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    0402 LAND PATTERN Search Results

    0402 LAND PATTERN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    G832MB130402322HR
    Amphenol Communications Solutions 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 4.7 mm, 40 Positions, Dual Row, BTB Vertical Plug SMT, 8u\\ Gold White. PDF
    G832MB130402022HR
    Amphenol Communications Solutions 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 4.7 mm, 40 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash White. PDF
    G832MB130204024HR
    Amphenol Communications Solutions Pitch 0.8mm, Height 6.7 mm, 20 Positions, Dual Row, BTB Vertical Plug SMT, G/F White PDF
    SE1404023111111
    Amphenol Communications Solutions Slim Cool Edge 0.65mm, Surface mount, 4 power pins, 40 signal pins, Vertical PDF
    G832MC110404022HR
    Amphenol Communications Solutions 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 6.7 mm, 40 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash Black. PDF

    0402 LAND PATTERN Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    land pattern 0805

    Abstract: 0402 0603 0805 land
    Contextual Info: 4/2/02 http:www.niccomp.com Technical Inquiries: tpmg@niccomp.com SOLDERING LAND PATTERNS PRODUCTS: NRC SERIES, THICK FILM CHIP RESISTORS SOLDERING LAND PATTERN DIMENSIONS mm SIZE 0201 0402 0603 0805 1206 1210 2010 2512 A 0.3~0.4 0.5~0.6 0.8~1.0 1.2~1.4


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    land pattern 08050402 0603 0805 land PDF

    Contextual Info: Land Patterns and Soldering Temperature Profiles Recommended PC Board Land Patterns Chip Size L mm inch G mm (inch) H mm (inch) 0402(1005) 1.3 (0.051) 0.4 (0.016) 0.5 (0.020) 0603(1608) 2.6 (0.102) 0.6 (0.023) 0.8 (0.031) 0805(2012) 3.0 (0.118) 1.0 (0.039)


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    ca92121 PDF

    Contextual Info: *1130 PRINTER 003-62 v2 3/13/03 2:32 PM Page 43 Land Patterns and Soldering Temperature Profiles Recommended PC Board Land Patterns A B C 0402 1005 0.051 (1.3) 0.020 (0.5) 0.016 (0.4) 0603 (1608) 0.102 (2.6) 0.031 (0.8) 0.023 (0.6) 0805 (2012) 0.118 (3.0)


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    Contextual Info: *1566 PRINTER 03-62 12/4/06 9:06 AM Page 43 Land Patterns and Soldering Temperature Profiles Recommended PC Board Land Patterns A B C 0402 1005 0.051 (1.3) 0.020 (0.5) 0.016 (0.4) 0603 (1608) 0.102 (2.6) 0.031 (0.8) 0.023 (0.6) 0805 (2012) 0.118 (3.0) 0.039 (1.0)


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    land pattern 0805

    Abstract: 0402 land pattern land pattern 1812 0402 0603 0805 1206 0402 0603 0805 land
    Contextual Info: APPLICATION NOTE RECOMMENDED LAND PATTERN NMC CHIP CERAMIC CAPACITOR Land Pattern NMC C < >< D > A < > B Solder Resist 1. Flow Soldering SIZE 0402 0603 0805 1206 1210 1812 2225 A NA 0.8 ~ 1.0 0.8 ~ 1.4 1.8 ~ 2.4 1.8 ~ 2.4 2.5 ~ 3.2 N/A B NA 2.6 ~ 3.2 3.0 ~ 4.0


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    land pattern 08050402 land patternland pattern 18120402 0603 0805 1206+10402 0603 0805 land PDF

    Contextual Info: Super Frequency Ceramic RF Chip Inductors - 0402CH Series Monolithic inorganic material construction Very High Q Values High Self Resonant Frequency Industry Standard 0402 1005 Surface Mount Land Pattern Electrical Specifications @ 25° Part Number Inductance


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    0402chpe-0402ch1n0sttpe-0402ch1n2sttpe-0402ch1n5stt+2pe-0402ch1n8sttwc702 PDF

    Contextual Info: Super Frequency Ceramic RF Chip Inductors - 0402CH Series Monolithic inorganic material construction Very High Q Values High Self Resonant Frequency Industry Standard 0402 1005 Surface Mount Land Pattern Electrical Specifications @ 25° Part Number Inductance Standard


