02NOV11 Search Results

Contextual Info: General Information www.vishay.com Vishay Siliconix Useful Web Links COMPARE MOSFET PACKAGES www.vishay.com/mosfets/tapereel-package-list/ FEATURED MOSFET FAMILIES CHECK DISTRIBUTOR STOCK

bk1680

Contextual Info: BK16 SERIES DATA SHEET R-LINE DEVICES – BK16 SERIES FEATURE Radial leaded devices. Faster tripping, typical application in micro-motors for automobiles. Protecting against over-current and over-temperature faults Available in lead-free version. PACKAGE DIMENSIONS

Contextual Info: VS-20CUT10, VS-20CWT10FN www.vishay.com Vishay Semiconductors High Performance Schottky Generation 5.0, 2 x 10 A FEATURES • 175 °C high performance Schottky diode • Very low forward voltage drop I-PAK TO-251AA • Extremely low reverse leakage D-PAK (TO-252AA)

dpak DIODE ANODE COMMON

Contextual Info: VS-20CUT10, VS-20CWT10FN www.vishay.com Vishay Semiconductors High Performance Schottky Generation 5.0, 2 x 10 A FEATURES • 175 °C high performance Schottky diode • Very low forward voltage drop I-PAK TO-251AA • Extremely low reverse leakage D-PAK (TO-252AA)

Contextual Info: VS-10UT10, VS-10WT10FN www.vishay.com Vishay Semiconductors High Performance Generation 5.0 Schottky Rectifier, 10 A FEATURES • 175 °C high performance Schottky diode • Very low forward voltage drop • Extremely low reverse leakage I-PAK TO-251AA D-PAK (TO-252AA)

VS-10ETS08

Abstract: VS-10ETS12 PBF VS-10ETS
Contextual Info: VS-10ETS.PbF Series, VS-10ETS.M3 Series www.vishay.com Vishay Semiconductors High Voltage, Input Rectifier Diode, 10 A FEATURES Base cathode 2 • Very low forward voltage drop • 150 °C max. operating junction temperature • Designed and JEDEC-JESD47

Contextual Info: BK30 SERIES DATA SHEET R-LINE DEVICES – BK30 SERIES FEATURE Radial leaded devices. Cured, flame retardant epoxy polymer insulating material meets UL94 V-0 requirement. Available in lead-free version. PACKAGE DIMENSIONS E F E F SI SZ A B C D E F Max. Max.

Contextual Info: BK60 SERIES DATA SHEET R-LINE DEVICES – BK60 SERIES FEATURE Radial leaded devices. High voltage surge capabilities. Cured, flame retardant epoxy polymer insulating material meets UL94 V-0 requirements. Available in lead-free version. PACKAGE DIMENSIONS D

BK130

Contextual Info: BK130 SERIES DATA SHEET R-LINE DEVICES – BK130 SERIES FEATURE Radial leaded devices. Available in lead-free version. PACKAGE DIMENSIONS E F F E SZ DZ A B C D E F Max. Max. ±0.6 Max. Typ. Min. BK130-100 8.3 10.7 5.1 3.8 0.5 7.6 DZ BK130-120 8.3 10.7 5.1

Contextual Info: 4 T H IS D R A W IN G IS U N P U B L IS H E D . 2 RELEASED FO R ALL C O P Y R IG H T P U B L IC A T IO N R IG H TS A U G U S T ,2 0 0 6 - REVISIO N S RESERVED. E 2006 LTR NOTES: /\ PACK IN ACCORDANCE WITH AMP SPEC 107-3275 /K 100 TRAY PACK IN ACCORDANCE WITH AMP SPEC 107- 3275

SY 180

Abstract: BK250
Contextual Info: BK250 SERIES DATA SHEET R-LINE DEVICES – BK250 SERIES FEATURE Radial leaded devices. High voltage surge capabilities. Cured, flame retardant epoxy polymer insulating material meets UL94 V-0 requirements. Available in lead-free version. PACKAGE DIMENSIONS

Contextual Info: BK600 SERIES DATA SHEET R-LINE DEVICES – BK600 SERIES FEATURE Radial leaded devices. Very high voltage surge capabilities. Available in lead-free version. PACKAGE DIMENSIONS D E SY A B C D E Max. Max. ±0.6 Max. Typ. BK600-110 15.0 15.0 5.1 6.5 0.6 SY BK600-150

Contextual Info: VS-10UT10, VS-10WT10FN www.vishay.com Vishay Semiconductors High Performance Generation 5.0 Schottky Rectifier, 10 A FEATURES • 175 °C high performance Schottky diode • Very low forward voltage drop • Extremely low reverse leakage I-PAK TO-251AA D-PAK (TO-252AA)

Contextual Info: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL ICONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: TIN QUALITY CLASS: 25 MATING CYCLES PITCH: FOR 3.00MM A ENVIRONMENTAL OPERATING TEMPERATURE: -25 UP TO 105°C COMPLIANCE: LEAD FREE AND ROHS

16471E3

Contextual Info: 101/102 PHR-ST www.vishay.com Vishay BCcomponents Aluminum Capacitors, Power High Ripple Current, Screw Terminals FEATURES • Polarized aluminum electrolytic capacitors, non-solid electrolyte • Large types, cylindrical aluminum case, insulated with a blue sleeve

SMD Tantalum Capacitors

Abstract: CECC 30801-001
Contextual Info: VISHAY I N T ER T E C H N O L O GY , I N C . INTERACTIVE data book smd tantalum capacitors vishay sprague vse-db0006-1201e Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents

Contextual Info: SDB380 SCHOTTKY RECTIFIER DIODE Schottky Barrier Rectifier General Description The SDB380 surface mounted Schottky rectifier has been designed for applications requiring low forward drop and very small foot prints on PC boards. Typical applications are in disk drives, switching power

Contextual Info: VS-20CUT10, VS-20CWT10FN www.vishay.com Vishay Semiconductors High Performance Schottky Generation 5.0, 2 x 10 A FEATURES • 175 °C high performance Schottky diode • Very low forward voltage drop I-PAK TO-251AA • Extremely low reverse leakage D-PAK (TO-252AA)

Contextual Info: VS-10UT10, VS-10WT10FN www.vishay.com Vishay Semiconductors High Performance Generation 5.0 Schottky Rectifier, 10 A FEATURES • 175 °C high performance Schottky diode • Very low forward voltage drop • Extremely low reverse leakage I-PAK TO-251AA D-PAK (TO-252AA)

Contextual Info: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL ICONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: TIN QUALITY CLASS: 25 MATING CYCLES PITCH: FOR 3.00MM A ENVIRONMENTAL OPERATING TEMPERATURE: -25 UP TO 105°C COMPLIANCE: LEAD FREE AND ROHS

Contextual Info: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL ICONTACT MATERIAL: COPPER ALLOY CONTACT TYPE: STAMPED CONTACT PLATING: TIN QUALITY CLASS: 25 MATING CYCLES PITCH: FOR 3.00MM A ENVIRONMENTAL OPERATING TEMPERATURE: -25 UP TO 105°C COMPLIANCE: LEAD FREE AND ROHS

Contextual Info: SDB380 SCHOTTKY RECTIFIER DIODE Schottky Barrier Rectifier General Description The SDB380 surface mounted Schottky rectifier has been designed for applications requiring low forward drop and very small foot prints on PC boards. Typical applications are in disk drives, switching power