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    MACOM

    MACOM MAMX-011037-DIE

    RF Mixer Die,Mixer,Dbl Bal,18-46 GHz
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    Mouser Electronics () MAMX-011037-DIE
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    MAMX-011037-DIE
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    037DIE Datasheets Context Search

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    chip bonding die

    Abstract: MIL-STD-750 method 2073
    Contextual Info: Introduction General Semiconductor Industries, Inc. offers a complete line of TransZorb * transient voltage suppressor semiconductor chips in die and cell construction, utilizing mesa and planar processing. Chips are available in unidirectional and bidirectional polarity, voltages ranging


    OCR Scan     		MIL-STD-750, 8/20JJ 037Die chip bonding die MIL-STD-750 method 2073 PDF