0402 LAND PATTERN Search Results

Contextual Info: Land Patterns and Soldering Temperature Profiles Recommended PC Board Land Patterns Chip Size L mm inch G mm (inch) H mm (inch) 0402(1005) 1.3 (0.051) 0.4 (0.016) 0.5 (0.020) 0603(1608) 2.6 (0.102) 0.6 (0.023) 0.8 (0.031) 0805(2012) 3.0 (0.118) 1.0 (0.039)

Contextual Info: *1566 PRINTER 03-62 12/4/06 9:06 AM Page 43 Land Patterns and Soldering Temperature Profiles Recommended PC Board Land Patterns A B C 0402 1005 0.051 (1.3) 0.020 (0.5) 0.016 (0.4) 0603 (1608) 0.102 (2.6) 0.031 (0.8) 0.023 (0.6) 0805 (2012) 0.118 (3.0) 0.039 (1.0)

122N10N

Contextual Info: CERAMIC RF CHIP INDUCTORS – 0402CC SERIES Monolithic inorganic material construction Low DC resistance and high Q Values at high frequency High Self Resonant Frequency Industry Standard 0402 1005 Surface Mount Land Pattern Electrical Specifications @ 25°C

Contextual Info: WIRE-WOUND RF CHIP INDUCTORS - 0402CD SERIES Wirewound ceramic core construction High Q values High self resonant frequency Industry standard 0402 1005 surface mount land pattern See page 3 for Competition Cross Reference Electrical Specifications @ 25°C

Contextual Info: Ver 201207 Multilayer High Frequency inductor CIH05T Series 1005/ EIA 0402 APPLICATION Mobile communication systems, noise suppression at high frequency and Impedance matching. FEATURES RECOMMENDED LAND PATTERN  Lowest value of specific resistivity, good property of Q

Contextual Info: Ver 201207 Chip Bead For High Current CIC05 Series 1005/ EIA 0402 APPLICATION Noise Suppression in power line FEATURES RECOMMENDED LAND PATTERN 0.45~0.55mm CIC series is used for high current. (~ 3A) 0.45~0.55mm 0.40~0.50mm 0.40~0.50mm DIMENSION Type 05

Contextual Info: Ver 201305 Chip Bead For EMI Suppression CIB/CIM05 Series 1005/ EIA 0402 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.45~0.55mm Perfect shape for automatic mounting, with no directionality.

Contextual Info: SPECTRUM CONTROL INC. Land Patterns and Soldering Temperature Profiles Chip Size EIA EIAJ A B C 0402 (1005) 0.051 (1.3) 0.020 (0.5) 0.016 (0.4) 0603 (1608) 0.102 (2.6) 0.031 (0.8) 0.023 (0.6) 0805 (2012) 0.118 (3.0) 0.039 (1.0) 0.039 (1.0) 1206 (3216) 0.173 (4.4)

Contextual Info: Inductors Chip Inductors  +LJK 3RZHU 7\SHV 3  3  3& 3$ 3% Q Type 1005(0402)PF O Recommended Land Pattern in mm (not to scale) 0.5 0.5 to 0.6 O Dimensions in mm (not to scale) 0.2 1.0 0.2 0.5 0.5 to 0.6 1.5 to 1.7 Q Standard Packing Quantity O  SFV5HHO

land pattern 0805

Abstract: 01005 land pattern resistor ERJ-3GE ERJA1 RESISTOR ARRAY 0402 land pattern ERA1A
Contextual Info: Surface Mount Resistors Packaging Method Taping Surface Mount Resistors Series Products Type ERJXGN ERJ1GN ERJ2GE ERJ3GE Thick Film Chip Resistors ERJ6GE ERJ8GE ERJ14 ERJ12 ERJ12Z ERJ1T ERJXGN ERJ1GN/1RH ERJ2RH/2RK Precision Thick Film Chip Resistors ERJ3RB/3RE/

ERJA1

Abstract: RESISTOR ARRAY 0402 land pattern
Contextual Info: Surface Mount Resistors Packaging Method Taping Surface Mount Resistors Series Products Type Size mm (inch) 0402 (01005) 0603 ERJ1GN (0201) 1005 ERJ2GE (0402) 1608 ERJ3GE (0603) 2012 ERJ6GE Thick Film (0805) 3216 Chip Resistors ERJ8GE (1206) 3225 ERJ14 (1210)

01005 land pattern

Abstract: 0402 land pattern
Contextual Info: NMC SERIES - LAND PATTERN DIMENSIONS Component Outline D Solder Resist A C Land Pads B 1. Flow Soldering Dimension mm A B C D 0603 0.8 ~ 1.0 2.6 ~ 3.2 0.7 ~ 0.8 0.8 ~ 1.2 Size 1206 1.8 ~ 2.4 4.2 ~ 5.2 1.2 ~ 1.6 0.9 ~ 1.7 1210 1.8 ~ 2.4 4.2 ~ 5.2 1.8 ~ 2.5