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    0402chpe-0402ch1n0sttpe-0402ch1n2sttpe-0402ch1n5stt+1wc702 PDF

    122N10N

    Contextual Info: CERAMIC RF CHIP INDUCTORS – 0402CC SERIES Monolithic inorganic material construction Low DC resistance and high Q Values at high frequency High Self Resonant Frequency Industry Standard 0402 1005 Surface Mount Land Pattern Electrical Specifications @ 25°C


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    0402ccpe-0402cc1n0sttpe-0402cc1n2sttpe-0402cc1n5stt+4pe-0402cc1n8sttpe-0402cc2n0sttwc704122n10n PDF

    Contextual Info: WIRE-WOUND RF CHIP INDUCTORS - 0402CD SERIES Wirewound ceramic core construction High Q values High self resonant frequency Industry standard 0402 1005 surface mount land pattern See page 3 for Competition Cross Reference Electrical Specifications @ 25°C


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    0402cdpe-0402cd1n0kttpe-0402cd1n2kttpe-0402cd1n8ktt+6pe-0402cd1n9kttpe-0402cd2n0kttpe-0402cd2n2kttpe-0402cd2n4kttpe-0402cd2n7kttpe-0402cd3n3ktt PDF

    122N10N

    Contextual Info: CERAMIC RF CHIP INDUCTORS – 0402CC SERIES Monolithic inorganic material construction Low DC resistance and high Q Values at high frequency High Self Resonant Frequency Industry Standard 0402 1005 Surface Mount Land Pattern Electrical Specifications @ 25°C


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    0402ccpe-0402cc1n0sttpe-0402cc1n2sttpe-0402cc1n5stt+4pe-0402cc1n8sttpe-0402cc2n0sttwc704122n10n PDF

    Contextual Info: Ver 201207 Multilayer High Frequency inductor CIH05T Series 1005/ EIA 0402 APPLICATION Mobile communication systems, noise suppression at high frequency and Impedance matching. FEATURES RECOMMENDED LAND PATTERN  Lowest value of specific resistivity, good property of Q


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    cih05t100mhz100nh PDF

    Contextual Info: WIRE-WOUND RF CHIP INDUCTORS - 0402CD SERIES Wirewound ceramic core construction High Q values High self resonant frequency Industry standard 0402 1005 surface mount land pattern Refer to page 3 for Competition Cross Reference Electrical Specifications @ 25°C


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    0402cdpe-0402cd1n0ktgpe-0402cd1n2ktgpe-0402cd1n8ktg+6pe-0402cd2n0ktgpe-0402cd2n2ktgpe-0402cd3n3ktgpe-0402cd3n6ktgpe-0402cd3n9ktgpe-0402cd4n7ktg PDF

    Contextual Info: Ver 201208 Chip Bead For EMI Suppression CIB/CIM05 Series 1005/ EIA 0402 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.45~0.55mm Perfect shape for automatic mounting, with no directionality.


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    cib/cim05 PDF

    Contextual Info: Ver 201207 Chip Bead For High Current CIC05 Series 1005/ EIA 0402 APPLICATION Noise Suppression in power line FEATURES RECOMMENDED LAND PATTERN 0.45~0.55mm CIC series is used for high current. (~ 3A) 0.45~0.55mm 0.40~0.50mm 0.40~0.50mm DIMENSION Type 05


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    cic05100mhzcic05p300cic05p600+3cic05p121cic05p102cic05j600 PDF

    Contextual Info: Ver 201305 Chip Bead For EMI Suppression CIB/CIM05 Series 1005/ EIA 0402 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.45~0.55mm Perfect shape for automatic mounting, with no directionality.


