3Gbps laser driver. The controlling software communicates with the EV kit through the USB port and provides

Contextual Info: MAX3949 Evaluation Kit General Description The MAX3949 evaluation kit EV kit is a fully tested and assembled demonstration board that provides optical evaluation of the MAX3949 AC-coupled, 1Gbps to 11.3Gbps laser driver. The controlling software communicates with the EV kit through the USB port and provides

RS-481-1

Abstract: iec 286 PGB1010603
Contextual Info: PulseGuard Suppressors Surface Mount Polymeric ESD Suppressors Reference Dimensions: Sn 1.60 .063" 0.076 (.003") MIN PGB1 Series Lead-Free 1.04 (.041") REF 0.787 (.031") Description 0.254 (.010") MIN 0.356 (.014") Reference Dimensions: Wave Solder Reflow

GRM216R71H103K

Abstract: 0402 resistor 0402 resistors max2391 GRM21BR71E104K TCXO 19.2MHZ murata vco saw 2140MHZ MAX2392EGI GRM31MR71C105K Murata DATASHEET
Contextual Info: 19-2868; Rev 0; 5/03 MAX2391/MAX2392/MAX2393 Evaluation Kits Features The MAX2391/MAX2392/MAX2393 evaluation kits EV kits simplify the evaluation of the MAX2391/ MAX2392/MAX2393 WCDMA/TD-SCDMA/3GPP-TDD direct-downconversion receive ICs. They are fully assembled and tested at the factory. Standard 50Ω

how to use rf signal generator

Abstract: LQW1608A6N8C00 LQW1608A8N2D00 MAX2374 MAX2374EBT MAX2374EVKIT 8970B
Contextual Info: 19-1614; Rev 0; 6/00 MAX2374 Evaluation Kit Features ♦ Easy Evaluation of MAX2374 The MAX2374 EV kit is assembled with the MAX2374 and incorporates input and output matching components optimized for an RF frequency of 880MHz. All matching components may be changed to match RF

Contextual Info: MAX17501G Evaluation Kit Evaluates: MAX17501G in TDFN Package General Description The MAX17501G EV kit provides a proven design to evaluate the MAX17501G high-efficiency, high-voltage, synchronous step-down DC-DC converter in a TDFN package. The EV kit generates 12V at load currents