0603 footprint IPC

Abstract: 0402 land pattern
Contextual Info: CH Vishay Sfernice 50 GHz Thin Film Microwave Resistors FEATURES • SMD wraparound or flip chip resistor • Small size, down to 20 mils by 16 mils • Edged trimmed block resistors • Pure alumina substrate 99.5 % • Various terminations: • Pre-tinned over nickel barrier (wraparound (N) or flip

Contextual Info: CH www.vishay.com Vishay Sfernice High Frequency 50 GHz Thin Film Chip Resistor FEATURES • Operating frequency 50 GHz • Thin film microwave resistors • SMD wraparound or flip chip resistor • Small size, down to 20 mils by 16 mils • Edged trimmed block resistors

Contextual Info: 【WB Series】 Wire Bondable Chip Resistor Wire Bondable Chip Resistor •Features －Thin film passivated NiCr resistive element －Tolerance of ±0.1% －Extremely low TCR down to ±25PPM/°C －Wide resistance range －Customized bonding pattern design

chip resistor rohm 1608

Abstract: chip resistor rohm 3216 ESR03
Contextual Info: Anti-surge Chip Resistors ESR Series Features 1 Exclusive resistive element pattern and laser trimming technology results in significantly improved surge resistance characteristics. 2) 2kV to 5kV electrostatic discharge resistance. 3) Superior power ratings.

Contextual Info: Thick Film Chip Resistors TA – I Low Resistance for 0402 Document No TRL-04OS025A Issued date 2007/01/30 page 1/8 1. Scope : This specification applies for the RL04 ( 0402 ) of thick film chip resistors made by TA-I. 2. Construction: Conductor : Over Coat

Contextual Info: ESD Suppressor ESD Suppressor Type: EZAEG EZAEG1A, 2A, 3A • Features ■ Recommended Applications ● ESD protection of high-speed data lines ● Low capacitance 0.04 pF : 0603 0201 size 0.05 pF : 1005(0402) size 0.10 pF : 1608(0603) size ● Good ESD suppression characteristics

Contextual Info: SZM-2166Z SZM-2166Z 2.3GHz to 2.7GHz 2W Power Amplifier 2.3GHz to 2.7GHz 2W POWER AMPLIFIER Package: QFN, 6mmx6mm Product Description Features RFMD’s SZM-2166Z is a high linearity class AB Heterojunction Bipolar Transistor HBT amplifier housed in a low-cost surface-mountable plastic Q-FlexN multi-chip module package. This HBT

MCH185A3R9DK

Abstract: SZM-3166Z SZM3166Z tRANSISTOR 2.7 3.1 3.5 GHZ cw 3166Z
Contextual Info: SZM-3166Z SZM-3166Z 3.3 GHz to 3.6 GHz 2W Power Amplifier 3.3 GHz to 3.6 GHz 2W POWER AMPLIFIER Package: QFN, 6 mm x 6 mm Product Description Features RFMD’s SZM-3166Z is a high linearity class AB Heterojunction Bipolar Transistor HBT amplifier housed in a low-cost surface-mountable plastic Q-FlexN multi-chip module package. This HBT

capacitor cross reference

Abstract: TDK 1206 MLCC paccom MT Philips X7R capacitors 0805 c g Panasonic capacitor ECU 104 CC 0603 COG capacitor 1uf 16v x7r 0402 Panasonic ecu series capacitor Philips cog 0805 philips capacitor part numbering system
Contextual Info: Rev: 6/98 MT Series Multilayer, Class I & II SMT Chip Ceramic Capacitor An ISO 9002 Registered Company MT Series Ceramic Multilayer ▼ Monolithic ▼ EIA Class I & II ▼ Surface Mount Chip Ceramic Multilayer Chip ▼ MT Series Capacitors Features: • Wide capacitance, TC, voltage, tolerance, and case size range

Contextual Info: Low Resistance Chip Resistors RBL Series Document No TRBL-XX0S001D Issued date 2011/12/30 Page 1/10 1. Scope : The specification applies for the RBL Series (0402 ~ 2512) of low resistance chip resistors made by TA-I and the resistance range between 10mΩ and 91mΩ.

SAMSUNG 0805 thick film resistor

Contextual Info: Thick Film Chip Resistors RC General Thi k Film Thick Fil General G l Chip Chi Resistors R i t - 1005(0402), 1608(0603), 2012(0805), 3216(1206), 3225(1210), 5025(2010), 6432(2512) • Features ● ● ● ● ● Small, thin and lightweight High reliability

Contextual Info: 0201/0402/0603 Chip Inductors NIS Series FEATURES • • • • • • LASER CUT SPIRAL COIL OVER ALUMINA CORE SUPER MINIATURE EIA 0201, 0402 & 0603 SIZE IN RESIN ENCLOSED BODY HIGH Q AND SRF FOR HIGH FREQUENCY APPLICATIONS TIGHT TOLERANCES D ± 0.3nH, G ± 2% or J ± 5%