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    cib/cim05 PDF

    Contextual Info: Ver 201208 Chip Bead For GHz noise suppression CIV05 Series 1005/ EIA 0402 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN CIV Series have high impedance in a GHz band


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    civ05 PDF

    Contextual Info: SPECTRUM CONTROL INC. Land Patterns and Soldering Temperature Profiles Chip Size EIA EIAJ A B C 0402 (1005) 0.051 (1.3) 0.020 (0.5) 0.016 (0.4) 0603 (1608) 0.102 (2.6) 0.031 (0.8) 0.023 (0.6) 0805 (2012) 0.118 (3.0) 0.039 (1.0) 0.039 (1.0) 1206 (3216) 0.173 (4.4)


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    PDF

    Contextual Info: Ferrite EMI Chip Bead Dimensions LAND PATTERN FOR REFLOW SOLDERING CHIP SIZE Monolithic Chip Bead B A C D See Page 41 for Equivalent Circuit Diagrams Metric EIA Pkg. Size A mm (inches) B mm (inches) C* mm (inches) D mm (inches) 1005 (0402) 1.01 (0.040)


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    Contextual Info: Chip Inductors • NK Type 1005 0402 ● Recommended Land Pattern in mm (not to scale) (0.1) 0.5 1.0 0.5 to 0.6 ● Dimensions in mm (not to scale) 0.5 0.5 to 0.6 0.64 max. 1.5 to 1.7 0.2 0.2 ■ Standard Packing Quantity ● 10000 pcs./Reel ■ Standard Parts


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    eljnk10nj/afeljnk12nj/afeljnk15nj/afeljnk18nj/af+6eljnk22nj/afeljnk27nj/afeljnk33nj/afeljnk39nj/afeljnk47nj/afeljnk56nj/af PDF

    Contextual Info: Chip Inductors 2. Type Non Wound High-Q QF, QE • QF Type 1005 (0402) ● Recommended Land Pattern in mm (not to scale) 0.5 0.5 to 0.6 ● Dimensions in mm (not to scale) 0.2 0.2 1.0 0.5 0.5 to 0.6 1.5 to 1.7 ■ Standard Packing Quantity ● 10000 pcs./Reel


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    eljqf10nj/gfeljqf12nj/gfeljqf15nj/gfeljqf18nj/gf+4eljqf22nj/gfeljqf27nj/gfeljqf33nj/gfeljqf39nj/gf PDF

    1100 A 4600

    Abstract: types of transistors ELJPF10NJF ELJPF5N6DF
    Contextual Info: Chip Inductors 4. High Power Types PF, PE, PC, PA, PB • Type 1005 0402 PF ● Recommended Land Pattern in mm (not to scale) 0.5 0.5 to 0.6 ● Dimensions in mm (not to scale) 0.2 0.2 1.0 0.5 0.5 to 0.6 1.5 to 1.7 ■ Examples Inductance Part No. ELJPF2N2DF


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    eljpf10njf1100 a 4600types of transistorseljpf5n6df PDF

    kf 680

    Abstract: kf 1300 KF 520 KF-470 220 NK 63 elj-NA5R6JF
    Contextual Info: Chip Inductors n Type 1005 0402 NK l Recommended Land Pattern in mm (not to scale) 0.5 (0.1) 0.5 to 0.6 l Dimensions in mm (not to scale) 1.0 0.5 0.5 to 0.6 0.64 max. 1.5 to 1.7 0.2 0.2 n Standard Packing Quantity l 10000 pcs./Reel n Examples Inductnce Part No.


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    kf 680kf 1300kf 520kf-470+2220 nk 63elj-na5r6jf PDF

    Contextual Info: Chip Inductors 5. High Power Types PF, PE, PC, PA, PB • PF Type 1005 0402 ● Recommended Land Pattern in mm (not to scale) 0.5 0.5 to 0.6 ● Dimensions in mm (not to scale) 0.2 1.0 0.2 0.5 0.5 to 0.6 1.5 to 1.7 ■ Standard Packing Quantity ● 10000 pcs./Reel


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    eljpf10njfresistanpb121kfeljpb151kfeljpb181kf+1eljpb221kf PDF

    Contextual Info: Chip Inductors • Type 1005 0402 RF ● Recommended Land Pattern in mm (not to scale) 0.5 0.5 to 0.6 ● Dimensions in mm (not to scale) 0.2 0.2 1.0 0.5 0.5 to 0.6 1.5 to 1.7 ■ Examples Inductnce Part No. (nH) Tolerance Q min. Q L,Q Test Freq. Typical (MHz) (800 MHz)


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    eljrf10njf2eljrf12njf2eljrf15njf2eljrf18njf2+6eljrf22njf2eljrf27njf2eljrf33njf2eljrf39njf2eljrf47njf2eljrf56njf2 PDF