030C0 Search Results

Contextual Info: 6 3 4 - 2 DWG STATUS DATE STG REV CHG N /P 030C01 003 ZONE AB 1 REVISION HISTORY AUTH CHANGE FORMAT F < 1 g 4 F . 5 cc O i — >1. S 1_ o oc CSJ H œ 2 * . — — co - — — < — û o +1 T—H œ O^ o Ui z

ask rf remote control encoder decoder

Abstract: S014A 40X7R TRF1400 TRC1315 TRC1300
Contextual Info: TRF1400 M A R C S T A R RF VHF/UHF RZ A S K R E M O T E C O N T R O L R E C E I V E R SLW S014A -JU N E 1996 - REVISED AUGUST 1996 Wi d e V H F / U H F F r e q u e n c y R a ng e : 200 M H z to 450 M H z for W o r l d - W i d e R e m o t e Cont r ol F r e q u e n c y C om p a t i b i l i t y

A81DC

Abstract: a21dc a51dc SG 2368 FE8800 ED8000 E78000 FA6400 0110FFFF e7040
Contextual Info: MOTOROLA Order at ANE408/0 SEMICONDUCTOR APPLICATION NOTE ANE408 Previously ANE008 Logarithmic/Linear Conversion Routines for DSP56000/1 Prepared by: Eric Cheval Motorola G eneva, Switzerland I. INTRODUCTION DSP chips are often connected to mono-circuits (cofidecs) in telecommunication applications. When programmed *Cs multichannel DTMF

Contextual Info: 16 15 14 13 12 11 10 8 SYMBOL D E F I N I T I O N A DIMENSION WITHOUT AN INSPECTION REPORT SYMBOL DOES NOT REQUIRE INSPECTION. IT MAY BE CONTROLLED ON THE INDIVIDUAL COMPONENT DRAWING. M M IS S IN G SYMBOLS TOTAL NO OF INSPECTIONS REQUI RED 2-4 65 LAST NO.

C2600R-H

Contextual Info: 23 24 22 21 20 19 18 17 16 15 14 13 12 11 10 _ 9_ \/ 7 8 6 CD M 5 SYMBOL DEFINITION A DIMENSION WITHOUT AN INSPECTION REPORT SYMBOL DOES NOT REQUIRE INSPECTION. IT MAY BE CONTROLLED ON AN INDIVIDUAL COMPONENT DRAWING. DIM LABEL DIMENSION

ONFI 3.0

Abstract: 202F
Contextual Info: m APPLICATION REVISIONS ì_ NEXT ASSY USED ON ä_ FINAL 1271-01 REV DATE APPROVED ADDED ALLEN VAR TO 3.1.2.4.1 WAVEFORM WAS SINE WAVE 5 /1 /9 7 MSA 5 /2 1 /9 7 WBA CORRECTED PIN DIA, SHEETS 7704 B DESCRIPTION DUPLICATE DRAWING DO NOT REVISE 2 I REV SHEET ^3 UU A-5 Uà L7 U8 U9 50

PA6-GB20

Abstract: PA6-GB20 gf10 packard electric 15326847 PA6-GB20-GF10 15465944
Contextual Info: 16 14 15 13 12 10 11 8 SYMBOL D EFIN IT IO N M ISSIN G A D I M E N S I O N WITHOUT AN I N S P E C T I O N R EPORT S YMBOL D OE S NOT R E Q U I R E I N S P E C T I O N . I T MAY BE C ONTROLLED ON THE I N D I V I D U A L COMPONENT DRAWING. M TOTAL NO OF

Contextual Info: 24 23 22 21 19 20 18 17 16 15 14 13 12 11 10 8 7 SYMBOL D E F I N I T I O N M IS S IN G TOTAL NO OF INSPECTIONS REQUIRED A DIMENSION WITHOUT AN INSPECTION REPORT SYMBOL DOES NOT REQUIRE INSPECTION. IT MAY BE CONTROLLED ON THE IN D IV ID U A L COMPONENT DRAWING.

1.0 k mef 250

Abstract: MEF 250 MEF 400 2.0 k mef 250 DELPHI Connectors type 101 1.5 k mef 250 Delphi 103 mef 250 106 1.0 k mef 400 MEF 250 1.0 J
Contextual Info: 21 24 20 19 17 IB 16 15 14 12 13 11 9 10 V 8 4 MISSING SYMBOLS SYMBOL DEFINITION M A DIMENSION WITHOUT AN INSPECTION REPORT SYMBOL DOES NOT REQUIRE INSPECTION. IT MAY BE CONTROLLED ON THE INDIVIDUAL COMPONENT DRAWING. CONNECTOR - SEE CHART TOTAL NO OF

RF remote control circuit diagram

Abstract: remote control receiver ic 1051 diagram remote control receiver and transmitter murata date coding for capacitor ask rf remote decoder TRC1315 trf 247 TRF1400 GRM40C0G101J050BD 49 mhz remote control transmitter circuit
Contextual Info: TRF1400 MARCSTAR RF VHF/UHF RZ ASK REMOTE CONTROL RECEIVER S LW S014A —JU N E 1 9 9 6 -R E V IS E D AU G U S T 1996 • Wide VHF/UHF Frequency Range: 200 MHz to 450 MHz for World-Wide Remote Control Frequency Compatibility • High Receiver Sensitivity . . . -1 0 3 dBm at

Contextual Info: 16 15 14 13 12 1 1 9 10 6 7 8 5 4 SYMBOL D E F I N I T I O N 3 M ISS IN G A DIMENSION WITHOUT AN INSPECTION REPORT SYMBOL DOES NOT REQUIRE INSPECTION. IT MAY BE CONTROLLED ON THE INDIVIDUAL COMPONENT DRAWING. TOTAL NO OF INSPECTIONS REQUIRED LAST NO. USED

Contextual Info: 12 11 10 8 SYMBOL D E F I N I T I O N A DIMENSION WITHOUT AN INSPECTION REPORT SYMBOL DOES NOT REQUIRE INSPECTION. I T MAY BE CONTROLLED ON AN IN D IV ID U A L COMPONENT DRAWING. H GD 20 . 6 ± 0.1 Q§D + 0 .2 - -0 13 M IS S IN G TOTAL NO. OF SYMBOLS ON

DSP56001 users manual

Abstract: f32 motorola DSP56000 DSP56001 SCF 112 S1535 B1401 Nippon capacitors
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 24-Bit General Purpose Digital Signal Processor Order this document by DSP56001/D DSP56001 Pin Grid Array PGA Available in an 88 pin ceramic through-hole package. Ceramic Quad Flat Pack (CQFP) The DSP56001 is a member of MotorolaÕs family of

Contextual Info: 7 6 4 5 3 2 DWG STAfUS STG REV CHG N / P DATE r r 3 1 .6 + 0 .4 1 AUTH REVISION HISTORY ZONE DR CK APVD TST POT ASG 19SE00 PE DRAWING CREATION 000012 30NOOO 15369135 WAS PE089541 0 0 0 007 MWG POT ASG 25AP01 003 RELEASE DIMENSION 0 1 0 007 POT AIM ASG 02MY01

SToD15

Contextual Info: ZL50073 32 K Channel Digital Switch with High Jitter Tolerance, Rate Conversion per Group of 4 Streams 8, 16, 32 or 64 Mbps , and 128 Inputs and 128 Outputs Data Sheet Features • March 2004 32,768 channel x 32,768 channel non-blocking digital Time Division Multiplex (TDM) switch at

4005F

Abstract: FPI02
Contextual Info: ZL50070 24 K Channel Digital Switch with High Jitter Tolerance, Rate Conversion per Group of 4 Streams 8, 16, 32 or 64 Mbps , and 96 Inputs and 96 Outputs Data Sheet Features • August 2005 24,576 channel x 24,576 channel non-blocking digital Time Division Multiplex (TDM) switch at

4-bit bidirectional shift register

Abstract: SToD15
Contextual Info: ZL50073 32 K Channel Digital Switch with High Jitter Tolerance, Rate Conversion per Group of 4 Streams 8, 16, 32 or 64 Mbps , and 128 Inputs and 128 Outputs Data Sheet Features • April 2005 32,768 channel x 32,768 channel non-blocking digital Time Division Multiplex (TDM) switch at

Contextual Info: ZL50073 32 K Channel Digital Switch with High Jitter Tolerance, Rate Conversion per Group of 4 Streams 8, 16, 32 or 64 Mbps , and 128 Inputs and 128 Outputs Data Sheet Features • August 2005 32,768 channel x 32,768 channel non-blocking digital Time Division Multiplex (TDM) switch at

ZL80009

Abstract: ZL50075
Contextual Info: ZL50075 32 K Channel Digital Switch with High Jitter Tolerance, Rate Conversion per Group of 2 Streams 8, 16, 32 or 64 Mbps , and 64 Inputs and 64 Outputs Data Sheet Features • January 2004 32,768 channel x 32,768 channel non-blocking digital Time Division Multiplex (TDM) switch at

12015323

Abstract: 12010293 12015323 DELPHI M2261009 M2261012 12015899 12015284 12015193 10717640 15324982
Contextual Info: 16 15 14 13 12 11 $ 10 MISSING SYMBOLS SYMBOL DEFINITION A DIMENSION WITHOUT AN INSPECTION REPORT SYMBOL O DOES NOT REQUIRE INSPECTION. IT MAY BE CONTROLLED ON THE INDIVIDUAL COMPONENT DRAWING. M TOTAL NO OF INSPECTIONS REQUIRED 4-5 LAST NO. USED 7 DWG STATUS

D2185

Abstract: DSP56001UM DSP56001AFC27 dsp56002 host APR12 DSP56001 users manual DSP56001ARC33 Package tray PGA DSP56000 DSP56001
Contextual Info: DSP56001A/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA DSP56001A 24-bit Digital Signal Processor The DSP56001A is an MPU-style general purpose Digital Signal Processor DSP composed of an efficient 24-bit digital signal processor engine, program and data memories, various peripherals,

XAPP424

Abstract: XAPP412 XAPP502 SSYA002C X424 XAPP058 XAPP500 XAPP503 XAPP693
Contextual Info: Application Note: All Families R Embedded JTAG ACE Player Author: Roy White, and Arthur Khu XAPP424 v1.0.1 November 16, 2007 Summary This application note contains a reference design consisting of HDL IP and Xilinx Advanced Configuration Environment (ACE) software utilities that give designers great flexibility in

sfc 1471

Abstract: DSP56001AFC27 DSP56001ARC27 h1 m6c DSP56001AFE27 DSP56001 DSP56001A DSP56002 LS09 MBD301
Contextual Info: Design Considerations Substituting the DSP56001A for the DSP56001 Design Considerations Substituting the DSP56001A for the DSP56001 This section highlights the differences between the DSP56001 and DSP56001A that need to be taken into consideration when substituting the DSP56001A for the

DSP56002FC40

Abstract: A0655 00FF DSP56002 LS09 MC68000 DSP56002RC40 01CC00 M52DC BR a94
Contextual Info: Design Considerations Heat Dissipation Design Considerations outside ambient ΘCA . These terms are related by the equation: Heat Dissipation The average chip junction temperature, TJ, in °C, can be obtained from: TJ = TA + (PD x ΘJA) (1) Where: TA = ambient temperature, °C